KR20200035894A - 연마 장치, 연마 방법 및 기계 학습 장치 - Google Patents

연마 장치, 연마 방법 및 기계 학습 장치 Download PDF

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KR20200035894A
KR20200035894A KR1020190118991A KR20190118991A KR20200035894A KR 20200035894 A KR20200035894 A KR 20200035894A KR 1020190118991 A KR1020190118991 A KR 1020190118991A KR 20190118991 A KR20190118991 A KR 20190118991A KR 20200035894 A KR20200035894 A KR 20200035894A
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South Korea
Prior art keywords
polishing
data
unit
state
learning
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Korean (ko)
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유타 스즈키
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가부시키가이샤 에바라 세이사꾸쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G06N3/0442—Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/092—Reinforcement learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Molecular Biology (AREA)
  • Artificial Intelligence (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020190118991A 2018-09-27 2019-09-26 연마 장치, 연마 방법 및 기계 학습 장치 Ceased KR20200035894A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018181352A JP2020053550A (ja) 2018-09-27 2018-09-27 研磨装置、研磨方法、及び機械学習装置
JPJP-P-2018-181352 2018-09-27

Publications (1)

Publication Number Publication Date
KR20200035894A true KR20200035894A (ko) 2020-04-06

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KR1020190118991A Ceased KR20200035894A (ko) 2018-09-27 2019-09-26 연마 장치, 연마 방법 및 기계 학습 장치

Country Status (6)

Country Link
US (1) US11027395B2 (https=)
JP (1) JP2020053550A (https=)
KR (1) KR20200035894A (https=)
CN (1) CN110948374A (https=)
SG (1) SG10201908562WA (https=)
TW (1) TWI831836B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230097048A (ko) * 2020-11-02 2023-06-30 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
KR20230169296A (ko) * 2021-04-13 2023-12-15 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 기판 처리 시스템, 및 데이터 처리 방법
US12516924B2 (en) 2021-03-31 2026-01-06 Ebara Corporation Method of producing a model for estimating film thickness of workpiece, method of estimating film thickness of workpiece using such a model, and computer readable storage medium storing program for causing computer to perform the methods

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
US10969773B2 (en) 2018-03-13 2021-04-06 Applied Materials, Inc. Machine learning systems for monitoring of semiconductor processing
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN111886686B (zh) 2018-09-26 2024-08-02 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
TW202044394A (zh) * 2019-05-22 2020-12-01 日商荏原製作所股份有限公司 基板處理系統
CN114341752B (zh) * 2019-09-02 2023-06-13 山崎马扎克公司 控制装置、机床、修正系数算出方法和存储介质
US11556117B2 (en) * 2019-10-21 2023-01-17 Applied Materials, Inc. Real-time anomaly detection and classification during semiconductor processing
CN111390706A (zh) * 2020-04-11 2020-07-10 新昌县鼎瑞科技有限公司 一种钣金加工表面打磨设备及其操作方法
WO2021231427A1 (en) * 2020-05-14 2021-11-18 Applied Materials, Inc. Technique for training neural network for use in in-situ monitoring during polishing and polishing system
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
KR102732531B1 (ko) 2020-06-24 2024-11-21 어플라이드 머티어리얼스, 인코포레이티드 연마 패드 마모 보상을 이용한 기판 층 두께의 결정
JP2022018205A (ja) * 2020-07-15 2022-01-27 東京エレクトロン株式会社 異常検知方法及び異常検知装置
US11742901B2 (en) * 2020-07-27 2023-08-29 Electronics And Telecommunications Research Institute Deep learning based beamforming method and apparatus
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
JP7453102B2 (ja) * 2020-09-09 2024-03-19 シャープ株式会社 移動時間予想装置および移動時間予想方法
JP7436335B2 (ja) * 2020-09-09 2024-02-21 シャープ株式会社 自動配車システムおよび自動配車方法
JP7535420B2 (ja) * 2020-09-16 2024-08-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び、基板処理方法
US11724355B2 (en) * 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
JP7690297B2 (ja) 2021-02-22 2025-06-10 キオクシア株式会社 基板処理の制御方法
JP7682641B2 (ja) * 2021-02-22 2025-05-26 株式会社荏原製作所 基板処理装置
TWI820399B (zh) * 2021-02-26 2023-11-01 國立臺灣科技大學 晶圓加工方法及晶圓加工系統
JP7684058B2 (ja) * 2021-03-01 2025-05-27 株式会社荏原製作所 研磨装置および研磨方法
US12504364B2 (en) 2021-03-03 2025-12-23 Applied Materials, Inc. In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring
KR102931498B1 (ko) * 2021-03-05 2026-02-27 어플라이드 머티어리얼스, 인코포레이티드 리테이닝 링들을 분류하기 위한 기계 학습
JP7710876B2 (ja) * 2021-04-19 2025-07-22 株式会社荏原製作所 研磨方法、および研磨装置
US20220347813A1 (en) * 2021-04-30 2022-11-03 Applied Materials, Inc. Monitor chemical mechanical polishing process using machine learning based processing of heat images
TWI766697B (zh) * 2021-05-24 2022-06-01 聯毅科技股份有限公司 監控裝置及方法
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US11969140B2 (en) 2021-06-22 2024-04-30 Micron Technology, Inc. Surface cleaning
JP7772797B2 (ja) * 2021-07-28 2025-11-18 ファナック株式会社 ロボットシステム
US12415248B2 (en) * 2021-08-12 2025-09-16 Samsung Electronics Co., Ltd. Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
JP7689061B2 (ja) 2021-11-11 2025-06-05 株式会社荏原製作所 研磨装置および研磨方法
US20250050461A1 (en) * 2021-12-17 2025-02-13 Ebara Corporation Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
JP7761515B2 (ja) * 2022-03-23 2025-10-28 株式会社Ｓｃｒｅｅｎホールディングス 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法および処理条件決定方法
CN114871858B (zh) * 2022-04-25 2023-06-06 中国工程物理研究院激光聚变研究中心 一种机器人全口径研磨抛光系统及方法
US12105504B2 (en) * 2022-04-27 2024-10-01 Applied Materials, Inc. Run-to-run control at a manufacturing system using machine learning
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US20240391049A1 (en) * 2023-05-25 2024-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
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WO2025263345A1 (ja) * 2024-06-19 2025-12-26 東京エレクトロン株式会社 最適厚み測定位置を決定する方法、基板処理方法及び基板処理装置
CN120480792B (zh) * 2025-05-23 2025-11-14 河北思瑞恩新材料科技有限公司 一种自动化研磨控制系统及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012135865A (ja) 2010-12-10 2012-07-19 Ebara Corp 渦電流センサ並びに研磨方法および装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594024B1 (en) * 2001-06-21 2003-07-15 Advanced Micro Devices, Inc. Monitor CMP process using scatterometry
US7001243B1 (en) * 2003-06-27 2006-02-21 Lam Research Corporation Neural network control of chemical mechanical planarization
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
KR102521159B1 (ko) * 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
SG11201902651QA (en) * 2016-10-18 2019-05-30 Ebara Corp Substrate processing control system, substrate processing control method, and program
JP6782145B2 (ja) * 2016-10-18 2020-11-11 株式会社荏原製作所 基板処理制御システム、基板処理制御方法、およびプログラム
JP6753758B2 (ja) * 2016-10-18 2020-09-09 株式会社荏原製作所 研磨装置、研磨方法およびプログラム
TWI807987B (zh) * 2016-11-30 2023-07-01 美商應用材料股份有限公司 使用神經網路的光譜監測
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
JP6499689B2 (ja) * 2017-03-08 2019-04-10 ファナック株式会社 仕上げ加工量予測装置及び機械学習装置
TWI816620B (zh) * 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
CN111936267B (zh) * 2018-03-13 2023-07-25 应用材料公司 化学机械研磨机中的耗材部件监控
TWI845444B (zh) * 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012135865A (ja) 2010-12-10 2012-07-19 Ebara Corp 渦電流センサ並びに研磨方法および装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230097048A (ko) * 2020-11-02 2023-06-30 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US12516924B2 (en) 2021-03-31 2026-01-06 Ebara Corporation Method of producing a model for estimating film thickness of workpiece, method of estimating film thickness of workpiece using such a model, and computer readable storage medium storing program for causing computer to perform the methods
KR20230169296A (ko) * 2021-04-13 2023-12-15 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 기판 처리 시스템, 및 데이터 처리 방법

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US11027395B2 (en) 2021-06-08
CN110948374A (zh) 2020-04-03
SG10201908562WA (en) 2020-04-29
TWI831836B (zh) 2024-02-11
TW202026105A (zh) 2020-07-16
US20200101579A1 (en) 2020-04-02
JP2020053550A (ja) 2020-04-02

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