CN110948374A - 研磨装置、研磨方法以及机器学习装置 - Google Patents

研磨装置、研磨方法以及机器学习装置 Download PDF

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Publication number
CN110948374A
CN110948374A CN201910916437.2A CN201910916437A CN110948374A CN 110948374 A CN110948374 A CN 110948374A CN 201910916437 A CN201910916437 A CN 201910916437A CN 110948374 A CN110948374 A CN 110948374A
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China
Prior art keywords
polishing
data
unit
state
learning
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Chinese (zh)
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铃木佑多
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Ebara Corp
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Ebara Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G06N3/0442—Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/092—Reinforcement learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Molecular Biology (AREA)
  • Artificial Intelligence (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN201910916437.2A 2018-09-27 2019-09-26 研磨装置、研磨方法以及机器学习装置 Pending CN110948374A (zh)

Applications Claiming Priority (2)

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JP2018181352A JP2020053550A (ja) 2018-09-27 2018-09-27 研磨装置、研磨方法、及び機械学習装置
JP2018-181352 2018-09-27

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US (1) US11027395B2 (https=)
JP (1) JP2020053550A (https=)
KR (1) KR20200035894A (https=)
CN (1) CN110948374A (https=)
SG (1) SG10201908562WA (https=)
TW (1) TWI831836B (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111390706A (zh) * 2020-04-11 2020-07-10 新昌县鼎瑞科技有限公司 一种钣金加工表面打磨设备及其操作方法
CN113878489A (zh) * 2020-06-17 2022-01-04 株式会社荏原制作所 研磨装置及记录介质
CN114871858A (zh) * 2022-04-25 2022-08-09 中国工程物理研究院激光聚变研究中心 一种机器人全口径研磨抛光系统及方法
CN114986383A (zh) * 2021-03-01 2022-09-02 株式会社荏原制作所 研磨装置及研磨方法
CN115035401A (zh) * 2021-03-05 2022-09-09 应用材料公司 用于对保持环进行分类的机器学习
TWI885260B (zh) * 2021-04-30 2025-06-01 美商應用材料股份有限公司 化學機械性研磨設備、電腦程式產品及操作研磨設備的方法
CN120480792A (zh) * 2025-05-23 2025-08-15 河北思瑞恩新材料科技有限公司 一种自动化研磨控制系统及方法
TWI915851B (zh) 2021-04-30 2026-02-21 美商應用材料股份有限公司 化學機械性研磨設備、電腦程式產品及操作研磨設備的方法

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
US10969773B2 (en) 2018-03-13 2021-04-06 Applied Materials, Inc. Machine learning systems for monitoring of semiconductor processing
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN111886686B (zh) 2018-09-26 2024-08-02 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
TW202044394A (zh) * 2019-05-22 2020-12-01 日商荏原製作所股份有限公司 基板處理系統
CN114341752B (zh) * 2019-09-02 2023-06-13 山崎马扎克公司 控制装置、机床、修正系数算出方法和存储介质
US11556117B2 (en) * 2019-10-21 2023-01-17 Applied Materials, Inc. Real-time anomaly detection and classification during semiconductor processing
WO2021231427A1 (en) * 2020-05-14 2021-11-18 Applied Materials, Inc. Technique for training neural network for use in in-situ monitoring during polishing and polishing system
KR102732531B1 (ko) 2020-06-24 2024-11-21 어플라이드 머티어리얼스, 인코포레이티드 연마 패드 마모 보상을 이용한 기판 층 두께의 결정
JP2022018205A (ja) * 2020-07-15 2022-01-27 東京エレクトロン株式会社 異常検知方法及び異常検知装置
US11742901B2 (en) * 2020-07-27 2023-08-29 Electronics And Telecommunications Research Institute Deep learning based beamforming method and apparatus
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
JP7453102B2 (ja) * 2020-09-09 2024-03-19 シャープ株式会社 移動時間予想装置および移動時間予想方法
JP7436335B2 (ja) * 2020-09-09 2024-02-21 シャープ株式会社 自動配車システムおよび自動配車方法
JP7535420B2 (ja) * 2020-09-16 2024-08-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び、基板処理方法
US11724355B2 (en) * 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
JP7494092B2 (ja) * 2020-11-02 2024-06-03 株式会社荏原製作所 研磨装置及び研磨方法
JP7690297B2 (ja) 2021-02-22 2025-06-10 キオクシア株式会社 基板処理の制御方法
JP7682641B2 (ja) * 2021-02-22 2025-05-26 株式会社荏原製作所 基板処理装置
TWI820399B (zh) * 2021-02-26 2023-11-01 國立臺灣科技大學 晶圓加工方法及晶圓加工系統
US12504364B2 (en) 2021-03-03 2025-12-23 Applied Materials, Inc. In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
JP7601692B2 (ja) * 2021-04-13 2024-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
JP7710876B2 (ja) * 2021-04-19 2025-07-22 株式会社荏原製作所 研磨方法、および研磨装置
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US11969140B2 (en) 2021-06-22 2024-04-30 Micron Technology, Inc. Surface cleaning
JP7772797B2 (ja) * 2021-07-28 2025-11-18 ファナック株式会社 ロボットシステム
US12415248B2 (en) * 2021-08-12 2025-09-16 Samsung Electronics Co., Ltd. Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
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US20250050461A1 (en) * 2021-12-17 2025-02-13 Ebara Corporation Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
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US12105504B2 (en) * 2022-04-27 2024-10-01 Applied Materials, Inc. Run-to-run control at a manufacturing system using machine learning
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US20240391049A1 (en) * 2023-05-25 2024-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
CN117415682B (zh) * 2023-11-29 2024-05-24 深圳市摆渡微电子有限公司 钨钢喷嘴的加工抛光方法及装置
WO2025263345A1 (ja) * 2024-06-19 2025-12-26 東京エレクトロン株式会社 最適厚み測定位置を決定する方法、基板処理方法及び基板処理装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594024B1 (en) * 2001-06-21 2003-07-15 Advanced Micro Devices, Inc. Monitor CMP process using scatterometry
US7001243B1 (en) * 2003-06-27 2006-02-21 Lam Research Corporation Neural network control of chemical mechanical planarization
CN107004060A (zh) * 2014-11-25 2017-08-01 流动马赛克公司 用于半导体制造工艺的经改进工艺控制技术
JP2018058197A (ja) * 2016-09-30 2018-04-12 株式会社荏原製作所 研磨装置、及び研磨方法
JP2018067610A (ja) * 2016-10-18 2018-04-26 株式会社荏原製作所 研磨装置、研磨方法およびプログラム
JP2018065212A (ja) * 2016-10-18 2018-04-26 株式会社荏原製作所 基板処理制御システム、基板処理制御方法、およびプログラム
CN108340281A (zh) * 2017-01-23 2018-07-31 不二越机械工业株式会社 工件研磨方法和工件研磨装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5730747B2 (ja) 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
SG11201902651QA (en) * 2016-10-18 2019-05-30 Ebara Corp Substrate processing control system, substrate processing control method, and program
TWI807987B (zh) * 2016-11-30 2023-07-01 美商應用材料股份有限公司 使用神經網路的光譜監測
JP6499689B2 (ja) * 2017-03-08 2019-04-10 ファナック株式会社 仕上げ加工量予測装置及び機械学習装置
TWI816620B (zh) * 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
CN111936267B (zh) * 2018-03-13 2023-07-25 应用材料公司 化学机械研磨机中的耗材部件监控
TWI845444B (zh) * 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594024B1 (en) * 2001-06-21 2003-07-15 Advanced Micro Devices, Inc. Monitor CMP process using scatterometry
US7001243B1 (en) * 2003-06-27 2006-02-21 Lam Research Corporation Neural network control of chemical mechanical planarization
CN107004060A (zh) * 2014-11-25 2017-08-01 流动马赛克公司 用于半导体制造工艺的经改进工艺控制技术
JP2018058197A (ja) * 2016-09-30 2018-04-12 株式会社荏原製作所 研磨装置、及び研磨方法
JP2018067610A (ja) * 2016-10-18 2018-04-26 株式会社荏原製作所 研磨装置、研磨方法およびプログラム
JP2018065212A (ja) * 2016-10-18 2018-04-26 株式会社荏原製作所 基板処理制御システム、基板処理制御方法、およびプログラム
CN108340281A (zh) * 2017-01-23 2018-07-31 不二越机械工业株式会社 工件研磨方法和工件研磨装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111390706A (zh) * 2020-04-11 2020-07-10 新昌县鼎瑞科技有限公司 一种钣金加工表面打磨设备及其操作方法
CN113878489A (zh) * 2020-06-17 2022-01-04 株式会社荏原制作所 研磨装置及记录介质
CN114986383A (zh) * 2021-03-01 2022-09-02 株式会社荏原制作所 研磨装置及研磨方法
CN115035401A (zh) * 2021-03-05 2022-09-09 应用材料公司 用于对保持环进行分类的机器学习
US12551981B2 (en) 2021-03-05 2026-02-17 Applied Materials, Inc. Machine learning for classifying retaining rings
TWI885260B (zh) * 2021-04-30 2025-06-01 美商應用材料股份有限公司 化學機械性研磨設備、電腦程式產品及操作研磨設備的方法
TWI915851B (zh) 2021-04-30 2026-02-21 美商應用材料股份有限公司 化學機械性研磨設備、電腦程式產品及操作研磨設備的方法
CN114871858A (zh) * 2022-04-25 2022-08-09 中国工程物理研究院激光聚变研究中心 一种机器人全口径研磨抛光系统及方法
CN120480792A (zh) * 2025-05-23 2025-08-15 河北思瑞恩新材料科技有限公司 一种自动化研磨控制系统及方法
CN120480792B (zh) * 2025-05-23 2025-11-14 河北思瑞恩新材料科技有限公司 一种自动化研磨控制系统及方法

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