SG11201902651QA - Substrate processing control system, substrate processing control method, and program - Google Patents

Substrate processing control system, substrate processing control method, and program

Info

Publication number
SG11201902651QA
SG11201902651QA SG11201902651QA SG11201902651QA SG11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA SG 11201902651Q A SG11201902651Q A SG 11201902651QA
Authority
SG
Singapore
Prior art keywords
polishing
recipe
local
substrate processing
processing control
Prior art date
Application number
SG11201902651QA
Inventor
Koichi Takeda
Tsuneo Torikoshi
Kunio Oishi
Katsuhide Watanabe
Hozumi Yasuda
Yu Ishii
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016204676A external-priority patent/JP6817778B2/en
Priority claimed from JP2016204678A external-priority patent/JP6753758B2/en
Priority claimed from JP2016204675A external-priority patent/JP6782145B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201902651QA publication Critical patent/SG11201902651QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL METHOD, AND PROGRAM A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing. Figure 3
SG11201902651QA 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program SG11201902651QA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016204676A JP6817778B2 (en) 2016-10-18 2016-10-18 Local polishing equipment, local polishing methods and programs
JP2016204678A JP6753758B2 (en) 2016-10-18 2016-10-18 Polishing equipment, polishing methods and programs
JP2016204675A JP6782145B2 (en) 2016-10-18 2016-10-18 Board processing control system, board processing control method, and program
PCT/JP2017/032306 WO2018074091A1 (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program

Publications (1)

Publication Number Publication Date
SG11201902651QA true SG11201902651QA (en) 2019-05-30

Family

ID=62019303

Family Applications (3)

Application Number Title Priority Date Filing Date
SG11201902651QA SG11201902651QA (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program
SG10202111784SA SG10202111784SA (en) 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program
SG10202111787PA SG10202111787PA (en) 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG10202111784SA SG10202111784SA (en) 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program
SG10202111787PA SG10202111787PA (en) 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program

Country Status (4)

Country Link
US (2) US12036634B2 (en)
SG (3) SG11201902651QA (en)
TW (2) TWI775569B (en)
WO (1) WO2018074091A1 (en)

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Also Published As

Publication number Publication date
TW202204090A (en) 2022-02-01
WO2018074091A1 (en) 2018-04-26
TWI739906B (en) 2021-09-21
SG10202111787PA (en) 2021-11-29
US20240316720A1 (en) 2024-09-26
SG10202111784SA (en) 2021-12-30
TW201832872A (en) 2018-09-16
US20190240799A1 (en) 2019-08-08
TWI775569B (en) 2022-08-21
US12036634B2 (en) 2024-07-16

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