TW200600263A - Voiceprint data monitor system of chemical mechanical polishing equipment - Google Patents

Voiceprint data monitor system of chemical mechanical polishing equipment

Info

Publication number
TW200600263A
TW200600263A TW093117760A TW93117760A TW200600263A TW 200600263 A TW200600263 A TW 200600263A TW 093117760 A TW093117760 A TW 093117760A TW 93117760 A TW93117760 A TW 93117760A TW 200600263 A TW200600263 A TW 200600263A
Authority
TW
Taiwan
Prior art keywords
voiceprint data
equipment
chemical mechanical
mechanical polishing
polishing equipment
Prior art date
Application number
TW093117760A
Other languages
Chinese (zh)
Inventor
Jui-Hai Hsieh
Jui-Lung Hsieh
Original Assignee
Trancom Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trancom Technology Inc filed Critical Trancom Technology Inc
Priority to TW093117760A priority Critical patent/TW200600263A/en
Publication of TW200600263A publication Critical patent/TW200600263A/en

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  • General Factory Administration (AREA)

Abstract

A voiceprint data monitor system applied in a chemical mechanical polishing equipment includes a voiceprint data recording device, an equipment situation collecting device, and a comparison device. The voiceprint data recording device is installed in one side of the chemical mechanical polishing equipment and used to collect the voiceprint data generated when the chemical mechanical polishing equipment carries out polishing process. The equipment situation collecting device utilizes a communication link to carry out communication connection with the chemical mechanical polishing equipment to obtain a plurality of equipment process parameters which represents the current states of chemical mechanical polishing equipment. The comparison device is built in a standard voiceprint database and connected to the voiceprint data recording device and the equipment situation collecting device to, according to the equipment process parameters collected by the equipment situation collecting device, a correspondent standard voiceprint data to compare between the standard voiceprint data and the voiceprint data collected by the voiceprint data recording device to judge if the polishing process is under normal situation. This invention can immediately get to know if the current process is abnormal by means of the comparison of voiceprint data to further provide the process engineer to carry out correct handling.
TW093117760A 2004-06-18 2004-06-18 Voiceprint data monitor system of chemical mechanical polishing equipment TW200600263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093117760A TW200600263A (en) 2004-06-18 2004-06-18 Voiceprint data monitor system of chemical mechanical polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093117760A TW200600263A (en) 2004-06-18 2004-06-18 Voiceprint data monitor system of chemical mechanical polishing equipment

Publications (1)

Publication Number Publication Date
TW200600263A true TW200600263A (en) 2006-01-01

Family

ID=57806782

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117760A TW200600263A (en) 2004-06-18 2004-06-18 Voiceprint data monitor system of chemical mechanical polishing equipment

Country Status (1)

Country Link
TW (1) TW200600263A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108188931A (en) * 2017-12-22 2018-06-22 华侨大学 The on-line control system that workpiece crushes in two-sided planet grinding/attrition process
TWI739906B (en) * 2016-10-18 2021-09-21 日商荏原製作所股份有限公司 Substrate processing control system, substrate processing control method, and program

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739906B (en) * 2016-10-18 2021-09-21 日商荏原製作所股份有限公司 Substrate processing control system, substrate processing control method, and program
CN108188931A (en) * 2017-12-22 2018-06-22 华侨大学 The on-line control system that workpiece crushes in two-sided planet grinding/attrition process

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