SG10202111784SA - System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program - Google Patents

System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program

Info

Publication number
SG10202111784SA
SG10202111784SA SG10202111784SA SG10202111784SA SG10202111784SA SG 10202111784S A SG10202111784S A SG 10202111784SA SG 10202111784S A SG10202111784S A SG 10202111784SA SG 10202111784S A SG10202111784S A SG 10202111784SA SG 10202111784S A SG10202111784S A SG 10202111784SA
Authority
SG
Singapore
Prior art keywords
scrubbing process
controlling
program
controller controlling
controller
Prior art date
Application number
SG10202111784SA
Inventor
Koichi Takeda
Tsuneo Torikoshi
Kunio Oishi
Katsuhide Watanabe
Hozumi Yasuda
Yu Ishii
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016204676A external-priority patent/JP6817778B2/en
Priority claimed from JP2016204678A external-priority patent/JP6753758B2/en
Priority claimed from JP2016204675A external-priority patent/JP6782145B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202111784SA publication Critical patent/SG10202111784SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
SG10202111784SA 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program SG10202111784SA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016204676A JP6817778B2 (en) 2016-10-18 2016-10-18 Local polishing equipment, local polishing methods and programs
JP2016204678A JP6753758B2 (en) 2016-10-18 2016-10-18 Polishing equipment, polishing methods and programs
JP2016204675A JP6782145B2 (en) 2016-10-18 2016-10-18 Board processing control system, board processing control method, and program

Publications (1)

Publication Number Publication Date
SG10202111784SA true SG10202111784SA (en) 2021-12-30

Family

ID=62019303

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10202111784SA SG10202111784SA (en) 2016-10-18 2017-09-07 System for controlling a scrubbing process system, method of a controller controlling a scrubbing process, and program
SG10202111787PA SG10202111787PA (en) 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program
SG11201902651QA SG11201902651QA (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG10202111787PA SG10202111787PA (en) 2016-10-18 2017-09-07 Local polisher, method of a local polisher and program
SG11201902651QA SG11201902651QA (en) 2016-10-18 2017-09-07 Substrate processing control system, substrate processing control method, and program

Country Status (4)

Country Link
US (1) US20190240799A1 (en)
SG (3) SG10202111784SA (en)
TW (2) TWI775569B (en)
WO (1) WO2018074091A1 (en)

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JP6830464B2 (en) * 2018-09-26 2021-02-17 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Substrate processing equipment, semiconductor device manufacturing methods and recording media.
JP2020053550A (en) * 2018-09-27 2020-04-02 株式会社荏原製作所 Polishing device, polishing method, and machine learning device
US11731232B2 (en) * 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
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WO2020161534A1 (en) * 2019-02-05 2020-08-13 3M Innovative Properties Company Paint repair process by scenario
JP7224265B2 (en) * 2019-09-18 2023-02-17 株式会社荏原製作所 machine learning device, substrate processing device, trained model, machine learning method, machine learning program
JP2021108367A (en) * 2019-12-27 2021-07-29 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus, substrate processing method, substrate processing system, and learning data generation method
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JP7390945B2 (en) 2020-03-19 2023-12-04 株式会社荏原製作所 Polishing equipment, information processing system and program
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JP7420328B2 (en) 2021-12-27 2024-01-23 株式会社レゾナック Waviness prediction device, waviness prediction method, method and program for processing objects to be polished

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Also Published As

Publication number Publication date
TW201832872A (en) 2018-09-16
TWI775569B (en) 2022-08-21
US20190240799A1 (en) 2019-08-08
TWI739906B (en) 2021-09-21
SG11201902651QA (en) 2019-05-30
SG10202111787PA (en) 2021-11-29
TW202204090A (en) 2022-02-01
WO2018074091A1 (en) 2018-04-26

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