KR20200035894A - 연마 장치, 연마 방법 및 기계 학습 장치 - Google Patents

연마 장치, 연마 방법 및 기계 학습 장치 Download PDF

Info

Publication number
KR20200035894A
KR20200035894A KR1020190118991A KR20190118991A KR20200035894A KR 20200035894 A KR20200035894 A KR 20200035894A KR 1020190118991 A KR1020190118991 A KR 1020190118991A KR 20190118991 A KR20190118991 A KR 20190118991A KR 20200035894 A KR20200035894 A KR 20200035894A
Authority
KR
South Korea
Prior art keywords
polishing
data
unit
state
learning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020190118991A
Other languages
English (en)
Korean (ko)
Inventor
유타 스즈키
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20200035894A publication Critical patent/KR20200035894A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G06N3/0442—Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/092—Reinforcement learning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computational Linguistics (AREA)
  • Mathematical Physics (AREA)
  • Biophysics (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biomedical Technology (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020190118991A 2018-09-27 2019-09-26 연마 장치, 연마 방법 및 기계 학습 장치 Ceased KR20200035894A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018181352A JP2020053550A (ja) 2018-09-27 2018-09-27 研磨装置、研磨方法、及び機械学習装置
JPJP-P-2018-181352 2018-09-27

Publications (1)

Publication Number Publication Date
KR20200035894A true KR20200035894A (ko) 2020-04-06

Family

ID=69947047

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190118991A Ceased KR20200035894A (ko) 2018-09-27 2019-09-26 연마 장치, 연마 방법 및 기계 학습 장치

Country Status (6)

Country Link
US (1) US11027395B2 (enExample)
JP (1) JP2020053550A (enExample)
KR (1) KR20200035894A (enExample)
CN (1) CN110948374A (enExample)
SG (1) SG10201908562WA (enExample)
TW (1) TWI831836B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230169296A (ko) * 2021-04-13 2023-12-15 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 기판 처리 시스템, 및 데이터 처리 방법
US12516924B2 (en) 2021-03-31 2026-01-06 Ebara Corporation Method of producing a model for estimating film thickness of workpiece, method of estimating film thickness of workpiece using such a model, and computer readable storage medium storing program for causing computer to perform the methods

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
KR102813170B1 (ko) 2018-03-13 2025-05-28 어플라이드 머티어리얼스, 인코포레이티드 반도체 처리의 모니터링을 위한 기계 학습 시스템들
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
KR102746811B1 (ko) 2018-09-26 2024-12-27 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링에 대한 가장자리 재구성에서의 기판 도핑에 대한 보상
JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
TW202044394A (zh) * 2019-05-22 2020-12-01 日商荏原製作所股份有限公司 基板處理系統
WO2021044491A1 (ja) * 2019-09-02 2021-03-11 ヤマザキマザック株式会社 制御装置、工作機械、算出方法及びプログラム
US11556117B2 (en) * 2019-10-21 2023-01-17 Applied Materials, Inc. Real-time anomaly detection and classification during semiconductor processing
CN111390706A (zh) * 2020-04-11 2020-07-10 新昌县鼎瑞科技有限公司 一种钣金加工表面打磨设备及其操作方法
KR20250073489A (ko) 2020-05-14 2025-05-27 어플라이드 머티어리얼스, 인코포레이티드 연마 동안의 인-시튜 모니터링에 사용하기 위한 신경망을 훈련시키기 위한 기법 및 연마 시스템
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
JP2022018205A (ja) * 2020-07-15 2022-01-27 東京エレクトロン株式会社 異常検知方法及び異常検知装置
US11742901B2 (en) * 2020-07-27 2023-08-29 Electronics And Telecommunications Research Institute Deep learning based beamforming method and apparatus
JP7436335B2 (ja) * 2020-09-09 2024-02-21 シャープ株式会社 自動配車システムおよび自動配車方法
JP7453102B2 (ja) * 2020-09-09 2024-03-19 シャープ株式会社 移動時間予想装置および移動時間予想方法
JP7535420B2 (ja) * 2020-09-16 2024-08-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び、基板処理方法
US11724355B2 (en) * 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
JP7494092B2 (ja) * 2020-11-02 2024-06-03 株式会社荏原製作所 研磨装置及び研磨方法
JP7690297B2 (ja) * 2021-02-22 2025-06-10 キオクシア株式会社 基板処理の制御方法
JP7682641B2 (ja) * 2021-02-22 2025-05-26 株式会社荏原製作所 基板処理装置
TWI820399B (zh) * 2021-02-26 2023-11-01 國立臺灣科技大學 晶圓加工方法及晶圓加工系統
KR102820308B1 (ko) * 2021-03-03 2025-06-13 어플라이드 머티어리얼스, 인코포레이티드 분광 모니터링을 위한 기계 학습 시스템을 위한 훈련 스펙트럼들을 표지하기 위한 인-시튜 모니터링
JP7674505B2 (ja) * 2021-03-05 2025-05-09 アプライド マテリアルズ インコーポレイテッド 保持リングを分類するための機械学習
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
JP7710876B2 (ja) * 2021-04-19 2025-07-22 株式会社荏原製作所 研磨方法、および研磨装置
US20220347813A1 (en) * 2021-04-30 2022-11-03 Applied Materials, Inc. Monitor chemical mechanical polishing process using machine learning based processing of heat images
TWI766697B (zh) * 2021-05-24 2022-06-01 聯毅科技股份有限公司 監控裝置及方法
JP7685882B2 (ja) * 2021-06-15 2025-05-30 株式会社荏原製作所 基板処理装置及び情報処理システム
US11969140B2 (en) 2021-06-22 2024-04-30 Micron Technology, Inc. Surface cleaning
US20240278428A1 (en) * 2021-07-28 2024-08-22 Fanuc Corporation Robot system
KR20230024626A (ko) * 2021-08-12 2023-02-21 삼성전자주식회사 기판 연마 장치, 이를 이용한 기판 연마 방법 및 이를 포함하는 반도체 소자 제조 방법
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
KR20240125594A (ko) * 2021-12-17 2024-08-19 가부시키가이샤 에바라 세이사꾸쇼 정보 처리 장치, 추론 장치, 기계 학습 장치, 정보 처리 방법, 추론 방법, 및 기계 학습 방법
JP7761515B2 (ja) * 2022-03-23 2025-10-28 株式会社Ｓｃｒｅｅｎホールディングス 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法および処理条件決定方法
CN114871858B (zh) * 2022-04-25 2023-06-06 中国工程物理研究院激光聚变研究中心 一种机器人全口径研磨抛光系统及方法
JP7689937B2 (ja) * 2022-05-27 2025-06-09 株式会社荏原製作所 研磨パッド寿命推定方法および研磨装置
JP2024015933A (ja) * 2022-07-25 2024-02-06 株式会社荏原製作所 情報処理装置、機械学習装置、情報処理方法、及び、機械学習方法
JP2024048886A (ja) 2022-09-28 2024-04-09 株式会社荏原製作所 ワークピースの膜厚測定の異常を検出する方法
JP2024090296A (ja) * 2022-12-22 2024-07-04 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP2024137220A (ja) * 2023-03-24 2024-10-07 株式会社Ｓｃｒｅｅｎホールディングス 予測アルゴリズム生成装置、情報処理装置、予測アルゴリズム生成方法および処理条件決定方法
US20240391049A1 (en) * 2023-05-25 2024-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
CN117415682B (zh) * 2023-11-29 2024-05-24 深圳市摆渡微电子有限公司 钨钢喷嘴的加工抛光方法及装置
CN120480792B (zh) * 2025-05-23 2025-11-14 河北思瑞恩新材料科技有限公司 一种自动化研磨控制系统及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012135865A (ja) 2010-12-10 2012-07-19 Ebara Corp 渦電流センサ並びに研磨方法および装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594024B1 (en) * 2001-06-21 2003-07-15 Advanced Micro Devices, Inc. Monitor CMP process using scatterometry
US7001243B1 (en) * 2003-06-27 2006-02-21 Lam Research Corporation Neural network control of chemical mechanical planarization
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
JP6751871B2 (ja) * 2014-11-25 2020-09-09 ピーディーエフ ソリューションズ，インコーポレイテッド 半導体製造プロセスのための改善されたプロセス制御技術
JP6357260B2 (ja) 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
SG11201902651QA (en) * 2016-10-18 2019-05-30 Ebara Corp Substrate processing control system, substrate processing control method, and program
JP6782145B2 (ja) * 2016-10-18 2020-11-11 株式会社荏原製作所 基板処理制御システム、基板処理制御方法、およびプログラム
JP6753758B2 (ja) * 2016-10-18 2020-09-09 株式会社荏原製作所 研磨装置、研磨方法およびプログラム
TWI755448B (zh) * 2016-11-30 2022-02-21 美商應用材料股份有限公司 使用神經網路的光譜監測
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
JP6499689B2 (ja) * 2017-03-08 2019-04-10 ファナック株式会社 仕上げ加工量予測装置及び機械学習装置
TWI816620B (zh) * 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
EP3765238B1 (en) * 2018-03-13 2025-08-13 Applied Materials, Inc. Consumable part monitoring in chemical mechanical polisher
TWI825075B (zh) * 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012135865A (ja) 2010-12-10 2012-07-19 Ebara Corp 渦電流センサ並びに研磨方法および装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12516924B2 (en) 2021-03-31 2026-01-06 Ebara Corporation Method of producing a model for estimating film thickness of workpiece, method of estimating film thickness of workpiece using such a model, and computer readable storage medium storing program for causing computer to perform the methods
KR20230169296A (ko) * 2021-04-13 2023-12-15 가부시키가이샤 스크린 홀딩스 기판 처리 장치, 기판 처리 시스템, 및 데이터 처리 방법

Also Published As

Publication number Publication date
JP2020053550A (ja) 2020-04-02
TW202026105A (zh) 2020-07-16
TWI831836B (zh) 2024-02-11
US20200101579A1 (en) 2020-04-02
US11027395B2 (en) 2021-06-08
SG10201908562WA (en) 2020-04-29
CN110948374A (zh) 2020-04-03

Similar Documents

Publication Publication Date Title
KR20200035894A (ko) 연마 장치, 연마 방법 및 기계 학습 장치
JP7182653B2 (ja) 研磨装置、及び研磨方法
KR102622803B1 (ko) 연마 장치, 및 연마 방법
WO2021029264A1 (ja) 終点検知装置、終点検知方法
US20100048100A1 (en) Method and system for endpoint detection
KR20190078519A (ko) 자성 소자 및 그것을 사용한 와전류식 센서
JP7403213B2 (ja) 研磨装置、及び研磨方法
CN109719612A (zh) 研磨装置、研磨系统、基板处理装置以及研磨方法
JP2019117185A (ja) 磁性素子、及びそれを用いた渦電流式センサ

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20190926

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20220523

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20190926

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20240125

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20240327

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20240125

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I