JP2020053550A - 研磨装置、研磨方法、及び機械学習装置 - Google Patents

研磨装置、研磨方法、及び機械学習装置 Download PDF

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Publication number
JP2020053550A
JP2020053550A JP2018181352A JP2018181352A JP2020053550A JP 2020053550 A JP2020053550 A JP 2020053550A JP 2018181352 A JP2018181352 A JP 2018181352A JP 2018181352 A JP2018181352 A JP 2018181352A JP 2020053550 A JP2020053550 A JP 2020053550A
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Prior art keywords
polishing
data
unit
state
learning
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Japanese (ja)
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JP2020053550A5 (enExample
Inventor
佑多 鈴木
Yuta Suzuki
佑多 鈴木
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Ebara Corp
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Ebara Corp
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Priority to JP2018181352A priority Critical patent/JP2020053550A/ja
Priority to SG10201908562WA priority patent/SG10201908562WA/en
Priority to US16/579,296 priority patent/US11027395B2/en
Priority to TW108134237A priority patent/TWI831836B/zh
Priority to KR1020190118991A priority patent/KR20200035894A/ko
Priority to CN201910916437.2A priority patent/CN110948374A/zh
Publication of JP2020053550A publication Critical patent/JP2020053550A/ja
Publication of JP2020053550A5 publication Critical patent/JP2020053550A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/044—Recurrent networks, e.g. Hopfield networks
    • G06N3/0442—Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/092—Reinforcement learning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computational Linguistics (AREA)
  • Mathematical Physics (AREA)
  • Biophysics (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biomedical Technology (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2018181352A 2018-09-27 2018-09-27 研磨装置、研磨方法、及び機械学習装置 Pending JP2020053550A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018181352A JP2020053550A (ja) 2018-09-27 2018-09-27 研磨装置、研磨方法、及び機械学習装置
SG10201908562WA SG10201908562WA (en) 2018-09-27 2019-09-16 Polishing apparatus, polishing method, and machine learning apparatus
US16/579,296 US11027395B2 (en) 2018-09-27 2019-09-23 Polishing apparatus, polishing method, and machine learning apparatus
TW108134237A TWI831836B (zh) 2018-09-27 2019-09-23 研磨裝置、研磨方法及機器學習裝置
KR1020190118991A KR20200035894A (ko) 2018-09-27 2019-09-26 연마 장치, 연마 방법 및 기계 학습 장치
CN201910916437.2A CN110948374A (zh) 2018-09-27 2019-09-26 研磨装置、研磨方法以及机器学习装置

Applications Claiming Priority (1)

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JP2018181352A JP2020053550A (ja) 2018-09-27 2018-09-27 研磨装置、研磨方法、及び機械学習装置

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JP2020053550A true JP2020053550A (ja) 2020-04-02
JP2020053550A5 JP2020053550A5 (enExample) 2021-11-04

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US (1) US11027395B2 (enExample)
JP (1) JP2020053550A (enExample)
KR (1) KR20200035894A (enExample)
CN (1) CN110948374A (enExample)
SG (1) SG10201908562WA (enExample)
TW (1) TWI831836B (enExample)

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JPWO2020235581A1 (enExample) * 2019-05-22 2020-11-26
WO2021231427A1 (en) * 2020-05-14 2021-11-18 Applied Materials, Inc. Technique for training neural network for use in in-situ monitoring during polishing and polishing system
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
JP2022045456A (ja) * 2020-09-09 2022-03-22 シャープ株式会社 移動時間予想装置および移動時間予想方法
JP2022045455A (ja) * 2020-09-09 2022-03-22 シャープ株式会社 自動配車システムおよび自動配車方法
JP2022049201A (ja) * 2020-09-16 2022-03-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、選択装置、選択方法、学習モデル生成方法、及び、学習モデル
WO2022091532A1 (ja) * 2020-11-02 2022-05-05 株式会社荏原製作所 研磨装置及び研磨方法
JP2022127883A (ja) * 2021-02-22 2022-09-01 キオクシア株式会社 基板処理の制御方法
JP2022127882A (ja) * 2021-02-22 2022-09-01 株式会社荏原製作所 基板処理装置
JP2022156879A (ja) * 2021-03-31 2022-10-14 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
WO2022220126A1 (ja) * 2021-04-13 2022-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
WO2022224508A1 (ja) * 2021-04-19 2022-10-27 株式会社荏原製作所 研磨方法、および研磨装置
US20220347813A1 (en) * 2021-04-30 2022-11-03 Applied Materials, Inc. Monitor chemical mechanical polishing process using machine learning based processing of heat images
WO2022264753A1 (ja) * 2021-06-15 2022-12-22 株式会社荏原製作所 基板処理装置及び情報処理システム
WO2023112830A1 (ja) * 2021-12-17 2023-06-22 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
WO2023181525A1 (ja) * 2022-03-23 2023-09-28 株式会社Ｓｃｒｅｅｎホールディングス 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法および処理条件決定方法
JP2023174205A (ja) * 2022-05-27 2023-12-07 株式会社荏原製作所 研磨パッド寿命推定方法および研磨装置
CN117415682A (zh) * 2023-11-29 2024-01-19 深圳市摆渡微电子有限公司 钨钢喷嘴的加工抛光方法及装置
WO2024024391A1 (ja) * 2022-07-25 2024-02-01 株式会社荏原製作所 情報処理装置、機械学習装置、情報処理方法、及び、機械学習方法
KR20240044349A (ko) 2022-09-28 2024-04-04 가부시키가이샤 에바라 세이사꾸쇼 워크피스의 막 두께 측정의 이상을 검출하는 방법, 광학식 막 두께 측정 장치, 및 프로그램을 기록한 기록 매체
WO2024135150A1 (ja) * 2022-12-22 2024-06-27 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
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