KR20200006197A - 접착시트 및 반도체 장치의 제조 방법 - Google Patents

접착시트 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR20200006197A
KR20200006197A KR1020207000826A KR20207000826A KR20200006197A KR 20200006197 A KR20200006197 A KR 20200006197A KR 1020207000826 A KR1020207000826 A KR 1020207000826A KR 20207000826 A KR20207000826 A KR 20207000826A KR 20200006197 A KR20200006197 A KR 20200006197A
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South Korea
Prior art keywords
adhesive
mass
degreec
adhesive sheet
semiconductor device
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KR1020207000826A
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Korean (ko)
Inventor
메구미 코다마
타카히로 토쿠야스
테츠로우 이와쿠라
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히타치가세이가부시끼가이샤
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Publication of KR20200006197A publication Critical patent/KR20200006197A/ko
Ceased legal-status Critical Current

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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
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    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • H01L21/185—
    • H01L24/29—
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
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    • C09J113/00—Adhesives based on rubbers containing carboxyl groups
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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    • C09J2413/00—Presence of rubbers containing carboxyl groups
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    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01304—Manufacture or treatment of die-attach connectors using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
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    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
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    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
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    • H10W72/351—Materials of die-attach connectors
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Sealing Material Composition (AREA)
KR1020207000826A 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법 Ceased KR20200006197A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2012-052156 2012-03-08
JP2012052156 2012-03-08
JPJP-P-2012-288113 2012-12-28
JP2012288113 2012-12-28
PCT/JP2013/056002 WO2013133275A1 (ja) 2012-03-08 2013-03-05 接着シート及び半導体装置の製造方法

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KR1020197005030A Division KR102067945B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법

Publications (1)

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KR20200006197A true KR20200006197A (ko) 2020-01-17

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KR1020207000826A Ceased KR20200006197A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020147024893A Ceased KR20140126736A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020177025281A Active KR101953052B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020197005030A Active KR102067945B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020167032236A Ceased KR20160139043A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법

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KR1020147024893A Ceased KR20140126736A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020177025281A Active KR101953052B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020197005030A Active KR102067945B1 (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법
KR1020167032236A Ceased KR20160139043A (ko) 2012-03-08 2013-03-05 접착시트 및 반도체 장치의 제조 방법

Country Status (6)

Country Link
US (1) US9212298B2 (https=)
JP (3) JPWO2013133275A1 (https=)
KR (5) KR20200006197A (https=)
CN (2) CN104169383B (https=)
TW (1) TWI485225B (https=)
WO (1) WO2013133275A1 (https=)

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Publication number Priority date Publication date Assignee Title
KR102344987B1 (ko) * 2013-12-24 2021-12-30 닛토덴코 가부시키가이샤 다이싱·다이 본드 필름, 반도체 장치의 제조 방법 및 반도체 장치
JP6312422B2 (ja) * 2013-12-24 2018-04-18 日東電工株式会社 ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
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