CN104169383B - 粘接片材及半导体装置的制造方法 - Google Patents

粘接片材及半导体装置的制造方法 Download PDF

Info

Publication number
CN104169383B
CN104169383B CN201380012784.3A CN201380012784A CN104169383B CN 104169383 B CN104169383 B CN 104169383B CN 201380012784 A CN201380012784 A CN 201380012784A CN 104169383 B CN104169383 B CN 104169383B
Authority
CN
China
Prior art keywords
adhesive layer
adhesive
mass
softening point
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380012784.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN104169383A (zh
Inventor
小玉惠
德安孝宽
岩仓哲郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201610329897.1A priority Critical patent/CN106024654B/zh
Publication of CN104169383A publication Critical patent/CN104169383A/zh
Application granted granted Critical
Publication of CN104169383B publication Critical patent/CN104169383B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J113/00—Adhesives based on rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2413/00—Presence of rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01304—Manufacture or treatment of die-attach connectors using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Sealing Material Composition (AREA)
CN201380012784.3A 2012-03-08 2013-03-05 粘接片材及半导体装置的制造方法 Active CN104169383B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610329897.1A CN106024654B (zh) 2012-03-08 2013-03-05 半导体装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012052156 2012-03-08
JP2012-052156 2012-03-08
JP2012288113 2012-12-28
JP2012-288113 2012-12-28
PCT/JP2013/056002 WO2013133275A1 (ja) 2012-03-08 2013-03-05 接着シート及び半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201610329897.1A Division CN106024654B (zh) 2012-03-08 2013-03-05 半导体装置

Publications (2)

Publication Number Publication Date
CN104169383A CN104169383A (zh) 2014-11-26
CN104169383B true CN104169383B (zh) 2016-11-09

Family

ID=49116750

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201380012784.3A Active CN104169383B (zh) 2012-03-08 2013-03-05 粘接片材及半导体装置的制造方法
CN201610329897.1A Active CN106024654B (zh) 2012-03-08 2013-03-05 半导体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201610329897.1A Active CN106024654B (zh) 2012-03-08 2013-03-05 半导体装置

Country Status (6)

Country Link
US (1) US9212298B2 (https=)
JP (3) JPWO2013133275A1 (https=)
KR (5) KR20200006197A (https=)
CN (2) CN104169383B (https=)
TW (1) TWI485225B (https=)
WO (1) WO2013133275A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102344987B1 (ko) * 2013-12-24 2021-12-30 닛토덴코 가부시키가이샤 다이싱·다이 본드 필름, 반도체 장치의 제조 방법 및 반도체 장치
JP6312422B2 (ja) * 2013-12-24 2018-04-18 日東電工株式会社 ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
KR102310226B1 (ko) * 2013-12-24 2021-10-08 닛토덴코 가부시키가이샤 접착 필름, 다이싱·다이 본드 필름, 반도체 장치의 제조 방법 및 반도체 장치
JP2015145489A (ja) * 2014-01-06 2015-08-13 Dic株式会社 熱接着シート及び物品
US10865329B2 (en) * 2015-04-29 2020-12-15 Lg Chem, Ltd. Adhesive film for semiconductor
JP6536177B2 (ja) * 2015-05-27 2019-07-03 日立化成株式会社 半導体装置
JP6768188B2 (ja) * 2016-01-06 2020-10-14 日立化成株式会社 接着フィルム用接着剤組成物及びその製造方法
SG11201909029YA (en) * 2017-04-28 2019-10-30 Hitachi Chemical Co Ltd Sealing film, sealed structure, and method for producing sealed structure
CN109266270B (zh) * 2017-07-17 2021-08-03 中国石油天然气股份有限公司 一种粘合剂及制备方法和应用
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
WO2019150449A1 (ja) * 2018-01-30 2019-08-08 日立化成株式会社 半導体装置の製造方法、及びフィルム状接着剤
JP6977588B2 (ja) * 2018-01-30 2021-12-08 昭和電工マテリアルズ株式会社 半導体装置の製造方法及び接着フィルム
KR102491831B1 (ko) * 2018-01-30 2023-01-27 쇼와덴코머티리얼즈가부시끼가이샤 필름형 접착제 및 그 제조 방법과, 반도체 장치 및 그 제조 방법
SG11202011196SA (en) * 2018-05-15 2020-12-30 Showa Denko Materials Co Ltd Semiconductor device, thermosetting resin composition used for production thereof, and dicing die bonding integrated tape
CN109654388A (zh) * 2018-12-06 2019-04-19 安徽皇广实业有限公司 一种集成高导热基材led灯具
WO2020217394A1 (ja) 2019-04-25 2020-10-29 日立化成株式会社 ドルメン構造を有する半導体装置及びその製造方法、並びに、支持片形成用積層フィルム及びその製造方法
WO2020217404A1 (ja) * 2019-04-25 2020-10-29 日立化成株式会社 ドルメン構造を有する半導体装置及びその製造方法
WO2022149277A1 (ja) 2021-01-08 2022-07-14 昭和電工マテリアルズ株式会社 接着剤組成物、フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
WO2022149582A1 (ja) 2021-01-08 2022-07-14 昭和電工マテリアルズ株式会社 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
JP7655011B2 (ja) * 2021-03-08 2025-04-02 三菱ケミカル株式会社 粘接着剤組成物、及びそれを用いてなる粘接着剤、粘接着シート、ならびに積層体
JPWO2023152837A1 (https=) 2022-02-09 2023-08-17
US20250293077A1 (en) 2023-03-15 2025-09-18 Resonac Corporation Film adhesive, dicing and die-bonding integral film, semiconductor device, and manufacturing method for same
WO2024189855A1 (ja) 2023-03-15 2024-09-19 株式会社レゾナック フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400993A (zh) * 2000-02-15 2003-03-05 日立化成工业株式会社 粘接剂组合物及其制造方法、使用它的粘接薄膜、半导体装载用基板及半导体装置
JP2008274259A (ja) * 2007-04-02 2008-11-13 Hitachi Chem Co Ltd 接着シート

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366933A (en) * 1993-10-13 1994-11-22 Intel Corporation Method for constructing a dual sided, wire bonded integrated circuit chip package
US6245841B1 (en) * 1998-03-23 2001-06-12 General Electric Company Cyanate ester based thermoset compositions
JP4505769B2 (ja) 2000-03-31 2010-07-21 日立化成工業株式会社 接着フィルム、接着フィルムを備えた半導体搭載用配線基板、半導体装置及びその製造方法
TWI245791B (en) * 2000-03-31 2005-12-21 Hitachi Chemical Co Ltd Adhesive films, and semiconductor devices using the same
EP1176172B1 (en) * 2000-07-26 2004-12-15 Matsushita Electric Works, Ltd. Epoxy resin composition, prepreg and metal-clad laminate
JP2002072009A (ja) 2000-08-25 2002-03-12 Shinko Electric Ind Co Ltd 光合分波器
JP3913481B2 (ja) 2001-01-24 2007-05-09 シャープ株式会社 半導体装置および半導体装置の製造方法
JP5236134B2 (ja) 2001-01-26 2013-07-17 日立化成株式会社 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等
JP3912223B2 (ja) 2002-08-09 2007-05-09 富士通株式会社 半導体装置及びその製造方法
JP2005327789A (ja) * 2004-05-12 2005-11-24 Sharp Corp ダイシング・ダイボンド兼用粘接着シートおよびこれを用いた半導体装置の製造方法
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
JP2007270125A (ja) * 2006-03-08 2007-10-18 Hitachi Chem Co Ltd 接着シート、一体型シート、半導体装置、及び半導体装置の製造方法
JP5157229B2 (ja) * 2006-04-11 2013-03-06 日立化成株式会社 接着シート
JP2007311395A (ja) * 2006-05-16 2007-11-29 Toppan Printing Co Ltd 半導体装置及び半導体装置の製造方法
JP2008074928A (ja) * 2006-09-20 2008-04-03 Hitachi Chem Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
WO2008114696A1 (ja) * 2007-03-16 2008-09-25 Hitachi Chemical Company, Ltd. 光導波路用接着剤組成物、これを用いた光導波路用接着フィルムおよび光導波路用粘接着シート、ならびにこれらを用いた光学装置
KR100959746B1 (ko) * 2007-10-23 2010-05-25 제일모직주식회사 페녹시수지 및 에스테르계 열 가소성 수지를 이용한 반도체조립용 접착 필름 조성물 및 접착 필름
JP5524465B2 (ja) * 2007-10-24 2014-06-18 日立化成株式会社 接着シート及びこれを用いた半導体装置およびその製造方法
US7723852B1 (en) * 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
KR101284978B1 (ko) * 2008-04-21 2013-07-10 주식회사 엘지화학 접착제 조성물, 상기를 포함하는 접착 필름, 다이싱 다이본딩 필름, 반도체 웨이퍼 및 반도체 장치
JP5428423B2 (ja) * 2008-04-21 2014-02-26 日立化成株式会社 半導体装置及びフィルム状接着剤
JP5805925B2 (ja) * 2008-10-02 2015-11-10 日立化成株式会社 ダイボンディングフィルム及びこれを用いた半導体装置
JP5549182B2 (ja) * 2008-10-28 2014-07-16 日立化成株式会社 接着シート及びこれを用いた半導体装置の製造方法
JP2010118554A (ja) * 2008-11-13 2010-05-27 Nec Electronics Corp 半導体装置およびその製造方法
JP2011018806A (ja) * 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd 半導体用フィルムおよび半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400993A (zh) * 2000-02-15 2003-03-05 日立化成工业株式会社 粘接剂组合物及其制造方法、使用它的粘接薄膜、半导体装载用基板及半导体装置
JP2008274259A (ja) * 2007-04-02 2008-11-13 Hitachi Chem Co Ltd 接着シート

Also Published As

Publication number Publication date
US20150050780A1 (en) 2015-02-19
JP2016021585A (ja) 2016-02-04
JPWO2013133275A1 (ja) 2015-07-30
KR20200006197A (ko) 2020-01-17
CN104169383A (zh) 2014-11-26
KR20140126736A (ko) 2014-10-31
KR20190020191A (ko) 2019-02-27
CN106024654B (zh) 2019-07-02
WO2013133275A1 (ja) 2013-09-12
KR20170105640A (ko) 2017-09-19
KR102067945B1 (ko) 2020-01-17
TWI485225B (zh) 2015-05-21
US9212298B2 (en) 2015-12-15
JP6414296B2 (ja) 2018-10-31
KR20160139043A (ko) 2016-12-06
TW201346003A (zh) 2013-11-16
CN106024654A (zh) 2016-10-12
KR101953052B1 (ko) 2019-02-27
JP2017204656A (ja) 2017-11-16

Similar Documents

Publication Publication Date Title
CN104169383B (zh) 粘接片材及半导体装置的制造方法
JP5428423B2 (ja) 半導体装置及びフィルム状接着剤
JP6133542B2 (ja) フィルム状接着剤、接着シート及び半導体装置
JP2013127014A (ja) 接着シート
CN101971312A (zh) 用于形成半导体元件粘接膜的树脂清漆、半导体元件粘接膜和半导体装置
JP6977588B2 (ja) 半導体装置の製造方法及び接着フィルム
JPWO2008105169A1 (ja) 半導体用接着フィルムおよびそれを用いた半導体装置
TWI664684B (zh) 接著膜、切晶黏晶膜、半導體裝置之製造方法及半導體裝置
TWI431093B (zh) Then the sheet
JP2012153851A (ja) 半導体装置及びフィルム状接着剤
CN113195668B (zh) 临时固定用树脂组合物、临时固定用树脂膜及临时固定用片、以及半导体装置的制造方法
JPWO2020136903A1 (ja) 半導体装置の製造方法、フィルム状接着剤及びダイシング・ダイボンディング一体型フィルム
CN110678966B (zh) 半导体加工用胶带
JP5805925B2 (ja) ダイボンディングフィルム及びこれを用いた半導体装置
JP2006199756A (ja) 接合フィルム、電子部品装置の製造方法及び電子部品装置
WO2019171544A1 (ja) 半導体装置の製造方法及びフィルム状接着剤
TW202126774A (zh) 暫時固定用樹脂組成物、基板搬送用支撐帶及電子機器裝置的製造方法
JP5846232B2 (ja) ウエハ加工用粘着シート一体型接着シート、および電子装置
TW202330830A (zh) 熱固性接著劑組成物、積層膜、連接體及其製造方法
JP2016191060A (ja) フィルム状接着剤、接着シート及び半導体装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Tokyo

Patentee after: Lishennoco Co.,Ltd.

Address before: Tokyo

Patentee before: HITACHI CHEMICAL Co.,Ltd.

CP01 Change in the name or title of a patent holder