JP2016021585A - 接着シート及び半導体装置の製造方法 - Google Patents
接着シート及び半導体装置の製造方法 Download PDFInfo
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- JP2016021585A JP2016021585A JP2015170820A JP2015170820A JP2016021585A JP 2016021585 A JP2016021585 A JP 2016021585A JP 2015170820 A JP2015170820 A JP 2015170820A JP 2015170820 A JP2015170820 A JP 2015170820A JP 2016021585 A JP2016021585 A JP 2016021585A
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Abstract
【解決手段】本発明の接着シートは、(A)高分子量成分と、(B1)軟化点が50℃未満の熱硬化性成分と、(B2)軟化点が50℃以上100℃以下の熱硬化性成分と、(C)軟化点が100℃以下のフェノール樹脂と、を含む樹脂組成物からなり、当該樹脂組成物100質量%を基準として、前記(A)高分子量成分を11〜22質量%、前記(B1)軟化点が50℃未満の熱硬化性成分を10〜20質量%、前記(B2)軟化点が50℃以上100℃以下の熱硬化性成分を10〜20質量%、前記(C)軟化点が100℃以下のフェノール樹脂を15〜30質量%含有する。
【選択図】図6
Description
図1は、第1実施形態に係る接着シートの概略断面図である。図1に示すように、接着シート1は、基材2上に、接着剤層4が積層された構成を有している。後述するように、接着シート1は、半導体装置を製造する際に、ラミネート工程において、半導体ウェハの回路面の裏面に貼り付けられることを想定している。
(A)高分子量成分(以下単に「(A)成分」とします。)としては、架橋性官能基を有するものであり、例えば架橋性官能基を有するポリイミド樹脂、(メタ)アクリル共重合体、ウレタン樹脂ポリフェニレンエーテル樹脂、ポリエーテルイミド樹脂、フェノキシ樹脂、変性ポリフェニレンエーテル樹脂等が挙げられ、これらのなかでも、架橋性官能基を有する(メタ)アクリル共重合体が好ましい。これら(A)成分は、1種を単独で用いても、2種以上を組み合わせて用いてもよい。前記架橋性官能基はポリマー鎖中に有していても、ポリマー鎖末端に有していてもよい。架橋性官能基の具体例としては、エポキシ基、アルコール性水酸基、フェノール性水酸基、カルボキシル基等が挙げられ、これらのなかでも、エポキシ基が好ましく、グリシジシル(メタ)アクリレートなどのエポキシ基含有モノマーを用いることによってポリマー鎖に導入することができる。
(B)熱硬化性成分は、150℃以上にて反応し高分子量化するエポキシ樹脂を好ましく用いることができ、(B1)軟化点が50℃未満の熱硬化性成分(以下単に「(B1)成分」とします。)と、(B2)軟化点が50℃以上100℃以下の熱硬化性成分(以下単に「(B2)成分」とします。)とを混合して用いる。
(C)軟化点が100℃以下のフェノール樹脂(以下単に「(C)成分」とします。)は、硬化剤として機能する。軟化点を100℃以下とすることにより、接着剤組成物の溶融粘度を低下させて、基板又は半導体チップの凹凸部やワイヤへの埋込性を向上させることができる。また、軟化点は50〜100℃であることが好ましい。使用するフェノール樹脂の軟化点が50℃よりも低くなると、室温における作業性が低下する傾向がある。
(D)フィラーとしては特に制限はないが、無機フィラーが好ましく、例えば、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、ケイ酸カルシウム、ケイ酸マグネシウム、酸化カルシウム、酸化マグネシウム、アルミナ、窒化アルミニウム、ほう酸アルミウイスカ、窒化ホウ素、結晶性シリカ及び非晶性シリカを使用できる。これらは1種を単独又は2種類以上を混合して用いてもよいし、特に問題がなければ添加しなくても良い。(D)フィラーの含有量は、樹脂組成物100質量%を基準として、0〜0.15質量%であることが好ましい。
(E)硬化促進剤としては、特に制限はなく、例えば、1,8−ジアザビシクロ[5.4.0]ウンデセン−7、1,5−ジアザビシクロ[4.3.0]ノネン−5、5,6−ジブチルアミノ−1,8−ジアザビシクロ[5.4.0]ウンデセン−7等のシクロアミジン化合物及びこれらの化合物に無水マレイン酸、1,4−ベンゾキノン、2,5−トルキノン、1,4−ナフトキノン、2,3−ジメチルベンゾキノン、2,6−ジメチルベンゾキノン、2,3−ジメトキシ−5−メチル−1,4−ベンゾキノン、2,3−ジメトキシ−1,4−ベンゾキノン、フェニル−1,4−ベンゾキノン等のキノン化合物、ジアゾフェニルメタン、フェノール樹脂等のπ結合をもつ化合物を付加してなる分子内分極を有する化合物、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス(ジメチルアミノメ9チル)フェノール等の三級アミン類及びこれらの誘導体、1−シアノエチル−2−フェニルイミダゾール、2−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール、2−ヘプタデシルイミダゾール等のイミダゾール類及びこれらの誘導体、トリブチルホスフィン、メチルジフェニルホスフィン、トリフェニルホスフィン、トリス(4−メチルフェニル)ホスフィン、ジフェニルホスフィン、フェニルホスフィン等の有機ホスフィン類及びこれらのホスフィン類に無水マレイン酸、上記キノン化合物、ジアゾフェニルメタン、フェノール樹脂等のπ結合をもつ化合物を付加してなる分子内分極を有するリン化合物、テトラフェニルホスホニウムテトラフェニルボレート、テトラフェニルホスホニウムエチルトリフェニルボレート、テトラブチルホスホニウムテトラブチルボレート等のテトラ置換ホスホニウム・テトラ置換ボレート、2−エチル−4−メチルイミダゾール・テトラフェニルボレート、N−メチルモルホリン・テトラフェニルボレート等のテトラフェニルボロン塩及びこれらの誘導体が挙げられる。これらの硬化促進剤は、1種を単独で又は2種以上を組み合わせて用いてもよい。これらのなか中でも、硬化促進剤としては、イミダゾール類を含むことが好ましい。(E)硬化促進剤の含有量は、樹脂組成物100質量%を基準として、28〜38質量%であることが好ましい。
(F)カップリング剤を含有させることで、樹脂組成物中の異種材料間の界面結合を高めることができる。カップリング剤としては、シラン系カップリング剤、チタネート系カップリング剤、アルミニウム系カップリング剤が挙げられ、これらのなかでもシラン系カップリング剤が好ましい。
次に、上述の接着シート1を用いて半導体装置を製造する方法について説明する。図2(a)〜図2(c)、図3(a)〜図3(c)及び図4(a)〜図4(c)は、本実施形態に係る半導体装置の製造方法における一工程を示す工程断面図である。
次に、上述した半導体装置の製造方法により製造される半導体装置100について説明する。図5は、本実施形態に係る半導体装置の概略断面図である。図5に示される半導体装置100は、半導体素子搭載用の支持部材14と、支持部材14上に設けられた複数(例えば2つ)の半導体素子Waとを備える。支持部材14と半導体素子Waとは接着剤層40を介して接着されている。また、半導体素子Wa,Wa同士も接着剤層40を介して接着されている。支持部材14は、回路パターン74及び端子76が形成された基板70からなる。この回路パターン74と半導体素子Waとが、金ワイヤ等のワイヤ78によってそれぞれ電気的に接続されている。そして、例えば樹脂製の封止材80が支持部材14の表面14a上に設けられることにより、半導体素子Wa、接着剤層4、回路パターン74及びワイヤ78が封止される。なお、封止材80が、支持部材14の表面14aとは反対側の面にも設けられているとしてもよい。
実施例1,2及び比較例1〜3において、表1に示される成分を用いて、以下の手順により接着剤組成物からなるワニスを調整した。まず、(B1)成分及び(B2)成分、(D)フィラーを配合した後に、シクロヘキサノンを加えて撹拌し、続いて(A)成分、(E)硬化促進剤及び(F)カップリング剤を加えて各成分が均一になるまで撹拌することによって、接着剤組成物のワニスを得た。
(A)アクリルゴム:ナガセケムテックス株式会社製商品名、商品名「HTR−860P−3」、重量平均分子量80万、ガラス転移点:−13℃
クレゾールノボラック型エポキシ樹脂:東都化成株式会社(株)製、商品名「YDCN−700−10」、エポキシ当量:210
(B)熱硬化性成分(B1)
ビスフェノールF型エポキシ樹脂:DIC株式会社、商品名「EXA−830CRP」、エポキシ当量:159
フェノール樹脂:三井化学株式会社(株)製、商品名「ミレックスXLCLL」、軟化点:75℃、水酸基当量175
フェノール樹脂:大日本インキ化学工業(株)製、商品名「フェノライトLF−4871」、軟化点:130℃、水酸基当量118
シリカフィラー:アドマテックス株式会社製、商品名「SC2050−HLG」、平均粒径0.500μm
1−シアノエチル−2−フェニルイミダゾールキュアゾール:四国化成工業株式会社(株)製、商品名「2PZ−CN」
γ―メルカプトプロピルトリメトキシシラン:日本ユニカー株式会社(株)製、商品名「NUC A−189」
γ―ウレイドプロピルトリエトキシシラン:日本ユニカー株式会社(株)製、商品名「NUC A−1160」
実施例1,2及び比較例1〜3で作製した接着シートの特性を、以下のようにして評価した。
実施例1,2及び比較例1〜3の接着シートの接着剤層の溶融粘度は回転式粘弾性測定装置(ティー・エイ・インスツルメント・ジャパン株式会社製、ARES−RDA)を用いて測定した。具体的な手順を以下に示す。まず、接着シート1から基材フィルム2を剥離した後、接着剤層4を70℃で数枚ラミネートして張り合わせて膜厚を100μm以上になるようにし、直径8mmの円形に打ち抜いた。作製した円形のフィルムを同じく8mmの治具2枚ではさみ、サンプルを作製しとし、測定した(測定条件:周波数:1Hz、測定開始温度:35℃,測定終了温度:150℃、昇温速度5℃/分の測定条件で測定を行い、80℃の値を読み取った)。結果を表2に示す。
表面にAlをコートした150μm厚の半導体ウェハ裏面に、FH−900−25(日立化成工業製)を貼付け、ダイサー(DISCO製DFD−6361)を用いて7.5mm×7.5mmにダイシングした。フレキシブルダイボンダ((株)ルネサス東日本セミコンダクタ製DB730SP)にて150℃/0.04MPa/1秒にて熱圧着した。ワイヤボンダ((株)新川製UTC−230BI)にてスタットバンプを形成し、エラストマ貼付機((株)ルネサス東日本セミコンダクタ製、商品名「ES−10」)を用いて、r.t./3.2kgf(50g/バンプ)/3秒にてバンプをレベリングした。ワイヤボンダにてボンディングし、ワイヤ埋込性評価用基板とした。100μm厚の半導体ウェハに接着シート1を70℃にてラミネートし、ダイサーを用いて7.5mm×7.5mmにダイシングした。次いで、フレキシブルダイボンダで120℃/0.1MPa/1秒の条件にて熱圧着し、評価サンプルとした。真空蒸着機((株)真空デバイス製VE2030)を用いて、上記評価サンプルにカーボン蒸着を施した。環境制御型走査電子顕微鏡((株)フィリップス製、商品名「LC30」)を用いて、斜め15°の角度よりワイヤ埋込部を観察し、埋込性評価した。埋込性が良好なものは「○」、悪いものは「×」と判断した。測定した結果を表2に示す。
接着剤層のダイシェア強度(接着強度)を下記の方法により測定した。まず、接着シートの接着剤層を厚み400μmの半導体ウェハに70℃で貼り付けた。次に、それらを5mm角にダイシングして接着剤層付き半導体チップを得た。個片化した接着剤層付き半導体チップの接着剤層側をリードフレーム(大日本印刷(株)製、商品名「42アロイLF810TR)上に、120℃/0.1MPa/5sの条件で熱圧着した。次に、オーブンで110℃/1時間+170℃/3時間のステップキュアを行い、ダイボンディングフィルムを完全硬化させた。万能ボンドテスター(Dage社製、シリーズ4000)を用いて、6.7MPa/秒、250℃の温度条件でダイシェア強度を測定し、これを接着強度とした。測定した結果を表2に示す。
電食試験用基板(エスパネックス上の銅箔をエッチングし、形成したくし形パターン(金めっき無、ライン30μm、スペース70μm)に、切り出したフィルム(5mm×12mm)を圧着機で貼付した(100℃、圧力2kgf、貼付時間10秒)。これを170℃で5時間硬化したものをサンプルとした。硬化後サンプルを加速寿命試験装置(HIRAYAMA製、商品名+「PL−422R8」、条件:130℃/85%/100時間)に設置し、絶縁抵抗を測定した。評価方法としては、20時間以内に106Ω以下になったものを「×」、50時間以上100時間以内に106Ω以下になったものを「△」、100時間以上106Ω以上を保てたものを「○」とした。測定した結果を表2に示す。
実施例1,2及び比較例1〜3の接着剤層シートのタック強度はプローブ法により測定した。具体的には、まず、接着シートの接着剤層を平行なガラス板に両面テープで張り付けた。次いで、基材フィルムを接着シートから剥離し、30℃の熱板上に置き接着剤層の表面にプローブを下記条件で押し付け、プローブを接着剤層から引き離す際の強度を測定してタック強度とした。測定した結果を表2に示す。
テスト速度:5mm/分
プレスタイム:1.0秒
初期荷重(プレロード):200gf
まず厚さ100um半導体ウェハに接着シートを70℃でラミネートし、10mm×10mmに小片化した。その小片化した接着シート付きのチップを120℃/0.1MPa/1秒の条件で厚さ625umの半導体ウェハに圧着し、110℃で1時間熱硬化を行った後、200℃で10分間、熱板上でワイヤボンド熱相当をかけた。その後、超音波探査装置(SAT)(日立建機(株)製、商品名「HYE−FOCUS」)を用いて発泡の有無を評価した。発泡がないものを「○」、発泡が見られるものを「×」とした。以上のように測定した結果を表2に示す。
Claims (2)
- 基板及び前記基板上に形成された回路パターンを有する支持部材と、
前記支持部材上に設けられた第一の半導体素子と、
前記第一の半導体素子に接着剤層を介して接着されている第二の半導体素子と、を備え、
前記支持部材と前記第一の半導体素子とは接着剤を介して接着されており、
前記回路パターンと前記第一の半導体素子とはワイヤにより電気的に接続されており、
前記第一の半導体素子及び前記ワイヤは前記接着剤層によって封止されており、
前記接着剤層が、
(A)高分子量成分と、
(B1)軟化点が50℃未満の熱硬化性成分と、
(B2)軟化点が50℃以上100℃以下の熱硬化性成分と、
(C)軟化点が100℃以下のフェノール樹脂と、を含む樹脂組成物からなり、
当該樹脂組成物100質量%を基準として、前記(A)高分子量成分を11〜22質量%、前記(B1)軟化点が50℃未満の熱硬化性成分を10〜20質量%、前記(B2)軟化点が50℃以上100℃以下の熱硬化性成分を10〜20質量%、前記(C)軟化点が100℃以下のフェノール樹脂を15〜30質量%含有する接着シート、がフィルムキュアされたものである、
半導体装置。 - 支持部材、前記支持部材上に設けられた接着剤を介して前記支持部材に接着された第一の半導体素子、及びワイヤに、第二の半導体素子及び接着剤層を有する接着剤層付き半導体素子を、熱圧着により、前記接着剤層を介して接着する工程と、
前記接着剤層に対して110〜125℃で0.5〜1時間の加熱を行って、前記接着剤層によって前記第一の半導体素子及び前記ワイヤを封止する工程と、
を備え、
前記支持部材が、基板及び前記基板上に形成された回路パターンを有し、前記回路パターンと前記第一の半導体素子とが前記ワイヤによって電気的に接続されており、
前記第一の半導体素子及び前記ワイヤを封止する前の前記接着剤層が、
(A)高分子量成分と、
(B1)軟化点が50℃未満の熱硬化性成分と、
(B2)軟化点が50℃以上100℃以下の熱硬化性成分と、
(C)軟化点が100℃以下のフェノール樹脂と、を含む樹脂組成物からなり、
当該樹脂組成物100質量%を基準として、前記(A)高分子量成分を11〜22質量%、前記(B1)軟化点が50℃未満の熱硬化性成分を10〜20質量%、前記(B2)軟化点が50℃以上100℃以下の熱硬化性成分を10〜20質量%、前記(C)軟化点が100℃以下のフェノール樹脂を15〜30質量%含有する、接着シートである、
半導体装置の製造方法。
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JP2017204656A (ja) | 2017-11-16 |
KR101953052B1 (ko) | 2019-02-27 |
US9212298B2 (en) | 2015-12-15 |
KR20170105640A (ko) | 2017-09-19 |
KR102067945B1 (ko) | 2020-01-17 |
JPWO2013133275A1 (ja) | 2015-07-30 |
JP6414296B2 (ja) | 2018-10-31 |
TW201346003A (zh) | 2013-11-16 |
CN104169383B (zh) | 2016-11-09 |
KR20160139043A (ko) | 2016-12-06 |
CN106024654B (zh) | 2019-07-02 |
CN106024654A (zh) | 2016-10-12 |
CN104169383A (zh) | 2014-11-26 |
KR20200006197A (ko) | 2020-01-17 |
KR20140126736A (ko) | 2014-10-31 |
TWI485225B (zh) | 2015-05-21 |
KR20190020191A (ko) | 2019-02-27 |
US20150050780A1 (en) | 2015-02-19 |
WO2013133275A1 (ja) | 2013-09-12 |
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