KR20190098142A - 연마용 조성물 - Google Patents

연마용 조성물 Download PDF

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Publication number
KR20190098142A
KR20190098142A KR1020197017169A KR20197017169A KR20190098142A KR 20190098142 A KR20190098142 A KR 20190098142A KR 1020197017169 A KR1020197017169 A KR 1020197017169A KR 20197017169 A KR20197017169 A KR 20197017169A KR 20190098142 A KR20190098142 A KR 20190098142A
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KR
South Korea
Prior art keywords
water
polishing
polishing composition
soluble polymers
soluble polymer
Prior art date
Application number
KR1020197017169A
Other languages
English (en)
Korean (ko)
Inventor
슈헤이 마쓰다
노리아키 스기타
다카유키 마쓰시타
Original Assignee
니타 하스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니타 하스 인코포레이티드 filed Critical 니타 하스 인코포레이티드
Publication of KR20190098142A publication Critical patent/KR20190098142A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
KR1020197017169A 2016-12-28 2017-12-27 연마용 조성물 KR20190098142A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016255099 2016-12-28
JPJP-P-2016-255099 2016-12-28
PCT/JP2017/047089 WO2018124230A1 (ja) 2016-12-28 2017-12-27 研磨用組成物

Publications (1)

Publication Number Publication Date
KR20190098142A true KR20190098142A (ko) 2019-08-21

Family

ID=62709419

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197017169A KR20190098142A (ko) 2016-12-28 2017-12-27 연마용 조성물

Country Status (5)

Country Link
JP (1) JP7077236B2 (zh)
KR (1) KR20190098142A (zh)
CN (1) CN110036086B (zh)
TW (1) TWI755467B (zh)
WO (1) WO2018124230A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020035870A (ja) * 2018-08-29 2020-03-05 株式会社フジミインコーポレーテッド 研磨用組成物
CN111378379B (zh) * 2018-12-29 2022-08-05 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
JP7433042B2 (ja) * 2019-12-24 2024-02-19 ニッタ・デュポン株式会社 研磨用組成物
JP2022155523A (ja) 2021-03-30 2022-10-13 株式会社フジミインコーポレーテッド 研磨用組成物、及び窒化ケイ素を選択的に除去する方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7524347B2 (en) * 2004-10-28 2009-04-28 Cabot Microelectronics Corporation CMP composition comprising surfactant
FR2917440B1 (fr) * 2007-06-12 2010-09-24 Comptoir Hydro Electro Thermiq Cabine modulaire pour fumeurs et espaces fumeurs modulables resultant de l'assemblage de telles cabines.
DE112008002628B4 (de) 2007-09-28 2018-07-19 Nitta Haas Inc. Polierzusammensetzung
JP5371416B2 (ja) 2008-12-25 2013-12-18 富士フイルム株式会社 研磨液及び研磨方法
JP2015205348A (ja) 2012-08-30 2015-11-19 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
US9505950B2 (en) * 2012-08-31 2016-11-29 Fujimi Incorporated Polishing composition and method for producing substrate
EP2826827B1 (en) 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
JP6559936B2 (ja) * 2014-09-05 2019-08-14 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法

Also Published As

Publication number Publication date
CN110036086B (zh) 2022-04-26
CN110036086A (zh) 2019-07-19
TW201829717A (zh) 2018-08-16
JP7077236B2 (ja) 2022-05-30
WO2018124230A1 (ja) 2018-07-05
TWI755467B (zh) 2022-02-21
JPWO2018124230A1 (ja) 2019-10-31

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