JP7077236B2 - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
JP7077236B2
JP7077236B2 JP2018559610A JP2018559610A JP7077236B2 JP 7077236 B2 JP7077236 B2 JP 7077236B2 JP 2018559610 A JP2018559610 A JP 2018559610A JP 2018559610 A JP2018559610 A JP 2018559610A JP 7077236 B2 JP7077236 B2 JP 7077236B2
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JP
Japan
Prior art keywords
polishing
water
polishing composition
soluble polymers
abrasive grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2018559610A
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English (en)
Japanese (ja)
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JPWO2018124230A1 (ja
Inventor
修平 松田
規章 杉田
隆幸 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta DuPont Inc
Original Assignee
Nitta DuPont Inc
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Publication date
Application filed by Nitta DuPont Inc filed Critical Nitta DuPont Inc
Publication of JPWO2018124230A1 publication Critical patent/JPWO2018124230A1/ja
Application granted granted Critical
Publication of JP7077236B2 publication Critical patent/JP7077236B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018559610A 2016-12-28 2017-12-27 研磨用組成物 Active JP7077236B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016255099 2016-12-28
JP2016255099 2016-12-28
PCT/JP2017/047089 WO2018124230A1 (ja) 2016-12-28 2017-12-27 研磨用組成物

Publications (2)

Publication Number Publication Date
JPWO2018124230A1 JPWO2018124230A1 (ja) 2019-10-31
JP7077236B2 true JP7077236B2 (ja) 2022-05-30

Family

ID=62709419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018559610A Active JP7077236B2 (ja) 2016-12-28 2017-12-27 研磨用組成物

Country Status (5)

Country Link
JP (1) JP7077236B2 (zh)
KR (1) KR20190098142A (zh)
CN (1) CN110036086B (zh)
TW (1) TWI755467B (zh)
WO (1) WO2018124230A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020035870A (ja) * 2018-08-29 2020-03-05 株式会社フジミインコーポレーテッド 研磨用組成物
CN111378379B (zh) * 2018-12-29 2022-08-05 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
JP7433042B2 (ja) * 2019-12-24 2024-02-19 ニッタ・デュポン株式会社 研磨用組成物
JP2022155523A (ja) 2021-03-30 2022-10-13 株式会社フジミインコーポレーテッド 研磨用組成物、及び窒化ケイ素を選択的に除去する方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008517791A (ja) 2004-10-28 2008-05-29 キャボット マイクロエレクトロニクス コーポレイション 界面活性剤を含むｃｍｐ組成物
WO2009041697A1 (ja) 2007-09-28 2009-04-02 Nitta Haas Incorporated 研磨用組成物
JP2010153626A (ja) 2008-12-25 2010-07-08 Fujifilm Corp 研磨液
JP2015205348A (ja) 2012-08-30 2015-11-19 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
JP2016056220A (ja) 2014-09-05 2016-04-21 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法
JP2016529356A (ja) 2013-07-18 2016-09-23 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ セリアを含有する研磨粒子を含むｃｍｐ組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2917440B1 (fr) * 2007-06-12 2010-09-24 Comptoir Hydro Electro Thermiq Cabine modulaire pour fumeurs et espaces fumeurs modulables resultant de l'assemblage de telles cabines.
US9505950B2 (en) * 2012-08-31 2016-11-29 Fujimi Incorporated Polishing composition and method for producing substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008517791A (ja) 2004-10-28 2008-05-29 キャボット マイクロエレクトロニクス コーポレイション 界面活性剤を含むｃｍｐ組成物
WO2009041697A1 (ja) 2007-09-28 2009-04-02 Nitta Haas Incorporated 研磨用組成物
JP2010153626A (ja) 2008-12-25 2010-07-08 Fujifilm Corp 研磨液
JP2015205348A (ja) 2012-08-30 2015-11-19 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
JP2016529356A (ja) 2013-07-18 2016-09-23 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ セリアを含有する研磨粒子を含むｃｍｐ組成物
JP2016056220A (ja) 2014-09-05 2016-04-21 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法

Also Published As

Publication number Publication date
KR20190098142A (ko) 2019-08-21
CN110036086A (zh) 2019-07-19
JPWO2018124230A1 (ja) 2019-10-31
CN110036086B (zh) 2022-04-26
TW201829717A (zh) 2018-08-16
WO2018124230A1 (ja) 2018-07-05
TWI755467B (zh) 2022-02-21

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