KR20190060527A - 반도체 메모리 장치 및 그 동작 방법 - Google Patents

반도체 메모리 장치 및 그 동작 방법 Download PDF

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Publication number
KR20190060527A
KR20190060527A KR1020170158829A KR20170158829A KR20190060527A KR 20190060527 A KR20190060527 A KR 20190060527A KR 1020170158829 A KR1020170158829 A KR 1020170158829A KR 20170158829 A KR20170158829 A KR 20170158829A KR 20190060527 A KR20190060527 A KR 20190060527A
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South Korea
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English (en)
Korean (ko)
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김경륜
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삼성전자주식회사
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Priority to KR1020170158829A priority Critical patent/KR20190060527A/ko
Priority to US16/130,544 priority patent/US10692582B2/en
Priority to DE102018122491.5A priority patent/DE102018122491A1/de
Priority to JP2018217444A priority patent/JP7271139B2/ja
Priority to CN201811409219.1A priority patent/CN110010187B/zh
Publication of KR20190060527A publication Critical patent/KR20190060527A/ko
Withdrawn legal-status Critical Current

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/76Masking faults in memories by using spares or by reconfiguring using address translation or modifications
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/44Indication or identification of errors, e.g. for repair
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/78Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/785Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/78Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • G11C29/806Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout by reducing size of decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/78Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • G11C29/808Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout using a flexible replacement scheme

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  • For Increasing The Reliability Of Semiconductor Memories (AREA)
KR1020170158829A 2017-11-24 2017-11-24 반도체 메모리 장치 및 그 동작 방법 Withdrawn KR20190060527A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020170158829A KR20190060527A (ko) 2017-11-24 2017-11-24 반도체 메모리 장치 및 그 동작 방법
US16/130,544 US10692582B2 (en) 2017-11-24 2018-09-13 Semiconductor memory device and method of operating the same
DE102018122491.5A DE102018122491A1 (de) 2017-11-24 2018-09-14 Halbleiterspeichervorrichtung und verfahren zum betreiben derselben
JP2018217444A JP7271139B2 (ja) 2017-11-24 2018-11-20 半導体メモリ装置及びその動作方法
CN201811409219.1A CN110010187B (zh) 2017-11-24 2018-11-23 半导体存储器装置及其操作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170158829A KR20190060527A (ko) 2017-11-24 2017-11-24 반도체 메모리 장치 및 그 동작 방법

Publications (1)

Publication Number Publication Date
KR20190060527A true KR20190060527A (ko) 2019-06-03

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KR1020170158829A Withdrawn KR20190060527A (ko) 2017-11-24 2017-11-24 반도체 메모리 장치 및 그 동작 방법

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Country Link
US (1) US10692582B2 (https=)
JP (1) JP7271139B2 (https=)
KR (1) KR20190060527A (https=)
CN (1) CN110010187B (https=)
DE (1) DE102018122491A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3095547B1 (fr) * 2019-04-26 2024-07-19 St Microelectronics Rousset Bus de données de mémoire non-volatile
US11164650B2 (en) 2019-08-30 2021-11-02 International Business Machines Corporation Scrub management in storage class memory
US10997084B2 (en) * 2019-08-30 2021-05-04 International Business Machines Corporation Virtual to physical translation and media repair in storage class memory
KR102697631B1 (ko) * 2019-10-28 2024-08-23 삼성전자주식회사 리페어 단위를 가변하는 메모리 장치 및 그것의 리페어 방법
CN114830241A (zh) * 2019-12-31 2022-07-29 华为技术有限公司 一种存储器的失效修复方法及装置
US11797371B2 (en) 2020-08-18 2023-10-24 Changxin Memory Technologies, Inc. Method and device for determining fail bit repair scheme
EP3985675B1 (en) 2020-08-18 2024-01-31 Changxin Memory Technologies, Inc. Method and device for repairing fail bits
US11887685B2 (en) 2020-08-18 2024-01-30 Changxin Memory Technologies, Inc. Fail Bit repair method and device
US11791010B2 (en) 2020-08-18 2023-10-17 Changxin Memory Technologies, Inc. Method and device for fail bit repairing
EP3992972B1 (en) 2020-09-01 2024-09-04 Changxin Memory Technologies, Inc. Method and apparatus for determining failed bit repair scheme, and chip
CN112667445B (zh) * 2021-01-12 2022-05-03 长鑫存储技术有限公司 封装后的内存修复方法及装置、存储介质、电子设备
KR102870571B1 (ko) * 2021-03-24 2025-10-13 양쯔 메모리 테크놀로지스 씨오., 엘티디. 리던던트 뱅크를 사용하여 결함 있는 메인 뱅크를 복구하기 위한 메모리 디바이스
US11984179B2 (en) 2021-03-26 2024-05-14 Changxin Memory Technologies, Inc. Redundant circuit assigning method and device, and medium
CN112908403B (zh) * 2021-03-31 2022-05-17 长鑫存储技术有限公司 备用电路分派方法、装置、设备及介质
US11791012B2 (en) 2021-03-31 2023-10-17 Changxin Memory Technologies, Inc. Standby circuit dispatch method, apparatus, device and medium
US11881278B2 (en) 2021-03-31 2024-01-23 Changxin Memory Technologies, Inc. Redundant circuit assigning method and device, apparatus and medium
EP4307306B1 (en) * 2021-04-30 2026-03-18 Huawei Technologies Co., Ltd. Access method for storage unit, repair method, die and storage chip
CN113539347B (zh) 2021-07-21 2023-08-18 长鑫存储技术有限公司 存储器修补线路确定方法及装置、存储介质及电子设备
CN116343883B (zh) * 2021-12-22 2025-11-21 浙江驰拓科技有限公司 一种存储器及存储器修复方法
US11989417B1 (en) 2022-10-31 2024-05-21 Nxp Usa, Inc. Column repair in a memory system using a repair cache
CN118212966A (zh) * 2022-12-08 2024-06-18 长鑫存储技术有限公司 一种信号传输电路及其方法、存储器和电子设备
CN115881202B (zh) * 2023-02-09 2023-05-12 长鑫存储技术有限公司 一种修复电路及方法、存储器和电子设备

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8900026A (nl) * 1989-01-06 1990-08-01 Philips Nv Matrixgeheugen, bevattende standaardblokken, standaardsubblokken, een redundant blok, en redundante subblokken, alsmede geintegreerde schakeling bevattende meerdere van zulke matrixgeheugens.
JP2536333B2 (ja) * 1991-07-24 1996-09-18 富士通株式会社 半導体記憶装置
EP0802541B1 (en) 1996-04-18 2003-03-12 STMicroelectronics S.r.l. Method for detecting redundant defective addresses in a memory device with redundancy
KR19990015310A (ko) 1997-08-05 1999-03-05 윤종용 서로 다른 메모리블락들에 공유되는 퓨즈박스를 갖는 반도체 메모리장치
US5999463A (en) 1997-07-21 1999-12-07 Samsung Electronics Co., Ltd. Redundancy fuse box and semiconductor device including column redundancy fuse box shared by a plurality of memory blocks
KR100345679B1 (ko) 1999-12-24 2002-07-27 주식회사 하이닉스반도체 메인 워드라인 대치방식의 로우 리페어를 갖는 반도체메모리 장치
US6480429B2 (en) 2001-02-12 2002-11-12 Micron Technology, Inc. Shared redundancy for memory having column addressing
KR100526882B1 (ko) 2003-07-10 2005-11-09 삼성전자주식회사 멀티 블록 구조를 갖는 반도체 메모리 장치에서의리던던시 회로
CN1823392A (zh) * 2003-07-15 2006-08-23 尔必达存储器株式会社 半导体存储器件
KR20050037144A (ko) 2003-10-17 2005-04-21 주식회사 하이닉스반도체 메모리 장치의 컬럼 리페어 회로
US7006393B2 (en) 2004-06-07 2006-02-28 Micron Technology, Inc. Method and apparatus for semiconductor device repair with reduced number of programmable elements
US7630258B2 (en) * 2004-09-30 2009-12-08 Texas Instruments Incorporated Decoder based set associative repair cache systems and methods
KR20080006113A (ko) 2006-07-11 2008-01-16 삼성전자주식회사 노멀 섹션 워드 라인 단위로 결함 셀을 리페어 할 수 있는 리페어 장치 및 방법
KR101226685B1 (ko) 2007-11-08 2013-01-25 삼성전자주식회사 수직형 반도체 소자 및 그 제조 방법.
US8144534B2 (en) 2009-08-25 2012-03-27 Micron Technology, Inc. Methods and memory devices for repairing memory cells
KR101691092B1 (ko) 2010-08-26 2016-12-30 삼성전자주식회사 불휘발성 메모리 장치, 그것의 동작 방법, 그리고 그것을 포함하는 메모리 시스템
US8553466B2 (en) 2010-03-04 2013-10-08 Samsung Electronics Co., Ltd. Non-volatile memory device, erasing method thereof, and memory system including the same
US9536970B2 (en) 2010-03-26 2017-01-03 Samsung Electronics Co., Ltd. Three-dimensional semiconductor memory devices and methods of fabricating the same
KR101124320B1 (ko) 2010-03-31 2012-03-27 주식회사 하이닉스반도체 리던던시 회로
KR101682666B1 (ko) 2010-08-11 2016-12-07 삼성전자주식회사 비휘발성 메모리 장치, 그것의 채널 부스팅 방법, 그것의 프로그램 방법 및 그것을 포함하는 메모리 시스템
JP2012252757A (ja) * 2011-06-06 2012-12-20 Elpida Memory Inc 半導体装置
KR102144107B1 (ko) 2012-11-21 2020-08-12 삼성전자주식회사 리페어 제어 회로 및 이를 포함하는 반도체 메모리 장치
US9007856B2 (en) 2012-11-21 2015-04-14 Samsung Electronics Co., Ltd. Repair control circuit and semiconductor memory device including the same
KR20160105599A (ko) 2015-02-27 2016-09-07 에스케이하이닉스 주식회사 메모리 장치
US10490296B2 (en) * 2016-02-09 2019-11-26 Globalfoundries U.S. Inc. Memory built-in self-test (MBIST) test time reduction
US10636511B2 (en) * 2017-07-27 2020-04-28 Taiwan Semiconductor Manufacturing Company Limited Memory repair scheme
US10522235B2 (en) * 2017-08-25 2019-12-31 Micron Technology, Inc. Repair fuse latches using static random access memory array

Also Published As

Publication number Publication date
US20190164621A1 (en) 2019-05-30
CN110010187A (zh) 2019-07-12
CN110010187B (zh) 2024-09-17
JP7271139B2 (ja) 2023-05-11
US10692582B2 (en) 2020-06-23
JP2019096376A (ja) 2019-06-20
DE102018122491A1 (de) 2019-05-29

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Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20171124

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