KR20180102575A - 핀을 가진 알루미늄 emi/rf 실드 - Google Patents

핀을 가진 알루미늄 emi/rf 실드 Download PDF

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Publication number
KR20180102575A
KR20180102575A KR1020187019917A KR20187019917A KR20180102575A KR 20180102575 A KR20180102575 A KR 20180102575A KR 1020187019917 A KR1020187019917 A KR 1020187019917A KR 20187019917 A KR20187019917 A KR 20187019917A KR 20180102575 A KR20180102575 A KR 20180102575A
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KR
South Korea
Prior art keywords
tab
stackable
shield
pin
tabs
Prior art date
Application number
KR1020187019917A
Other languages
English (en)
Korean (ko)
Inventor
아서 커츠
마이클 슈나이더
브렛 배리
Original Assignee
에이.케이 스탬핑 컴퍼니, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/967,970 external-priority patent/US9603292B2/en
Application filed by 에이.케이 스탬핑 컴퍼니, 인크. filed Critical 에이.케이 스탬핑 컴퍼니, 인크.
Publication of KR20180102575A publication Critical patent/KR20180102575A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020187019917A 2015-12-14 2016-12-14 핀을 가진 알루미늄 emi/rf 실드 KR20180102575A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/967,970 2015-12-14
US14/967,970 US9603292B2 (en) 2013-03-15 2015-12-14 Aluminum EMI/RF shield with fins
PCT/US2016/066479 WO2017106242A1 (en) 2015-12-14 2016-12-14 Aluminum emi / rf shield with fins

Publications (1)

Publication Number Publication Date
KR20180102575A true KR20180102575A (ko) 2018-09-17

Family

ID=59057457

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187019917A KR20180102575A (ko) 2015-12-14 2016-12-14 핀을 가진 알루미늄 emi/rf 실드

Country Status (5)

Country Link
EP (1) EP3391719A4 (zh)
JP (1) JP2019506755A (zh)
KR (1) KR20180102575A (zh)
CN (1) CN108476606A (zh)
WO (1) WO2017106242A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022173887A1 (en) * 2021-02-12 2022-08-18 Arris Enterprises Llc Metamaterial heat spreader

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750494A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 冷却装置
JP3088624U (ja) * 2002-03-15 2002-09-20 豫▲徳▼科技股▲分▼有限公司 組み立て式ヒートシンク
US6619381B1 (en) * 2002-03-21 2003-09-16 Chien-Te Lee Modular heat dissipating device
CN2559187Y (zh) * 2002-04-27 2003-07-02 奇鋐科技股份有限公司 组合式散热鳍片
US6644386B1 (en) * 2002-12-03 2003-11-11 A-Chu Chang Engaging mechanism for heat-dissipating member
JP4043986B2 (ja) * 2003-03-31 2008-02-06 古河電気工業株式会社 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法
JP3799477B2 (ja) * 2003-12-12 2006-07-19 ソニー株式会社 放熱フィン、冷却装置、電子機器及び冷却装置の製造方法
US7104311B1 (en) * 2005-10-17 2006-09-12 Kwo Ger Metal Technology, Inc. Heat sink assembly
JP4604262B2 (ja) * 2006-09-19 2011-01-05 株式会社デンソー 冷却装置とその製造方法
CN201171257Y (zh) * 2008-02-02 2008-12-24 国格金属科技股份有限公司 散热鳍片组装结构
JP3141510U (ja) * 2008-02-22 2008-05-08 國格金屬科技股▲ふん▼有限公司 ヒートシンクフィン組み込み構造
TWM346266U (en) * 2008-05-19 2008-12-01 Asia Vital Components Co Ltd Heat dissipation fin and heat dissipation module having the same
CN201221912Y (zh) * 2008-05-25 2009-04-15 奇鋐科技股份有限公司 散热鳍片
CN201290212Y (zh) * 2008-09-24 2009-08-12 昆山新力精密五金有限公司 散热器结构
TWI370722B (en) * 2008-12-22 2012-08-11 Unihan Corp Electromagnetic shielding device with heat dissipating
CN101754667B (zh) * 2008-12-22 2011-11-09 永硕联合国际股份有限公司 具有散热功能的电磁屏蔽装置
CN101839654B (zh) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 散热器
JP5089668B2 (ja) * 2009-10-14 2012-12-05 古河電気工業株式会社 ヒートシンク
US8213180B2 (en) * 2010-01-21 2012-07-03 Broadcom Corporation Electromagnetic interference shield with integrated heat sink
CN103929935A (zh) * 2013-01-15 2014-07-16 起源技术美国股份有限公司 散热的emi/rfi屏蔽装置
US9439333B2 (en) * 2013-01-15 2016-09-06 Genesis Technology Usa, Inc. Heat-dissipating EMI/RFI shield
US9538693B2 (en) * 2013-03-15 2017-01-03 A.K. Stamping Company, Inc. Aluminum EMI / RF shield

Also Published As

Publication number Publication date
WO2017106242A1 (en) 2017-06-22
JP2019506755A (ja) 2019-03-07
EP3391719A1 (en) 2018-10-24
CN108476606A (zh) 2018-08-31
EP3391719A4 (en) 2019-07-24

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