KR20180085110A - 스크라이빙 장치 - Google Patents
스크라이빙 장치 Download PDFInfo
- Publication number
- KR20180085110A KR20180085110A KR1020170008128A KR20170008128A KR20180085110A KR 20180085110 A KR20180085110 A KR 20180085110A KR 1020170008128 A KR1020170008128 A KR 1020170008128A KR 20170008128 A KR20170008128 A KR 20170008128A KR 20180085110 A KR20180085110 A KR 20180085110A
- Authority
- KR
- South Korea
- Prior art keywords
- wheel holder
- scribing
- wheel
- unit
- holder receiving
- Prior art date
Links
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 description 54
- 238000007790 scraping Methods 0.000 description 11
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 230000003993 interaction Effects 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 4
- 230000002452 interceptive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170008128A KR20180085110A (ko) | 2017-01-17 | 2017-01-17 | 스크라이빙 장치 |
CN201710475093.7A CN108314304B (zh) | 2017-01-17 | 2017-06-21 | 划片设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170008128A KR20180085110A (ko) | 2017-01-17 | 2017-01-17 | 스크라이빙 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20180085110A true KR20180085110A (ko) | 2018-07-26 |
Family
ID=62891425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170008128A KR20180085110A (ko) | 2017-01-17 | 2017-01-17 | 스크라이빙 장치 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20180085110A (zh) |
CN (1) | CN108314304B (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070070824A (ko) | 2005-12-29 | 2007-07-04 | 주식회사 탑 엔지니어링 | 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100673269B1 (ko) * | 2005-12-29 | 2007-01-24 | 주식회사 탑 엔지니어링 | 스크라이버의 휠 홀더장치 |
JP5239547B2 (ja) * | 2008-06-23 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | チップホルダ、ホルダユニット、スクライブヘッド及びスクライブ装置 |
KR20100059204A (ko) * | 2008-11-26 | 2010-06-04 | 주식회사 탑 엔지니어링 | 글래스 패널의 스크라이빙 장치 |
JP5826652B2 (ja) * | 2012-01-31 | 2015-12-02 | 三星ダイヤモンド工業株式会社 | ホルダユニット及びスクライブ装置 |
JP5894876B2 (ja) * | 2012-06-29 | 2016-03-30 | 三星ダイヤモンド工業株式会社 | チップホルダ収納体 |
CN103111761B (zh) * | 2012-12-05 | 2015-05-20 | 大族激光科技产业集团股份有限公司 | 划片方法及装置 |
-
2017
- 2017-01-17 KR KR1020170008128A patent/KR20180085110A/ko active IP Right Grant
- 2017-06-21 CN CN201710475093.7A patent/CN108314304B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070070824A (ko) | 2005-12-29 | 2007-07-04 | 주식회사 탑 엔지니어링 | 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버 |
Also Published As
Publication number | Publication date |
---|---|
CN108314304B (zh) | 2022-02-25 |
CN108314304A (zh) | 2018-07-24 |
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