KR20170086522A - 에피택셜 웨이퍼, 반도체 소자, 에피택셜 웨이퍼의 제조 방법 및 반도체 소자의 제조 방법 - Google Patents

에피택셜 웨이퍼, 반도체 소자, 에피택셜 웨이퍼의 제조 방법 및 반도체 소자의 제조 방법 Download PDF

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KR20170086522A
KR20170086522A KR1020177013821A KR20177013821A KR20170086522A KR 20170086522 A KR20170086522 A KR 20170086522A KR 1020177013821 A KR1020177013821 A KR 1020177013821A KR 20177013821 A KR20177013821 A KR 20177013821A KR 20170086522 A KR20170086522 A KR 20170086522A
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layer
buffer
composition
average
epitaxial wafer
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겐 사또
히로시 시까우찌
히로까즈 고또
마사루 시노미야
게이따로 즈찌야
가즈노리 하기모또
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산켄덴키 가부시키가이샤
신에쯔 한도타이 가부시키가이샤
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    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
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    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
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    • H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
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  • Recrystallisation Techniques (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020177013821A 2014-11-25 2015-11-06 에피택셜 웨이퍼, 반도체 소자, 에피택셜 웨이퍼의 제조 방법 및 반도체 소자의 제조 방법 Withdrawn KR20170086522A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-237683 2014-11-25
JP2014237683A JP6180401B2 (ja) 2014-11-25 2014-11-25 エピタキシャルウェーハ、半導体素子、エピタキシャルウェーハの製造方法、並びに、半導体素子の製造方法
PCT/JP2015/005562 WO2016084311A1 (ja) 2014-11-25 2015-11-06 エピタキシャルウェーハ、半導体素子、エピタキシャルウェーハの製造方法、並びに、半導体素子の製造方法

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KR20170086522A true KR20170086522A (ko) 2017-07-26

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US (1) US20170323960A1 (https=)
JP (1) JP6180401B2 (https=)
KR (1) KR20170086522A (https=)
CN (1) CN107004579B (https=)
TW (1) TWI610344B (https=)
WO (1) WO2016084311A1 (https=)

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KR20230149975A (ko) * 2022-04-21 2023-10-30 웨이브로드 주식회사 3족 질화물 반도체 적층체를 제조하는 방법

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EP3451364B1 (en) 2017-08-28 2020-02-26 Siltronic AG Heteroepitaxial wafer and method for producing a heteroepitaxial wafer
EP3576132B1 (en) * 2018-05-28 2025-12-17 IMEC vzw A iii-n semiconductor structure and a method for forming a iii-n semiconductor structure
WO2019240894A1 (en) * 2018-06-14 2019-12-19 Glo Ab Epitaxial gallium nitride based light emitting diode and method of making thereof
CN110233105B (zh) * 2019-06-20 2022-07-08 江苏能华微电子科技发展有限公司 一种翘曲可调的SiC基HEMT结构的制备方法及结构
TWI735212B (zh) * 2020-04-24 2021-08-01 環球晶圓股份有限公司 具有超晶格疊層體的磊晶結構
US11387356B2 (en) * 2020-07-31 2022-07-12 Vanguard International Semiconductor Corporation Semiconductor structure and high-electron mobility transistor device having the same
JP7654367B2 (ja) * 2020-08-24 2025-04-01 エア・ウォーター株式会社 化合物半導体基板および化合物半導体デバイス

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JP5309451B2 (ja) * 2007-02-19 2013-10-09 サンケン電気株式会社 半導体ウエーハ及び半導体素子及び製造方法
JP5309452B2 (ja) * 2007-02-28 2013-10-09 サンケン電気株式会社 半導体ウエーハ及び半導体素子及び製造方法
JP5477685B2 (ja) * 2009-03-19 2014-04-23 サンケン電気株式会社 半導体ウェーハ及び半導体素子及びその製造方法
JP5334057B2 (ja) * 2009-11-04 2013-11-06 Ｄｏｗａエレクトロニクス株式会社 Ｉｉｉ族窒化物積層基板
JP5660373B2 (ja) * 2010-10-29 2015-01-28 サンケン電気株式会社 半導体ウエーハ及び半導体素子
JP5708187B2 (ja) * 2011-04-15 2015-04-30 サンケン電気株式会社 半導体装置
US8710511B2 (en) * 2011-07-29 2014-04-29 Northrop Grumman Systems Corporation AIN buffer N-polar GaN HEMT profile
JP5127978B1 (ja) * 2011-09-08 2013-01-23 株式会社東芝 窒化物半導体素子、窒化物半導体ウェーハ及び窒化物半導体層の製造方法
JP5462377B1 (ja) * 2013-01-04 2014-04-02 Ｄｏｗａエレクトロニクス株式会社 Ｉｉｉ族窒化物エピタキシャル基板およびその製造方法
CN103633134B (zh) * 2013-12-12 2016-09-14 中山大学 一种厚膜高阻氮化物半导体外延结构及其生长方法

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KR20230149975A (ko) * 2022-04-21 2023-10-30 웨이브로드 주식회사 3족 질화물 반도체 적층체를 제조하는 방법

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CN107004579B (zh) 2020-03-10
JP6180401B2 (ja) 2017-08-16
TWI610344B (zh) 2018-01-01
TW201631635A (zh) 2016-09-01
WO2016084311A1 (ja) 2016-06-02
JP2016100508A (ja) 2016-05-30
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000