KR20160137392A - 내열성 유기 고분자층의 박리 방법 및 플렉시블 배선판의 제조 방법 - Google Patents

내열성 유기 고분자층의 박리 방법 및 플렉시블 배선판의 제조 방법 Download PDF

Info

Publication number
KR20160137392A
KR20160137392A KR1020160061161A KR20160061161A KR20160137392A KR 20160137392 A KR20160137392 A KR 20160137392A KR 1020160061161 A KR1020160061161 A KR 1020160061161A KR 20160061161 A KR20160061161 A KR 20160061161A KR 20160137392 A KR20160137392 A KR 20160137392A
Authority
KR
South Korea
Prior art keywords
organic polymer
polymer layer
heat
resistant organic
substrate
Prior art date
Application number
KR1020160061161A
Other languages
English (en)
Korean (ko)
Inventor
다카히로 기무라
유타카 구와타
아키라 시게타
다케시 요시다
Original Assignee
가부시키가이샤 스크린 홀딩스
유니티카 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스, 유니티카 가부시끼가이샤 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20160137392A publication Critical patent/KR20160137392A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
    • H01L51/0097—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020160061161A 2015-05-22 2016-05-19 내열성 유기 고분자층의 박리 방법 및 플렉시블 배선판의 제조 방법 KR20160137392A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015104692 2015-05-22
JPJP-P-2015-104692 2015-05-22
JP2016091094A JP6718736B2 (ja) 2015-05-22 2016-04-28 耐熱性有機高分子層の剥離方法およびフレキシブル配線板の製造方法
JPJP-P-2016-091094 2016-04-28

Publications (1)

Publication Number Publication Date
KR20160137392A true KR20160137392A (ko) 2016-11-30

Family

ID=57579102

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160061161A KR20160137392A (ko) 2015-05-22 2016-05-19 내열성 유기 고분자층의 박리 방법 및 플렉시블 배선판의 제조 방법

Country Status (3)

Country Link
JP (1) JP6718736B2 (zh)
KR (1) KR20160137392A (zh)
TW (1) TWI709998B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210145418A (ko) * 2020-05-25 2021-12-02 한국생산기술연구원 Xfl 리프트 오프 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023098471A (ja) * 2021-12-28 2023-07-10 スリーエム イノベイティブ プロパティズ カンパニー 光熱変換層インク組成物及び積層体
JP2023097915A (ja) * 2021-12-28 2023-07-10 株式会社Ｓｃｒｅｅｎホールディングス 層状構造の製造方法、電子装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1165380A (ja) * 1997-08-13 1999-03-05 Ricoh Co Ltd 被記録材の再生装置
JP2003177229A (ja) * 2001-12-11 2003-06-27 Fuji Photo Film Co Ltd カラーフィルター付回路基板の形成方法及びカラーフィルター付回路基板
JP5257314B2 (ja) * 2009-09-29 2013-08-07 大日本印刷株式会社 積層体、準備用支持体、積層体の製造方法、及びデバイスの製造方法
JP5619461B2 (ja) * 2010-03-31 2014-11-05 ユー・ディー・シー アイルランド リミテッド 光路長調整層転写シート、並びに有機電界発光装置及びその製造方法
JP5864926B2 (ja) * 2011-07-14 2016-02-17 東京応化工業株式会社 積層体、分離方法、及び製造方法
JP2013145808A (ja) * 2012-01-13 2013-07-25 Sharp Corp 剥離方法、液晶ディスプレイの製造方法、有機ｅｌディスプレイの製造方法、およびタッチパネルの製造方法
JP6126360B2 (ja) * 2012-11-26 2017-05-10 株式会社Ｓｃｒｅｅｎホールディングス 剥離補助方法
KR101977992B1 (ko) * 2012-12-14 2019-05-13 도레이첨단소재 주식회사 레이저 열전사용 도너 필름
JP2014120664A (ja) * 2012-12-18 2014-06-30 Dainippon Screen Mfg Co Ltd 剥離補助方法および剥離補助装置
CN103700662B (zh) * 2013-12-09 2017-02-15 京东方科技集团股份有限公司 一种承载基板和柔性显示器件制作方法
JP6354338B2 (ja) * 2014-05-30 2018-07-11 東レ株式会社 積層体、積層体の製造方法、及びこれを用いたフレキシブルデバイスの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210145418A (ko) * 2020-05-25 2021-12-02 한국생산기술연구원 Xfl 리프트 오프 장치

Also Published As

Publication number Publication date
TWI709998B (zh) 2020-11-11
JP2016219405A (ja) 2016-12-22
JP6718736B2 (ja) 2020-07-08
TW201709271A (zh) 2017-03-01

Similar Documents

Publication Publication Date Title
JP7514369B2 (ja) ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス
JP6996764B2 (ja) 積層体およびその製造方法および使用方法ならびにガラス基板積層用ポリイミド前駆体溶液
KR102302417B1 (ko) 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드 막, 적층체 및 플렉시블 디바이스, 그리고 폴리이미드 막의 제조 방법
JPWO2008013288A1 (ja) 耐熱性フィルム金属箔積層体、およびその製造方法
TWI709998B (zh) 耐熱性有機高分子層之剝離方法及可撓性佈線板之製造方法
CN112745676A (zh) 树脂组合物、树脂膜及覆金属层叠板
JP6537584B2 (ja) ガラス基板への塗工用溶液
CN106170178B (zh) 耐热性有机高分子层的剥离方法及柔性布线板的制造方法
JP2019172746A (ja) ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
CN113045895A (zh) 树脂组合物、树脂膜及覆金属层叠板
CN112745529A (zh) 二氧化硅粒子、树脂组合物、树脂膜及覆金属层叠板
JP2020164704A (ja) ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
JP6846148B2 (ja) ポリイミド前駆体溶液及びその製造方法並びにポリイミドフィルムの製造方法及び積層体の製造方法
JP7461626B2 (ja) ポリアミック酸溶液およびこれを用いた積層体の製造方法
KR20160088844A (ko) 저유전율을 갖는 폴리이미드 내열성 접착제 및 이를 이용한 연성 동박적층판
JP2015174379A (ja) 積層体
JP2021091753A (ja) ポリイミド基板の製造方法
KR101614596B1 (ko) 투명 프리프레그의 제조방법
TWI594670B (zh) 聚醯亞胺膜及其聚醯亞胺積層板
KR20240117105A (ko) 폴리이미드 필름, 고주파 회로 기판, 플렉시블 전자 디바이스 기판