KR20160093555A - 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 - Google Patents

표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20160093555A
KR20160093555A KR1020160010282A KR20160010282A KR20160093555A KR 20160093555 A KR20160093555 A KR 20160093555A KR 1020160010282 A KR1020160010282 A KR 1020160010282A KR 20160010282 A KR20160010282 A KR 20160010282A KR 20160093555 A KR20160093555 A KR 20160093555A
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KR
South Korea
Prior art keywords
copper foil
carrier
layer
average
resin
Prior art date
Application number
KR1020160010282A
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English (en)
Korean (ko)
Inventor
데루마사 모리야마
미치야 고히키
Original Assignee
제이엑스금속주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20160093555A publication Critical patent/KR20160093555A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020160010282A 2015-01-29 2016-01-27 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 KR20160093555A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015014867 2015-01-29
JPJP-P-2015-014867 2015-01-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180119042A Division KR20180114533A (ko) 2015-01-29 2018-10-05 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법

Publications (1)

Publication Number Publication Date
KR20160093555A true KR20160093555A (ko) 2016-08-08

Family

ID=56580531

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020160010282A KR20160093555A (ko) 2015-01-29 2016-01-27 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
KR1020180119042A KR20180114533A (ko) 2015-01-29 2018-10-05 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020180119042A KR20180114533A (ko) 2015-01-29 2018-10-05 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법

Country Status (4)

Country Link
JP (1) JP2016146477A (zh)
KR (2) KR20160093555A (zh)
CN (1) CN105835478B (zh)
TW (1) TWI659826B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7356209B2 (ja) 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN109587955A (zh) * 2018-12-13 2019-04-05 珠海精路电子有限公司 一种双侧线路基板的制作工艺
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
KR102429384B1 (ko) * 2021-07-02 2022-08-04 와이엠티 주식회사 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196863A (ja) 2004-12-14 2006-07-27 Mitsubishi Gas Chem Co Inc プリント配線板の製造法

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US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP4579705B2 (ja) * 2005-02-02 2010-11-10 日本製箔株式会社 クラッド材とその製造方法
JP2008047655A (ja) * 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
JP5654581B2 (ja) * 2010-05-07 2015-01-14 Jx日鉱日石金属株式会社 印刷回路用銅箔、銅張積層板、印刷回路基板、印刷回路及び電子機器
JP2011249511A (ja) * 2010-05-26 2011-12-08 Sumitomo Bakelite Co Ltd 金メッキ金属微細パターン付き基材の製造方法、金メッキ金属微細パターン付き基材、プリント配線板、インターポーザ及び半導体装置
JP5919303B2 (ja) * 2012-01-18 2016-05-18 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた銅張積層板
CN105142897B (zh) * 2013-03-29 2018-09-28 Jx日矿日石金属株式会社 附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法
WO2014196576A1 (ja) * 2013-06-04 2014-12-11 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法
JP5470493B1 (ja) * 2013-07-23 2014-04-16 Ｊｘ日鉱日石金属株式会社 樹脂基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
TWI577256B (zh) * 2013-07-24 2017-04-01 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、基材、樹脂基材、印刷配線板、覆銅積層板及印刷配線板之製造方法
JP5457594B2 (ja) * 2013-07-29 2014-04-02 Ｊｘ日鉱日石金属株式会社 プリント配線板用樹脂、プリント配線板、半導体パッケージ基板及びプリント配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196863A (ja) 2004-12-14 2006-07-27 Mitsubishi Gas Chem Co Inc プリント配線板の製造法

Also Published As

Publication number Publication date
CN105835478A (zh) 2016-08-10
TWI659826B (zh) 2019-05-21
KR20180114533A (ko) 2018-10-18
JP2016146477A (ja) 2016-08-12
CN105835478B (zh) 2019-08-09
TW201722717A (zh) 2017-07-01

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