JP2016146477A - 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法 - Google Patents

表面処理銅箔、キャリア付銅箔、基材、樹脂基材、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法 Download PDF

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Publication number
JP2016146477A
JP2016146477A JP2016016131A JP2016016131A JP2016146477A JP 2016146477 A JP2016146477 A JP 2016146477A JP 2016016131 A JP2016016131 A JP 2016016131A JP 2016016131 A JP2016016131 A JP 2016016131A JP 2016146477 A JP2016146477 A JP 2016146477A
Authority
JP
Japan
Prior art keywords
copper foil
resin
carrier
layer
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016016131A
Other languages
English (en)
Japanese (ja)
Inventor
晃正 森山
Akimasa Moriyama
晃正 森山
倫也 古曳
Michiya Kohiki
倫也 古曳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of JP2016146477A publication Critical patent/JP2016146477A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
JP2016016131A 2015-01-29 2016-01-29 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法 Pending JP2016146477A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015014867 2015-01-29
JP2015014867 2015-01-29

Publications (1)

Publication Number Publication Date
JP2016146477A true JP2016146477A (ja) 2016-08-12

Family

ID=56580531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016016131A Pending JP2016146477A (ja) 2015-01-29 2016-01-29 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法

Country Status (4)

Country Link
JP (1) JP2016146477A (zh)
KR (2) KR20160093555A (zh)
CN (1) CN105835478B (zh)
TW (1) TWI659826B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022215330A1 (ja) * 2021-04-09 2022-10-13 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7492808B2 (ja) 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7356209B2 (ja) 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN109587955A (zh) * 2018-12-13 2019-04-05 珠海精路电子有限公司 一种双侧线路基板的制作工艺
KR102429384B1 (ko) * 2021-07-02 2022-08-04 와이엠티 주식회사 캐리어박 부착 금속박, 이를 이용한 프린트 배선판용 적층체 및 이의 제조방법

Citations (2)

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JP5470493B1 (ja) * 2013-07-23 2014-04-16 Ｊｘ日鉱日石金属株式会社 樹脂基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
WO2014196576A1 (ja) * 2013-06-04 2014-12-11 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法

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US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP4740692B2 (ja) 2004-12-14 2011-08-03 三菱瓦斯化学株式会社 プリント配線板の製造法
JP4579705B2 (ja) * 2005-02-02 2010-11-10 日本製箔株式会社 クラッド材とその製造方法
JP2008047655A (ja) * 2006-08-11 2008-02-28 Mitsui Mining & Smelting Co Ltd 配線基板およびその製造方法
CN102884228B (zh) * 2010-05-07 2015-11-25 吉坤日矿日石金属株式会社 印刷电路用铜箔
JP2011249511A (ja) * 2010-05-26 2011-12-08 Sumitomo Bakelite Co Ltd 金メッキ金属微細パターン付き基材の製造方法、金メッキ金属微細パターン付き基材、プリント配線板、インターポーザ及び半導体装置
CN104053825B (zh) * 2012-01-18 2016-12-07 Jx日矿日石金属株式会社 表面处理铜箔及使用了它的覆铜板
WO2014157728A1 (ja) * 2013-03-29 2014-10-02 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
WO2015012376A1 (ja) * 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
JP5457594B2 (ja) * 2013-07-29 2014-04-02 Ｊｘ日鉱日石金属株式会社 プリント配線板用樹脂、プリント配線板、半導体パッケージ基板及びプリント配線板の製造方法

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WO2014196576A1 (ja) * 2013-06-04 2014-12-11 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法
JP5470493B1 (ja) * 2013-07-23 2014-04-16 Ｊｘ日鉱日石金属株式会社 樹脂基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022215330A1 (ja) * 2021-04-09 2022-10-13 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
JP2022161636A (ja) * 2021-04-09 2022-10-21 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
JP7273883B2 (ja) 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板

Also Published As

Publication number Publication date
KR20160093555A (ko) 2016-08-08
CN105835478B (zh) 2019-08-09
KR20180114533A (ko) 2018-10-18
CN105835478A (zh) 2016-08-10
TWI659826B (zh) 2019-05-21
TW201722717A (zh) 2017-07-01

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