KR20160052771A - 배선 회로, 배선 기판 및 배선 기판의 제조 방법 - Google Patents

배선 회로, 배선 기판 및 배선 기판의 제조 방법 Download PDF

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Publication number
KR20160052771A
KR20160052771A KR1020167010798A KR20167010798A KR20160052771A KR 20160052771 A KR20160052771 A KR 20160052771A KR 1020167010798 A KR1020167010798 A KR 1020167010798A KR 20167010798 A KR20167010798 A KR 20167010798A KR 20160052771 A KR20160052771 A KR 20160052771A
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KR
South Korea
Prior art keywords
electrode layer
via hole
insulating layer
wiring
layer
Prior art date
Application number
KR1020167010798A
Other languages
English (en)
Korean (ko)
Inventor
다꾸 나가노
다까히로 요시다
노부유끼 야나기다
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20160052771A publication Critical patent/KR20160052771A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020167010798A 2012-02-10 2012-12-26 배선 회로, 배선 기판 및 배선 기판의 제조 방법 KR20160052771A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012027382A JP2013165164A (ja) 2012-02-10 2012-02-10 配線回路、配線基板及び配線基板の製造方法
JPJP-P-2012-027382 2012-02-10
PCT/JP2012/008313 WO2013118229A1 (ja) 2012-02-10 2012-12-26 配線回路、配線基板及び配線基板の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147013491A Division KR20140079846A (ko) 2012-02-10 2012-12-26 배선 회로, 배선 기판 및 배선 기판의 제조 방법

Publications (1)

Publication Number Publication Date
KR20160052771A true KR20160052771A (ko) 2016-05-12

Family

ID=48947036

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167010798A KR20160052771A (ko) 2012-02-10 2012-12-26 배선 회로, 배선 기판 및 배선 기판의 제조 방법
KR1020147013491A KR20140079846A (ko) 2012-02-10 2012-12-26 배선 회로, 배선 기판 및 배선 기판의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147013491A KR20140079846A (ko) 2012-02-10 2012-12-26 배선 회로, 배선 기판 및 배선 기판의 제조 방법

Country Status (5)

Country Link
JP (1) JP2013165164A (ja)
KR (2) KR20160052771A (ja)
CN (1) CN103947307B (ja)
TW (1) TWI556292B (ja)
WO (1) WO2013118229A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111418120B (zh) 2017-12-04 2022-10-21 三菱电机株式会社 电场吸收型调制器、光半导体装置及光模块
CN108093561A (zh) * 2017-12-22 2018-05-29 珠海市航达科技有限公司 一种热电分离印制电路板的制作方法
JP6803415B2 (ja) * 2019-01-30 2020-12-23 Hoya株式会社 回路基板固定構造、及びこれを備える光照射装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138454A (ja) * 1998-10-29 2000-05-16 Kyocera Corp 配線基板の製造方法
JP3591818B2 (ja) * 1999-06-17 2004-11-24 京セラ株式会社 配線基板の製造方法
US20060163989A1 (en) * 2002-07-10 2006-07-27 Koji Kawaguchi Blue color filter, and organic electroluminescent device using the same
JP2004165343A (ja) * 2002-11-12 2004-06-10 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法
CN100569825C (zh) * 2004-07-15 2009-12-16 太阳油墨制造株式会社 光固化性·热固化性树脂组合物及其固化物
JPWO2008087890A1 (ja) * 2007-01-15 2010-05-06 太陽インキ製造株式会社 熱硬化性樹脂組成物
CN102209438B (zh) * 2010-10-29 2012-12-26 博罗县精汇电子科技有限公司 高密度柔性线路板及其制作方法

Also Published As

Publication number Publication date
JP2013165164A (ja) 2013-08-22
CN103947307A (zh) 2014-07-23
CN103947307B (zh) 2017-05-17
KR20140079846A (ko) 2014-06-27
TW201334044A (zh) 2013-08-16
WO2013118229A1 (ja) 2013-08-15
TWI556292B (zh) 2016-11-01

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