KR20160022760A - 취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체 - Google Patents

취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체 Download PDF

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Publication number
KR20160022760A
KR20160022760A KR1020150079948A KR20150079948A KR20160022760A KR 20160022760 A KR20160022760 A KR 20160022760A KR 1020150079948 A KR1020150079948 A KR 1020150079948A KR 20150079948 A KR20150079948 A KR 20150079948A KR 20160022760 A KR20160022760 A KR 20160022760A
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South Korea
Prior art keywords
brittle material
material substrate
substrate
dividing
adhesive film
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KR1020150079948A
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English (en)
Korean (ko)
Inventor
이치로 미야키
유이치 가네히라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20160022760A publication Critical patent/KR20160022760A/ko
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    • H01L21/78—
    • H01L21/6836—
    • H01L21/76—

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  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020150079948A 2014-08-20 2015-06-05 취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체 Withdrawn KR20160022760A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014167298A JP2016043503A (ja) 2014-08-20 2014-08-20 脆性材料基板の分断方法、脆性材料基板分断用の基板保持部材、および、脆性材料基板の分断時に使用する粘着フィルム張設用の枠体
JPJP-P-2014-167298 2014-08-20

Publications (1)

Publication Number Publication Date
KR20160022760A true KR20160022760A (ko) 2016-03-02

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KR1020150079948A Withdrawn KR20160022760A (ko) 2014-08-20 2015-06-05 취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체

Country Status (4)

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JP (1) JP2016043503A (https=)
KR (1) KR20160022760A (https=)
CN (1) CN105382945A (https=)
TW (1) TWI644774B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2955007T3 (es) 2016-01-29 2023-11-28 Kaneka Corp Uso de alantoína para potenciar la resistencia a altas temperaturas en plantas
DE102017201154B4 (de) * 2017-01-25 2025-02-27 Disco Corporation Verfahren zum Bearbeiten eines Wafers und Waferbearbeitungssystem
JP2020151929A (ja) 2019-03-20 2020-09-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置およびブレイク方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014083821A (ja) 2012-10-26 2014-05-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法並びに分断装置

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JPS4989475A (https=) * 1972-12-27 1974-08-27
JP2000306864A (ja) * 1999-04-22 2000-11-02 Apic Yamada Corp 短冊ワークダイシング用フィルム取付フレーム
JP2004026539A (ja) * 2002-06-24 2004-01-29 Nakamura Tome Precision Ind Co Ltd ガラス基板の割断加工方法及びその装置
JP2006173269A (ja) * 2004-12-14 2006-06-29 Hamamatsu Photonics Kk 基板加工方法及びフィルム伸張装置
JP4589201B2 (ja) * 2005-08-23 2010-12-01 株式会社ディスコ 基板の切削装置
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
JP5121746B2 (ja) * 2009-01-29 2013-01-16 昭和電工株式会社 基板切断方法および電子素子の製造方法
JP5182339B2 (ja) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014083821A (ja) 2012-10-26 2014-05-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法並びに分断装置

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Publication number Publication date
JP2016043503A (ja) 2016-04-04
TW201607713A (zh) 2016-03-01
TWI644774B (zh) 2018-12-21
CN105382945A (zh) 2016-03-09

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