CN105382945A - 脆性材料基板的分断方法、基板保持构件及框体 - Google Patents

脆性材料基板的分断方法、基板保持构件及框体 Download PDF

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Publication number
CN105382945A
CN105382945A CN201510417153.0A CN201510417153A CN105382945A CN 105382945 A CN105382945 A CN 105382945A CN 201510417153 A CN201510417153 A CN 201510417153A CN 105382945 A CN105382945 A CN 105382945A
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China
Prior art keywords
brittle substrate
substrate
disjunction
framework
brittle
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Pending
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CN201510417153.0A
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English (en)
Chinese (zh)
Inventor
宫木一郎
金平雄一
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN105382945A publication Critical patent/CN105382945A/zh
Pending legal-status Critical Current

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  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201510417153.0A 2014-08-20 2015-07-15 脆性材料基板的分断方法、基板保持构件及框体 Pending CN105382945A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014167298A JP2016043503A (ja) 2014-08-20 2014-08-20 脆性材料基板の分断方法、脆性材料基板分断用の基板保持部材、および、脆性材料基板の分断時に使用する粘着フィルム張設用の枠体
JP2014-167298 2014-08-20

Publications (1)

Publication Number Publication Date
CN105382945A true CN105382945A (zh) 2016-03-09

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CN201510417153.0A Pending CN105382945A (zh) 2014-08-20 2015-07-15 脆性材料基板的分断方法、基板保持构件及框体

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JP (1) JP2016043503A (https=)
KR (1) KR20160022760A (https=)
CN (1) CN105382945A (https=)
TW (1) TWI644774B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2955007T3 (es) 2016-01-29 2023-11-28 Kaneka Corp Uso de alantoína para potenciar la resistencia a altas temperaturas en plantas
DE102017201154B4 (de) * 2017-01-25 2025-02-27 Disco Corporation Verfahren zum Bearbeiten eines Wafers und Waferbearbeitungssystem
JP2020151929A (ja) 2019-03-20 2020-09-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置およびブレイク方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004026539A (ja) * 2002-06-24 2004-01-29 Nakamura Tome Precision Ind Co Ltd ガラス基板の割断加工方法及びその装置
WO2006064714A1 (ja) * 2004-12-14 2006-06-22 Hamamatsu Photonics K.K. 基板加工方法及びフィルム伸張装置
JP2007059526A (ja) * 2005-08-23 2007-03-08 Disco Abrasive Syst Ltd 基板の切削方法
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
JP2012051120A (ja) * 2010-08-31 2012-03-15 Mitsuboshi Diamond Industrial Co Ltd 保持装置および基板ブレーク装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
CN103786267A (zh) * 2012-10-26 2014-05-14 三星钻石工业股份有限公司 脆性材料基板的分断方法与分断装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4989475A (https=) * 1972-12-27 1974-08-27
JP2000306864A (ja) * 1999-04-22 2000-11-02 Apic Yamada Corp 短冊ワークダイシング用フィルム取付フレーム
JP5121746B2 (ja) * 2009-01-29 2013-01-16 昭和電工株式会社 基板切断方法および電子素子の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004026539A (ja) * 2002-06-24 2004-01-29 Nakamura Tome Precision Ind Co Ltd ガラス基板の割断加工方法及びその装置
WO2006064714A1 (ja) * 2004-12-14 2006-06-22 Hamamatsu Photonics K.K. 基板加工方法及びフィルム伸張装置
JP2007059526A (ja) * 2005-08-23 2007-03-08 Disco Abrasive Syst Ltd 基板の切削方法
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
JP2012051120A (ja) * 2010-08-31 2012-03-15 Mitsuboshi Diamond Industrial Co Ltd 保持装置および基板ブレーク装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
CN103786267A (zh) * 2012-10-26 2014-05-14 三星钻石工业股份有限公司 脆性材料基板的分断方法与分断装置

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Publication number Publication date
KR20160022760A (ko) 2016-03-02
JP2016043503A (ja) 2016-04-04
TW201607713A (zh) 2016-03-01
TWI644774B (zh) 2018-12-21

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Application publication date: 20160309