KR20150139628A - 하프늄과 지르코늄계 전구체를 이용한 원자층 증착에 의한 박막의 제조 방법 - Google Patents
하프늄과 지르코늄계 전구체를 이용한 원자층 증착에 의한 박막의 제조 방법 Download PDFInfo
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- KR20150139628A KR20150139628A KR1020157033746A KR20157033746A KR20150139628A KR 20150139628 A KR20150139628 A KR 20150139628A KR 1020157033746 A KR1020157033746 A KR 1020157033746A KR 20157033746 A KR20157033746 A KR 20157033746A KR 20150139628 A KR20150139628 A KR 20150139628A
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- precursors
- ald
- metal
- precursor
- hafnium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97245107P | 2007-09-14 | 2007-09-14 | |
| US60/972,451 | 2007-09-14 | ||
| PCT/US2008/075831 WO2009036046A1 (en) | 2007-09-14 | 2008-09-10 | Methods of preparing thin films by atomic layer deposition using monocyclopentadienyl trialkoxy hafnium and zirconium precursors |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107008048A Division KR20100072021A (ko) | 2007-09-14 | 2008-09-10 | 하프늄과 지르코늄계 전구체를 이용한 원자층 증착에 의한 박막의 제조 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150139628A true KR20150139628A (ko) | 2015-12-11 |
Family
ID=40070699
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157033746A Ceased KR20150139628A (ko) | 2007-09-14 | 2008-09-10 | 하프늄과 지르코늄계 전구체를 이용한 원자층 증착에 의한 박막의 제조 방법 |
| KR1020107008048A Ceased KR20100072021A (ko) | 2007-09-14 | 2008-09-10 | 하프늄과 지르코늄계 전구체를 이용한 원자층 증착에 의한 박막의 제조 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107008048A Ceased KR20100072021A (ko) | 2007-09-14 | 2008-09-10 | 하프늄과 지르코늄계 전구체를 이용한 원자층 증착에 의한 박막의 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8039062B2 (https=) |
| EP (1) | EP2191034B1 (https=) |
| JP (1) | JP2010539710A (https=) |
| KR (2) | KR20150139628A (https=) |
| CN (2) | CN101815807B (https=) |
| TW (1) | TWI464290B (https=) |
| WO (1) | WO2009036046A1 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017135715A1 (ko) * | 2016-02-03 | 2017-08-10 | 주식회사 유피케미칼 | 4 족 금속 원소-함유 화합물, 이의 제조 방법, 이를 포함하는 막 증착용 전구체 조성물, 및 이를 이용하는 막의 증착 방법 |
| WO2022245039A1 (ko) * | 2021-05-21 | 2022-11-24 | 주식회사 아이켐스 | 신규한 하프늄 함유 화합물, 이를 함유하는 하프늄 전구체 조성물, 상기 하프늄 전구체 조성물을 이용한 하프늄 함유 박막 및 이의 제조방법. |
| WO2023219446A1 (ko) * | 2022-05-13 | 2023-11-16 | 주식회사 유피케미칼 | 4족 금속 원소-함유 전구체 화합물을 포함하는 막 증착용 조성물, 및 이를 이용한 막 형성 방법 |
| WO2024050011A1 (en) * | 2022-09-02 | 2024-03-07 | Entegris, Inc. | Precursors containing fluorinated alkoxides and amides |
| KR102855353B1 (ko) * | 2024-12-27 | 2025-09-08 | 주식회사 티에스피 | 풀벤계 박막 형성 전구체 |
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| GB2432363B (en) | 2005-11-16 | 2010-06-23 | Epichem Ltd | Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition |
| EP2049705A4 (en) * | 2006-07-20 | 2014-10-29 | Linde Inc | IMPROVED METHODS FOR DEPOSITION OF ATOMIC LAYERS |
| US8795771B2 (en) | 2006-10-27 | 2014-08-05 | Sean T. Barry | ALD of metal-containing films using cyclopentadienyl compounds |
| TWI425110B (zh) | 2007-07-24 | 2014-02-01 | 辛格瑪艾瑞契公司 | 以化學相沉積法製造含金屬薄膜之方法 |
| TWI382987B (zh) * | 2007-07-24 | 2013-01-21 | Sigma Aldrich Co | 應用於化學相沉積製程的有機金屬前驅物 |
| CN101827956A (zh) | 2007-09-14 | 2010-09-08 | 西格玛-奥吉奇公司 | 采用基于单环戊二烯基钛的前体通过原子层沉积制备含钛薄膜的方法 |
| EP2191034B1 (en) | 2007-09-14 | 2013-03-13 | Sigma-Aldrich Co. LLC | Methods of preparing thin films by atomic layer deposition using monocyclopentadienyl triamino zirconium precursors |
| CN101959897A (zh) | 2008-02-27 | 2011-01-26 | 乔治洛德方法研究和开发液化空气有限公司 | 使用原子层沉积(ald)法在基底上形成含钛层的方法 |
| TW200949939A (en) * | 2008-05-23 | 2009-12-01 | Sigma Aldrich Co | High-k dielectric films and methods of producing using titanium-based β -diketonate precursors |
| TWI467045B (zh) | 2008-05-23 | 2015-01-01 | Sigma Aldrich Co | 高介電常數電介質薄膜與使用鈰基前驅物製造高介電常數電介質薄膜之方法 |
| US20100290968A1 (en) * | 2009-05-13 | 2010-11-18 | Ce Ma | Solution based lanthanide and group iii precursors for atomic layer deposition |
| WO2011005653A1 (en) * | 2009-07-06 | 2011-01-13 | Llinde Aktiengesellschaft | Solution based precursors |
| SG178267A1 (en) | 2009-08-07 | 2012-03-29 | Sigma Aldrich Co Llc | High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films |
| CN102712662A (zh) * | 2009-08-14 | 2012-10-03 | 乔治洛德方法研究和开发液化空气有限公司 | 含铪和锆的前体及使用它的方法 |
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| JP5957017B2 (ja) | 2011-03-15 | 2016-07-27 | メカロニックス シーオー. エルティディ.Mecharonics Co. Ltd. | 新規な4b族有機金属化合物及びその製造方法 |
| KR101263454B1 (ko) | 2011-03-15 | 2013-11-27 | 주식회사 메카로닉스 | 지르코늄 금속을 함유하는 신규한 유기금속화합물 및 그 제조방법 |
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| JP5675458B2 (ja) * | 2011-03-25 | 2015-02-25 | 東京エレクトロン株式会社 | 成膜方法、成膜装置および記憶媒体 |
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- 2008-09-10 WO PCT/US2008/075831 patent/WO2009036046A1/en not_active Ceased
- 2008-09-10 US US12/207,968 patent/US8039062B2/en active Active
- 2008-09-10 KR KR1020157033746A patent/KR20150139628A/ko not_active Ceased
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- 2008-09-10 JP JP2010524955A patent/JP2010539710A/ja active Pending
- 2008-09-10 KR KR1020107008048A patent/KR20100072021A/ko not_active Ceased
- 2008-09-10 CN CN201110448392.4A patent/CN103147062A/zh active Pending
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| WO2017135715A1 (ko) * | 2016-02-03 | 2017-08-10 | 주식회사 유피케미칼 | 4 족 금속 원소-함유 화합물, 이의 제조 방법, 이를 포함하는 막 증착용 전구체 조성물, 및 이를 이용하는 막의 증착 방법 |
| US10005795B1 (en) | 2016-02-03 | 2018-06-26 | Up Chemical Co., Ltd. | Group 4 metal element-containing compound, method of preparing the same, precursor composition including the same for depositing film, and method of depositing film using the same |
| WO2022245039A1 (ko) * | 2021-05-21 | 2022-11-24 | 주식회사 아이켐스 | 신규한 하프늄 함유 화합물, 이를 함유하는 하프늄 전구체 조성물, 상기 하프늄 전구체 조성물을 이용한 하프늄 함유 박막 및 이의 제조방법. |
| WO2023219446A1 (ko) * | 2022-05-13 | 2023-11-16 | 주식회사 유피케미칼 | 4족 금속 원소-함유 전구체 화합물을 포함하는 막 증착용 조성물, 및 이를 이용한 막 형성 방법 |
| JP2025515587A (ja) * | 2022-05-13 | 2025-05-20 | ユーピー ケミカル カンパニー リミテッド | 第4族金属元素含有前駆体化合物を含む成膜用組成物、及び、それを用いた膜を形成する方法 |
| WO2024050011A1 (en) * | 2022-09-02 | 2024-03-07 | Entegris, Inc. | Precursors containing fluorinated alkoxides and amides |
| KR102855353B1 (ko) * | 2024-12-27 | 2025-09-08 | 주식회사 티에스피 | 풀벤계 박막 형성 전구체 |
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| WO2009036046A1 (en) | 2009-03-19 |
| EP2191034B1 (en) | 2013-03-13 |
| US8039062B2 (en) | 2011-10-18 |
| US20090081385A1 (en) | 2009-03-26 |
| KR20100072021A (ko) | 2010-06-29 |
| TWI464290B (zh) | 2014-12-11 |
| TW200912024A (en) | 2009-03-16 |
| EP2191034A1 (en) | 2010-06-02 |
| CN101815807A (zh) | 2010-08-25 |
| JP2010539710A (ja) | 2010-12-16 |
| CN103147062A (zh) | 2013-06-12 |
| CN101815807B (zh) | 2012-06-13 |
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