TWI464290B - 利用含鉿與含鋯前驅物以原子層沉積製備薄膜之方法 - Google Patents
利用含鉿與含鋯前驅物以原子層沉積製備薄膜之方法 Download PDFInfo
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- TWI464290B TWI464290B TW097134790A TW97134790A TWI464290B TW I464290 B TWI464290 B TW I464290B TW 097134790 A TW097134790 A TW 097134790A TW 97134790 A TW97134790 A TW 97134790A TW I464290 B TWI464290 B TW I464290B
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- zirconium
- precursor
- butoxy
- atomic layer
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97245107P | 2007-09-14 | 2007-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200912024A TW200912024A (en) | 2009-03-16 |
| TWI464290B true TWI464290B (zh) | 2014-12-11 |
Family
ID=40070699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097134790A TWI464290B (zh) | 2007-09-14 | 2008-09-11 | 利用含鉿與含鋯前驅物以原子層沉積製備薄膜之方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8039062B2 (https=) |
| EP (1) | EP2191034B1 (https=) |
| JP (1) | JP2010539710A (https=) |
| KR (2) | KR20150139628A (https=) |
| CN (2) | CN101815807B (https=) |
| TW (1) | TWI464290B (https=) |
| WO (1) | WO2009036046A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI883111B (zh) * | 2020-02-04 | 2025-05-11 | 德商馬克專利公司 | 選擇性形成含金屬膜之方法 |
Families Citing this family (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2432363B (en) | 2005-11-16 | 2010-06-23 | Epichem Ltd | Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition |
| EP2049705A4 (en) * | 2006-07-20 | 2014-10-29 | Linde Inc | IMPROVED METHODS FOR DEPOSITION OF ATOMIC LAYERS |
| US8795771B2 (en) | 2006-10-27 | 2014-08-05 | Sean T. Barry | ALD of metal-containing films using cyclopentadienyl compounds |
| TWI425110B (zh) | 2007-07-24 | 2014-02-01 | 辛格瑪艾瑞契公司 | 以化學相沉積法製造含金屬薄膜之方法 |
| TWI382987B (zh) * | 2007-07-24 | 2013-01-21 | Sigma Aldrich Co | 應用於化學相沉積製程的有機金屬前驅物 |
| CN101827956A (zh) | 2007-09-14 | 2010-09-08 | 西格玛-奥吉奇公司 | 采用基于单环戊二烯基钛的前体通过原子层沉积制备含钛薄膜的方法 |
| EP2191034B1 (en) | 2007-09-14 | 2013-03-13 | Sigma-Aldrich Co. LLC | Methods of preparing thin films by atomic layer deposition using monocyclopentadienyl triamino zirconium precursors |
| CN101959897A (zh) | 2008-02-27 | 2011-01-26 | 乔治洛德方法研究和开发液化空气有限公司 | 使用原子层沉积(ald)法在基底上形成含钛层的方法 |
| TW200949939A (en) * | 2008-05-23 | 2009-12-01 | Sigma Aldrich Co | High-k dielectric films and methods of producing using titanium-based β -diketonate precursors |
| TWI467045B (zh) | 2008-05-23 | 2015-01-01 | Sigma Aldrich Co | 高介電常數電介質薄膜與使用鈰基前驅物製造高介電常數電介質薄膜之方法 |
| US20100290968A1 (en) * | 2009-05-13 | 2010-11-18 | Ce Ma | Solution based lanthanide and group iii precursors for atomic layer deposition |
| WO2011005653A1 (en) * | 2009-07-06 | 2011-01-13 | Llinde Aktiengesellschaft | Solution based precursors |
| SG178267A1 (en) | 2009-08-07 | 2012-03-29 | Sigma Aldrich Co Llc | High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films |
| CN102712662A (zh) * | 2009-08-14 | 2012-10-03 | 乔治洛德方法研究和开发液化空气有限公司 | 含铪和锆的前体及使用它的方法 |
| US8592606B2 (en) | 2009-12-07 | 2013-11-26 | Air Products And Chemicals, Inc. | Liquid precursor for depositing group 4 metal containing films |
| TWI509695B (zh) | 2010-06-10 | 2015-11-21 | Asm國際股份有限公司 | 使膜選擇性沈積於基板上的方法 |
| SG187920A1 (en) | 2010-08-27 | 2013-03-28 | Sigma Aldrich Co Llc | Molybdenum (iv) amide precursors and use thereof in atomic layer deposition |
| JP5957017B2 (ja) | 2011-03-15 | 2016-07-27 | メカロニックス シーオー. エルティディ.Mecharonics Co. Ltd. | 新規な4b族有機金属化合物及びその製造方法 |
| KR101263454B1 (ko) | 2011-03-15 | 2013-11-27 | 주식회사 메카로닉스 | 지르코늄 금속을 함유하는 신규한 유기금속화합물 및 그 제조방법 |
| KR101395644B1 (ko) * | 2012-02-08 | 2014-05-16 | 주식회사 메카로닉스 | 신규한 4-비이 족 금속 유기화합물 및 그 제조방법 |
| JP5675458B2 (ja) * | 2011-03-25 | 2015-02-25 | 東京エレクトロン株式会社 | 成膜方法、成膜装置および記憶媒体 |
| JP5732962B2 (ja) * | 2011-03-28 | 2015-06-10 | 宇部興産株式会社 | ジルコニウムアミド化合物の製造方法 |
| US8927748B2 (en) | 2011-08-12 | 2015-01-06 | Sigma-Aldrich Co. Llc | Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films |
| US9112003B2 (en) | 2011-12-09 | 2015-08-18 | Asm International N.V. | Selective formation of metallic films on metallic surfaces |
| WO2013112383A1 (en) | 2012-01-26 | 2013-08-01 | Sigma-Aldrich Co. Llc | Molybdenum allyl complexes and use thereof in thin film deposition |
| WO2013157901A1 (ko) * | 2012-04-20 | 2013-10-24 | 주식회사 유피케미칼 | 4 족 전이금속-함유 전구체 화합물, 이의 제조 방법, 이를 포함하는 전구체 조성물, 및 이를 이용하는 박막의 증착 방법 |
| KR20140121761A (ko) * | 2013-04-08 | 2014-10-16 | 주식회사 유피케미칼 | 4 족 전이금속-함유 전구체 화합물 및 이를 이용하는 박막의 증착 방법 |
| US9895715B2 (en) | 2014-02-04 | 2018-02-20 | Asm Ip Holding B.V. | Selective deposition of metals, metal oxides, and dielectrics |
| KR102008445B1 (ko) * | 2014-02-26 | 2019-08-08 | 주식회사 유진테크 머티리얼즈 | 지르코늄 함유막 형성용 전구체 조성물 및 이를 이용한 지르코늄 함유막 형성 방법 |
| US10047435B2 (en) | 2014-04-16 | 2018-08-14 | Asm Ip Holding B.V. | Dual selective deposition |
| KR101569447B1 (ko) | 2014-04-29 | 2015-11-16 | (주)디엔에프 | 지르코늄 산화물 박막 형성용 전구체 화합물, 이의 제조방법 및 이를 이용한 박막의 제조방법 |
| US9499571B2 (en) * | 2014-12-23 | 2016-11-22 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Germanium- and zirconium-containing compositions for vapor deposition of zirconium-containing films |
| US9663547B2 (en) * | 2014-12-23 | 2017-05-30 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Silicon- and Zirconium-containing compositions for vapor deposition of Zirconium-containing films |
| US9490145B2 (en) | 2015-02-23 | 2016-11-08 | Asm Ip Holding B.V. | Removal of surface passivation |
| KR102147190B1 (ko) * | 2015-03-20 | 2020-08-25 | 에스케이하이닉스 주식회사 | 막형성조성물 및 그를 이용한 박막 제조 방법 |
| US10428421B2 (en) | 2015-08-03 | 2019-10-01 | Asm Ip Holding B.V. | Selective deposition on metal or metallic surfaces relative to dielectric surfaces |
| US10566185B2 (en) | 2015-08-05 | 2020-02-18 | Asm Ip Holding B.V. | Selective deposition of aluminum and nitrogen containing material |
| US10121699B2 (en) | 2015-08-05 | 2018-11-06 | Asm Ip Holding B.V. | Selective deposition of aluminum and nitrogen containing material |
| US10343186B2 (en) | 2015-10-09 | 2019-07-09 | Asm Ip Holding B.V. | Vapor phase deposition of organic films |
| US10814349B2 (en) | 2015-10-09 | 2020-10-27 | Asm Ip Holding B.V. | Vapor phase deposition of organic films |
| US10695794B2 (en) | 2015-10-09 | 2020-06-30 | Asm Ip Holding B.V. | Vapor phase deposition of organic films |
| KR101806987B1 (ko) * | 2016-02-03 | 2017-12-08 | 주식회사 유피케미칼 | 4 족 금속 원소-함유 화합물, 이의 제조 방법, 이를 포함하는 막 증착용 전구체 조성물, 및 이를 이용하는 막의 증착 방법 |
| US9981286B2 (en) | 2016-03-08 | 2018-05-29 | Asm Ip Holding B.V. | Selective formation of metal silicides |
| WO2017184357A1 (en) | 2016-04-18 | 2017-10-26 | Asm Ip Holding B.V. | Method of forming a directed self-assembled layer on a substrate |
| US10204782B2 (en) | 2016-04-18 | 2019-02-12 | Imec Vzw | Combined anneal and selective deposition process |
| KR20170123221A (ko) * | 2016-04-28 | 2017-11-07 | 주식회사 유진테크 머티리얼즈 | 박막 증착 방법 |
| US11081342B2 (en) | 2016-05-05 | 2021-08-03 | Asm Ip Holding B.V. | Selective deposition using hydrophobic precursors |
| US10453701B2 (en) | 2016-06-01 | 2019-10-22 | Asm Ip Holding B.V. | Deposition of organic films |
| US10373820B2 (en) | 2016-06-01 | 2019-08-06 | Asm Ip Holding B.V. | Deposition of organic films |
| US10014212B2 (en) | 2016-06-08 | 2018-07-03 | Asm Ip Holding B.V. | Selective deposition of metallic films |
| US9803277B1 (en) | 2016-06-08 | 2017-10-31 | Asm Ip Holding B.V. | Reaction chamber passivation and selective deposition of metallic films |
| US10106568B2 (en) | 2016-10-28 | 2018-10-23 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Hafnium-containing film forming compositions for vapor deposition of hafnium-containing films |
| US11430656B2 (en) | 2016-11-29 | 2022-08-30 | Asm Ip Holding B.V. | Deposition of oxide thin films |
| US10337104B2 (en) | 2016-12-30 | 2019-07-02 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Zirconium, hafnium, titanium precursors and deposition of group 4 containing films using the same |
| US10364259B2 (en) * | 2016-12-30 | 2019-07-30 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Zirconium, hafnium, titanium precursors and deposition of group 4 containing films using the same |
| US10465289B2 (en) * | 2016-12-30 | 2019-11-05 | L'Air Liquide, Société Anonyme pour l'Etude at l'Exploitation des Procédés Georges Claude | Zirconium, hafnium, titanium precursors and deposition of group 4 containing films using the same |
| US11094535B2 (en) | 2017-02-14 | 2021-08-17 | Asm Ip Holding B.V. | Selective passivation and selective deposition |
| US11501965B2 (en) | 2017-05-05 | 2022-11-15 | Asm Ip Holding B.V. | Plasma enhanced deposition processes for controlled formation of metal oxide thin films |
| JP7183187B2 (ja) | 2017-05-16 | 2022-12-05 | エーエスエム アイピー ホールディング ビー.ブイ. | 誘電体上の酸化物の選択的peald |
| JP6948159B2 (ja) * | 2017-05-31 | 2021-10-13 | 株式会社Adeka | 新規な化合物、薄膜形成用原料及び薄膜の製造方法 |
| US10900120B2 (en) | 2017-07-14 | 2021-01-26 | Asm Ip Holding B.V. | Passivation against vapor deposition |
| WO2019156451A1 (ko) * | 2018-02-07 | 2019-08-15 | 주식회사 유피케미칼 | 4 족 금속 원소-함유 화합물, 이의 제조 방법, 이를 포함하는 막 형성용 전구체 조성물, 및 이를 이용하는 막의 형성 방법 |
| CN111655899A (zh) | 2018-02-12 | 2020-09-11 | 默克专利有限公司 | 使用无氧共反应物气相沉积钌的方法 |
| JP7146690B2 (ja) | 2018-05-02 | 2022-10-04 | エーエスエム アイピー ホールディング ビー.ブイ. | 堆積および除去を使用した選択的層形成 |
| KR102080218B1 (ko) * | 2018-08-27 | 2020-02-21 | (주)원익머트리얼즈 | 이중치환 사이클로펜타디엔 화합물, 유기금속 화합물 및 그 제조방법 |
| US12482648B2 (en) | 2018-10-02 | 2025-11-25 | Asm Ip Holding B.V. | Selective passivation and selective deposition |
| JP2020056104A (ja) | 2018-10-02 | 2020-04-09 | エーエスエム アイピー ホールディング ビー.ブイ. | 選択的パッシベーションおよび選択的堆積 |
| KR102471126B1 (ko) * | 2019-02-01 | 2022-11-28 | 주식회사 유피케미칼 | 4 족 금속 원소-함유 화합물, 이의 제조 방법, 이를 포함하는 막 형성용 전구체 조성물, 및 이를 이용하는 막의 형성 방법 |
| US11965238B2 (en) | 2019-04-12 | 2024-04-23 | Asm Ip Holding B.V. | Selective deposition of metal oxides on metal surfaces |
| US11139163B2 (en) | 2019-10-31 | 2021-10-05 | Asm Ip Holding B.V. | Selective deposition of SiOC thin films |
| KR102853690B1 (ko) * | 2019-12-02 | 2025-09-02 | 솔브레인 주식회사 | 박막 형성용 성장 억제제, 이를 이용한 박막 형성 방법 및 이로부터 제조된 반도체 기판 |
| TWI865747B (zh) | 2020-03-30 | 2024-12-11 | 荷蘭商Asm Ip私人控股有限公司 | 在兩不同表面上同時選擇性沉積兩不同材料 |
| TWI862807B (zh) | 2020-03-30 | 2024-11-21 | 荷蘭商Asm Ip私人控股有限公司 | 相對於金屬表面在介電表面上之氧化矽的選擇性沉積 |
| TW202140832A (zh) | 2020-03-30 | 2021-11-01 | 荷蘭商Asm Ip私人控股有限公司 | 氧化矽在金屬表面上之選擇性沉積 |
| KR102562274B1 (ko) | 2020-12-17 | 2023-08-01 | 주식회사 이지티엠 | 유기 금속 전구체 화합물 |
| KR20220157741A (ko) * | 2021-05-21 | 2022-11-29 | 주식회사 아이켐스 | 신규한 하프늄 함유 화합물, 이를 함유하는 하프늄 전구체 조성물, 상기 하프늄 전구체 조성물을 이용한 하프늄 함유 박막 및 이의 제조방법. |
| WO2023219446A1 (ko) * | 2022-05-13 | 2023-11-16 | 주식회사 유피케미칼 | 4족 금속 원소-함유 전구체 화합물을 포함하는 막 증착용 조성물, 및 이를 이용한 막 형성 방법 |
| CN119948037A (zh) * | 2022-09-02 | 2025-05-06 | 恩特格里斯公司 | 含有氟化烷氧化物和酰胺的前体 |
| KR20250017860A (ko) * | 2023-07-28 | 2025-02-04 | 에스케이트리켐 주식회사 | 금속-규소 함유 박막 형성용 전구체, 이를 이용한 박막 증착 방법, 및 상기 박막을 포함하는 반도체 소자. |
| CN117660926A (zh) * | 2023-12-07 | 2024-03-08 | 江苏雅克科技股份有限公司 | 一种基于新型前驱体材料的氧化锆薄膜制备方法 |
| CN117626218A (zh) * | 2023-12-08 | 2024-03-01 | 江苏雅克科技股份有限公司 | 一种基于原子层沉积的ZrxHf(1-x)O2薄膜的制备方法 |
| KR102855353B1 (ko) * | 2024-12-27 | 2025-09-08 | 주식회사 티에스피 | 풀벤계 박막 형성 전구체 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006131751A1 (en) * | 2005-11-16 | 2006-12-14 | Sigma-Aldrich Co. | Cyclopentadienyl type hafnium and zirconium precursors and use thereof in atomic layer deposition |
| WO2007066546A1 (ja) * | 2005-12-06 | 2007-06-14 | Tri Chemical Laboratories Inc. | ハフニウム系化合物、ハフニウム系薄膜形成材料、及びハフニウム系薄膜形成方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07107190B2 (ja) | 1984-03-30 | 1995-11-15 | キヤノン株式会社 | 光化学気相成長方法 |
| JPH02167334A (ja) * | 1988-09-05 | 1990-06-27 | Idemitsu Kosan Co Ltd | 重合体の製造法 |
| JP2908819B2 (ja) * | 1989-09-21 | 1999-06-21 | 出光興産株式会社 | アリールスチレン系重合体およびその製造方法 |
| US5393564A (en) | 1993-05-14 | 1995-02-28 | Micron Semiconductor, Inc. | High efficiency method for performing a chemical vapor deposition utilizing a nonvolatile precursor |
| ATE185141T1 (de) | 1995-07-12 | 1999-10-15 | Witco Gmbh | Verfahren zur herstellung von cyclopentadienyltitantrialkoxy-derivaten |
| US7192892B2 (en) * | 2003-03-04 | 2007-03-20 | Micron Technology, Inc. | Atomic layer deposited dielectric layers |
| US20040198069A1 (en) * | 2003-04-04 | 2004-10-07 | Applied Materials, Inc. | Method for hafnium nitride deposition |
| JP2005171291A (ja) | 2003-12-09 | 2005-06-30 | Tosoh Corp | チタン含有薄膜およびその製造方法 |
| CN1898192A (zh) | 2003-12-25 | 2007-01-17 | 株式会社艾迪科 | 金属化合物、薄膜形成用原料及薄膜的制造方法 |
| US7091129B2 (en) * | 2003-12-30 | 2006-08-15 | Intel Corporation | Atomic layer deposition using photo-enhanced bond reconfiguration |
| US7514119B2 (en) * | 2005-04-29 | 2009-04-07 | Linde, Inc. | Method and apparatus for using solution based precursors for atomic layer deposition |
| KR100716652B1 (ko) * | 2005-04-30 | 2007-05-09 | 주식회사 하이닉스반도체 | 나노컴포지트 유전막을 갖는 캐패시터 및 그의 제조 방법 |
| EP2029790A1 (en) | 2006-06-02 | 2009-03-04 | L'AIR LIQUIDE, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Method of forming high-k dielectric films based on novel titanium, zirconium, and hafnium precursors and their use for semiconductor manufacturing |
| KR100852234B1 (ko) | 2006-11-17 | 2008-08-13 | 삼성전자주식회사 | 금속 산화막의 형성 방법, 이를 이용한 게이트 구조물의제조 방법 및 커패시터의 제조 방법 |
| US20080274615A1 (en) * | 2007-05-02 | 2008-11-06 | Vaartstra Brian A | Atomic Layer Deposition Methods, Methods of Forming Dielectric Materials, Methods of Forming Capacitors, And Methods of Forming DRAM Unit Cells |
| KR20080101040A (ko) | 2007-05-15 | 2008-11-21 | 주식회사 유피케미칼 | 금속 박막 또는 세라믹 박막 증착용 유기 금속 전구체화합물 및 이를 이용한 박막 증착 방법 |
| EP2191034B1 (en) | 2007-09-14 | 2013-03-13 | Sigma-Aldrich Co. LLC | Methods of preparing thin films by atomic layer deposition using monocyclopentadienyl triamino zirconium precursors |
| CN101827956A (zh) | 2007-09-14 | 2010-09-08 | 西格玛-奥吉奇公司 | 采用基于单环戊二烯基钛的前体通过原子层沉积制备含钛薄膜的方法 |
| CN101959897A (zh) | 2008-02-27 | 2011-01-26 | 乔治洛德方法研究和开发液化空气有限公司 | 使用原子层沉积(ald)法在基底上形成含钛层的方法 |
-
2008
- 2008-09-10 EP EP08799401A patent/EP2191034B1/en not_active Not-in-force
- 2008-09-10 WO PCT/US2008/075831 patent/WO2009036046A1/en not_active Ceased
- 2008-09-10 US US12/207,968 patent/US8039062B2/en active Active
- 2008-09-10 KR KR1020157033746A patent/KR20150139628A/ko not_active Ceased
- 2008-09-10 CN CN2008801068593A patent/CN101815807B/zh active Active
- 2008-09-10 JP JP2010524955A patent/JP2010539710A/ja active Pending
- 2008-09-10 KR KR1020107008048A patent/KR20100072021A/ko not_active Ceased
- 2008-09-10 CN CN201110448392.4A patent/CN103147062A/zh active Pending
- 2008-09-11 TW TW097134790A patent/TWI464290B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006131751A1 (en) * | 2005-11-16 | 2006-12-14 | Sigma-Aldrich Co. | Cyclopentadienyl type hafnium and zirconium precursors and use thereof in atomic layer deposition |
| WO2007066546A1 (ja) * | 2005-12-06 | 2007-06-14 | Tri Chemical Laboratories Inc. | ハフニウム系化合物、ハフニウム系薄膜形成材料、及びハフニウム系薄膜形成方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI883111B (zh) * | 2020-02-04 | 2025-05-11 | 德商馬克專利公司 | 選擇性形成含金屬膜之方法 |
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| WO2009036046A1 (en) | 2009-03-19 |
| EP2191034B1 (en) | 2013-03-13 |
| US8039062B2 (en) | 2011-10-18 |
| US20090081385A1 (en) | 2009-03-26 |
| KR20100072021A (ko) | 2010-06-29 |
| KR20150139628A (ko) | 2015-12-11 |
| TW200912024A (en) | 2009-03-16 |
| EP2191034A1 (en) | 2010-06-02 |
| CN101815807A (zh) | 2010-08-25 |
| JP2010539710A (ja) | 2010-12-16 |
| CN103147062A (zh) | 2013-06-12 |
| CN101815807B (zh) | 2012-06-13 |
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