KR20150117732A - Test handler, pushing device and test tray for testhandler, interface board for tester - Google Patents

Abstract

The present invention relates to a test handler which is used in testing a semiconductor device, and a component thereof and an interface board for a tester. The test handler according to the present invention has a contact part capable of contacting a surface of the semiconductor device to measure surface resistance of the semiconductor device, and the interface board for the tester has a measurement port which can be connected to the contact part electrically, and outputs a signal capable of measuring the surface resistance of the semiconductor device. Here, the contact part of the test handler may be comprised in the component thereof such as a pushing device or a test tray. According to the present invention, the test handler can improve reliability for the test because the test handler can measure the surface resistance of the semiconductor device.

Description

TEST HANDLER, PUSHING DEVICE AND TEST TRAY FOR TESTHANDLER, INTERFACE BOARD FOR TESTER < RTI ID = 0.0 >

The present invention relates to a test handler used for testing semiconductor devices, a pushing device which is an accessory of a test handler, a test tray, and an interface board of a tester.

The test handler electrically connects the fabricated semiconductor device to the tester. The test handler then classifies the semiconductor devices according to the test results. The test handler can be referred to in Korean Patent Publication No. 2012-0106320 (hereinafter referred to as "the first document").

In order to electrically connect the semiconductor device to the tester, the test handler has a test tray and a pushing device.

The test tray may hold semiconductor elements. The semiconductor device is seated in an insert provided in the test tray. As in Korean Patent Publication No. 10-2011-0011462 (hereinafter referred to as "second cited document"), the insert has a latching device for holding the seated semiconductor device. The latch device is composed of a retention lever (referred to as "latch member" in the second citation) and an elastic member (referred to as "restoring spring" in the second citation). The holding lever holds or releases the semiconductor element by normal rotation. The elastic member exerts an elastic force in the forward direction so that the holding lever holds the semiconductor element. For reference, when the holding lever releases the holding of the semiconductor element, an external force is applied to the holding lever in a reverse direction by a separate opening device.

The pushing device pushes the semiconductor device mounted on the test tray and electrically connects it to the interface board of the tester. As in the first document, the pushing device is composed of a pusher (referred to as a "pushing unit" in the first document), a pusher mounting plate (referred to as "mounting plate" in the first document) and a moving source. The pusher supports or presses the semiconductor device against the test socket of the interface board. Pushers are installed on the pusher mounting plate. The moving source moves the pusher mounting plate to the interface board side or to the opposite direction.

The interface board is typically coupled to the test handler, spaced from the body of the tester. As disclosed in Korean Utility Model Application No. 2009-0002814, an interface board has a test socket that can be electrically connected to a semiconductor device. The semiconductor element supported or pressed by the pusher is therefore electrically connected to the test socket.

The above relationship between the test tray, the pushing device, and the interface board is described with reference to FIG.

On the other hand, the semiconductor device may be malfunctioned due to external electrical influences. This problem can be more frequent as the density of electronic components is higher. Especially in recent years, the density of electronic components is high for implementing various functions of electronic products. Therefore, the surface of the semiconductor element is shielded. The shielding layer treated on the surface of the semiconductor element protects the semiconductor element from the influence of external electrical action. That is, the external electrical action is canceled through the grounded shielding layer.

One way to create a shielding layer is to cover the surface of the semiconductor device with a thin metal plate. However, the process of covering the surface of the semiconductor element with the metal plate is troublesome and the productivity is low.

Another method of making the shielding layer is to coat the surface of the semiconductor device with a conductive material. This method is simple in process and good in productivity. However, it is difficult to check if there is coating failure.

The coating defects do not affect the electrical property test of the semiconductor device. Thus, a semiconductor element which has passed the test and is defective in coating can be applied to electronic products. In this case, the coating failure can be extended to the defects of the electronic product itself.

It is an object of the present invention to provide a technique for checking whether a shielding layer is appropriately formed on a surface of a semiconductor device in the process of inspecting electrical characteristics of the semiconductor device.

A pushing device for a test handler according to the present invention comprises: a pusher for electrically connecting a semiconductor device to a test socket by supporting a semiconductor device against a test socket provided on an interface board of a tester; A pusher mounting plate on which the pusher is installed; A moving source for moving the pusher mounting plate toward the interface board; A contact terminal contacting the surface of the semiconductor element electrically connected to the test socket by the pusher; And a connection circuit for electrically connecting the contact terminal to a measurement terminal for outputting a signal for measuring a surface resistance of the semiconductor element; .

The contact terminal and the connection circuit may be installed in the pusher.

A connection terminal for electrically connecting the contact terminal to the test socket; And the connection circuit electrically connects the contact terminal and the connection terminal.

A test handler according to the present invention comprises: a test tray in which a semiconductor element can be seated and in which a closed path determined by a plurality of transfer devices circulates; A loading device for loading a semiconductor device into the test tray; A pushing device for pushing the test tray toward the interface board of the tester so as to electrically connect the semiconductor device loaded on the test tray with the tester by the loading device; And an unloading device for unloading the semiconductor device from the test tray on which the loaded semiconductor elements have been tested. And the pushing device is a pushing device for a test handler having the contact terminal and the connecting circuit.

An interface board for a tester according to the present invention includes: a test socket electrically connected to a semiconductor device; A socket mounting plate on which the test socket is installed; And a measurement terminal for outputting a signal for measuring a surface resistance of the semiconductor element; .

The measurement terminal may be installed in the test socket.

The measuring terminal may be installed on the socket mounting plate separately from the test socket

The connection terminal connected to the surface of the semiconductor element may be bent or rotated by an external force, and in this case, the measurement terminal may be resiliently restored.

A test tray for a test handler according to the present invention includes: an insert having a seating groove on which a semiconductor element can be seated; And an installation frame in which the insert is installed; Wherein the insert comprises: an insert body having the seating groove formed therein; A holding lever for electrically connecting the surface of the semiconductor element to a measurement terminal for outputting a signal for measuring a surface resistance of the semiconductor element, holding or releasing the semiconductor element seated in the seating groove in the seating groove; And an elastic member for applying an elastic force in a direction in which the holding lever holds the semiconductor element in the seating groove; Wherein the holding lever comprises: a holding end that holds or releases a semiconductor element seated in the seating recess in the seating recess, and contacts the surface of the semiconductor element when holding the semiconductor element; And a contact terminal contacting the measurement terminal for outputting a signal for measuring the surface resistance of the semiconductor element; .

A pushing device for a test handler according to the present invention comprises: a test tray on which a semiconductor device can be seated, and which circulates a closed path defined by a plurality of conveying devices; A loading device for loading a semiconductor device into the test tray; A pushing device for pushing the test tray toward the interface board of the tester so as to electrically connect the semiconductor device loaded on the test tray with the tester by the loading device; And an unloading device for unloading the semiconductor device from the test tray on which the loaded semiconductor elements have been tested. Wherein the test tray is a test tray for a test handler having a holding lever with the contact end.

According to the present invention, it is possible to confirm whether or not a shielding layer on the surface of a semiconductor device is appropriately formed in the process of examining electrical characteristics of the semiconductor device. Therefore, the following effects can be obtained.

First, the reliability of the test can be improved.

Second, since the inspection of the shielding layer is performed together with the electrical characteristic inspection, it is not necessary to undergo a separate inspection process.

1 is a schematic plan view of a test handler and an interface board according to the present invention.
Figure 2 is a schematic plan view of a test tray applied to the test handler of Figure 1;
Figs. 3 and 4 are conceptual diagrams of characteristic parts of the first embodiment of the present invention. Fig.
Figs. 5 and 6 are conceptual diagrams of characteristic parts of a second embodiment of the present invention.
Figs. 7 and 8 are conceptual diagrams of characteristic parts of a third embodiment of the present invention.
Fig. 9 is another variation of the connection terminal of the test socket applied to the interface board of Fig.
Figs. 10 and 11 are conceptual diagrams of characteristic parts of a fourth embodiment of the present invention. Fig.
12 is a schematic configuration diagram of a test handler, a measuring instrument, and an interface board according to the present invention.
Fig. 13 shows an example in which a contact terminal, which is a contact portion, is installed to another accessory of the test handler.

Preferred embodiments according to the present invention will be described with reference to the accompanying drawings. For the sake of brevity, redundant descriptions are preferably omitted or compressed.

<Description of basic configuration of test handler and interface board>

1 is a schematic plan view of a test handler 100 and an interface board 200 according to the present invention.

The test handler 100 includes a test tray 110, a loading device 120, a SOAK CHAMBER 130, a test chamber 140, a pushing device 150, a desock chamber 160, An unloading device 170, and the like.

The test tray 110 circulates along a closed path C via a loading position LP, a test position TP, and an unloading position UP. These test trays 110 may be loaded with semiconductor devices. As shown in the plan view of FIG. 2, the test tray 110 includes a plurality of inserts 111 and a mounting frame 112. A plurality of inserts (111) are installed in the installation frame (112). The semiconductor element is seated in the seating groove (S) of the insert (111). Of course, as in the background art, the insert 111 has a retaining lever and an elastic member.

The loading device 120 loads the semiconductor elements of the customer tray CT ₁ into the test tray 110 at the loading position LP.

The soak chamber 130 is provided to preheat or precool the semiconductor elements of the test tray 110 from the loading position LP according to the test conditions.

The test chamber 140 is provided to test the semiconductor elements of the on test tray 110 via the soak chamber 130 and into the test position TP.

The pushing device 150 pushes the test tray 110 in the test chamber 140 toward the interface board 200 side of the tester. Accordingly, the semiconductor devices mounted on the test tray 110 are electrically connected to the interface board 200. Of course, as in the background art, the pushing device 150 has a pusher, a pusher mounting plate, and a move source 153.

The desock chamber 160 is provided to return the semiconductor elements of the test tray 110 from the test chamber 140 to room temperature.

The unloading device 170 unloads the semiconductor elements of the on test tray 110 from the deshook chamber 160 to the unloading position UP. At this time, the unloading apparatus 170 classifies the semiconductor elements according to the test grades and loads them on the customer trays CT ₂ , CT ₃ , and CT ₄ .

Whether or not the shielding layer formed on the surface of the semiconductor element is defective can be confirmed through resistance measurement. That is, depending on whether the surface resistance of the semiconductor device is higher than or equal to the reference, it is possible to confirm whether or not the shielding layer is defective.

Thus, the test handler 100 may have a contact portion that can electrically contact the surface of the semiconductor device. The contact portion is used to measure the surface resistance of the semiconductor element. This contact portion may optionally be configured with an accessory such as the test tray 110 or the pushing device 150.

When the test handler 100 is provided with the contact portion for measuring the surface resistance, the sorting operation of the unloading device 150 can be varied. For example, in FIG. 1, the semiconductor devices which are defective in the electrical characteristic test are classified into the customer tray of the code CT ₃ , the semiconductor devices which are defective in the surface resistance measurement are classified into the customer tray of the code CT ₄ , And the electrical characteristic test can be classified in the customer tray of the code CT ₅ . Of course, it is also possible to classify only whether or not a defect is caused in the electrical characteristic test, and whether or not the defect is a defect in the surface resistance measurement.

Meanwhile, the interface board 200 includes a test socket 210 and a socket mounting board 220.

The test socket 210 has a plurality of test terminals electrically connected to the lead terminals of the semiconductor device.

The socket mounting plate 220 is provided with test sockets 210.

The interface board 200 according to the present invention may further have a measurement terminal. The measurement terminal outputs a signal for measuring the surface resistance of the semiconductor element. Such a measuring terminal may be provided in the form of a pogo pin.

Specific embodiments of the test handler 100 and the interface board 200 having the above basic configuration will be described.

&Lt; Embodiment 1 >

FIG. 3 is a conceptual diagram of the characteristic portion of the first embodiment. FIG.

In this embodiment, the contact portion is provided in the pusher 151 of the pushing device 150, and the measurement terminal MT is installed in the test socket 210 of the interface board 200.

The pusher 151 is provided with a contact terminal CT and a connection circuit CC. Here, the contact terminal CT and the connection circuit CC are contact portions provided in the test handler 100. [

The contact terminal CT is brought into contact with the surface of the semiconductor element D. The contact terminal CT may be provided in the form of a pogo pin.

The connection circuit CC is provided for electrically connecting the contact terminal CT to the measurement terminal MT of the interface board 200. [

Fig. 4 shows a state in which the semiconductor element D is electrically connected to the test socket 210. Fig.

The outgoing terminals OT of the semiconductor device D mounted on the insert 111 are electrically connected to the test terminals TT of the test socket 210. [ The contact terminal CT provided on the pusher 151 is brought into contact with the surface of the semiconductor element D and the measurement terminal MT is brought into contact with the connection circuit CC. Therefore, the electrical characteristics of the semiconductor device and the surface resistance are tested together by a tester.

&Lt; Embodiment 2 >

5 is a conceptual diagram of a characteristic portion of the second embodiment.

In this embodiment, the holding lever 111a of the insert 111 is utilized as the contact portion. Here, the holding lever 111a is a contact portion provided in the test handler 100. [

The holding lever 111a is made of a metal of a conductive material. The retaining lever 111a has a retaining end HP and a contact CP on both sides with respect to the rotation point LP.

The retaining end HP holds or releases the semiconductor element D seated in the seating groove S of the insert body 111c. Of course, the elastic member 111b exerts an elastic force on the holding lever 111a in such a direction as to hold the semiconductor element D in the seating groove S. And the holding end (HP) is brought into contact with the surface of the semiconductor element.

The contact end CP protrudes to the outside of the seating groove S. This contact end CP is provided for contacting the measurement terminal MT.

6 shows a state in which the semiconductor element D is electrically connected to the test socket 210. As shown in Fig. That is, the measurement terminal MT of the interface board 200 may be connected to the surface of the semiconductor element D through the holding lever 111a.

For reference, the holding lever 111a is made of a conductive material only in a portion contacting the semiconductor element D and a portion in contact with the measurement terminal MT, and may be implemented to have wiring connecting the both sides. That is, it suffices that the holding lever 111a can electrically connect the surface of the semiconductor element D and the measurement terminal MT.

&Lt; Third Embodiment >

Fig. 7 is a conceptual diagram of the characteristic portion of the third embodiment.

In this embodiment, the measurement terminal MT of the interface board 200 is characterized.

The measurement terminal MT has a connection terminal MTa at its end. Both connection ends MTa are kept tilted in directions opposite to each other.

8 shows a state in which the semiconductor element D is electrically connected to the test socket 210. In Fig.

In this embodiment, the insert 111 is moved toward the test socket 210 side by the pusher 151 to apply an external force to the connection terminal MTa. Therefore, the connection terminal MTa is directly connected to the surface of the semiconductor element D.

It is assumed that the connection end MTa in this embodiment is elastically restored after being bent. However, as shown in FIG. 9, the connection terminal MTa of the measurement terminal MT may be provided so as to be elastically restored by the restoring spring RS after being rotated by an external force.

<Fourth Embodiment>

10 is a conceptual diagram of a characteristic portion of the fourth embodiment.

The present embodiment further includes a connection terminal LT installed on the pusher mounting plate 152 of the pushing device 150. [ The connection terminal LT is electrically connected to the contact terminal CT provided on the pusher 151 via the connection circuit CC. The measurement terminal MT is mounted on the socket mounting plate 220 of the interface board 200. Here, the connection terminal LT and the measurement terminal MT are located at positions corresponding to each other. Therefore, the measurement terminal MT is installed independently of the test socket 210 separately. Of course, as shown in the drawing, the plurality of connection terminals LT and the plurality of measurement terminals MT are preferably bundled together by one socket.

11 shows a state in which the semiconductor element D is electrically connected to the test socket 210. As shown in Fig.

The contact terminal CT provided on the pusher 151 contacts the surface of the semiconductor element D and the measurement terminal MT is connected to the connection terminal LT. Of course, the contact terminal CT and the connection terminal LT are connected by the connection circuit CC.

In this embodiment, the contact terminal CT, the connection circuit CC, and the connection terminal LT are the contact portions provided in the test handler 100.

In the above embodiments, the contact terminal CT and the measurement terminal MT may be applied, for example, in a Kelvin probe structure in order to prevent a contact error.

The first, second, and fourth embodiments above may be selectively applied to the test handler 100.

For reference, the above-described embodiments describe that the electrical characteristic test of the semiconductor device and the surface resistance measurement of the semiconductor device are performed together. However, depending on the operation of the equipment, the surface resistance measurement of the semiconductor device and the electrical characteristic test of the semiconductor device may be selectively performed. That is, it is possible to take an operation mode in which either the electric characteristic test of the semiconductor device and the surface resistance measurement are performed in parallel, or only the electric property test or the surface resistance measurement of the semiconductor device is selectively performed.

On the other hand, in the above embodiments, it is assumed that the tester outputs a signal for electrical characteristic test and a signal for measuring surface resistance together.

However, according to the embodiment of the present invention, a measuring instrument (RTA) different from the tester (TESTER) may be provided as shown in FIG. The measuring instrument (RTA) outputs a signal for measuring the surface resistance of the semiconductor element. In this example, the contact portion of the test handler 100 shown in the first embodiment, the second embodiment, and the fourth embodiment relates to the meter RTA. Therefore, the interface board 200 is not equipped with a measurement terminal.

In the above-described embodiments, only the examples in which the contact portion is configured in the test tray 110 or the pushing device 150 are described. However, depending on the implementation, the contact portion may be provided in other accessories of the test handler 100. Of course, the contact portion may be provided independently of the existing accessories of the test handler 100. For example, in Fig. 13, a contact terminal CT may be provided on the picker P provided in the loading device or the unloading device. The picker P is an element for holding or releasing the semiconductor element D by vacuum adsorption. In the embodiment as shown in FIG. 13, the electrical characteristic test and the surface resistance measurement of the semiconductor element D are not performed at the same time, but are performed separately at intervals of time.

As described above, the present invention has been described in detail with reference to the accompanying drawings. However, the above-described embodiments are only illustrative of preferred embodiments of the present invention. Therefore, the present invention should not be construed as being limited to the above-described embodiments.

100: Test handler
110: Test tray
111: insert
111a: Holding lever 111b: Elastic member
111c: insert body
S: seat home HP: holding stage
CP: Contact stage
112: Installation frame
120: loading device
150: pushing device
151: pusher 152: pusher mounting plate
153:
170: Unloading device
CT: Contact terminal CC: Connection circuit
200: Interface board
210: Test socket
220: socket mounting plate
MT: Measuring terminal
MTa: connection stage

Claims (10)

A pusher for electrically connecting the semiconductor element to the test socket by supporting the semiconductor element against a test socket provided on an interface board of a tester;
A pusher mounting plate on which the pusher is installed;
A moving source for moving the pusher mounting plate toward the interface board;
A contact terminal contacting the surface of the semiconductor element electrically connected to the test socket by the pusher; And
A connection circuit for electrically connecting the contact terminal to a measurement terminal that outputs a signal for measuring a surface resistance of the semiconductor element; &Lt; RTI ID = 0.0 &gt;
Pushing device for test handler. The method according to claim 1,
And the contact terminal and the connection circuit are installed in the pusher
Pushing device for test handler. The method according to claim 1,
A connection terminal for electrically connecting the contact terminal to the test socket; Further comprising:
And the connection circuit electrically connects the contact terminal and the connection terminal
Pushing device for test handler. A test tray through which a semiconductor element can be seated and circulates a closed path determined by a plurality of conveying devices;
A loading device for loading a semiconductor device into the test tray;
A pushing device for pushing the test tray toward the interface board of the tester so as to electrically connect the semiconductor device loaded on the test tray with the tester by the loading device; And
An unloading device for unloading a semiconductor element from a test tray on which loaded semiconductor elements have been tested; / RTI &gt;
Characterized in that the pushing device is a pushing device for a test handler according to any one of claims 1 to 3
Test handler. A test socket electrically connected to the semiconductor device;
A socket mounting plate on which the test socket is installed; And
A measurement terminal for outputting a signal for measuring a surface resistance of the semiconductor element; &Lt; RTI ID = 0.0 &gt;
Interface board for testers. 6. The method of claim 5,
And the measuring terminal is installed in the test socket.
Interface board for testers. 6. The method of claim 5,
And the measuring terminal is installed on the socket mounting plate independently of the test socket.
Interface board for testers. 6. The method of claim 5,
The measurement terminal is characterized in that the connection end connected to the surface of the semiconductor element can be bent or rotated by an external force and can be elastically restored
Interface board for testers. An insert having a seating groove on which a semiconductor device can be seated; And
An installation frame on which the insert is installed; / RTI &gt;
The insert
An insert body having the seating groove formed therein;
A holding lever for electrically connecting the surface of the semiconductor element to a measurement terminal for outputting a signal for measuring a surface resistance of the semiconductor element, holding or releasing the semiconductor element seated in the seating groove in the seating groove; And
An elastic member for applying an elastic force in a direction in which the holding lever holds the semiconductor element in the seating groove; / RTI &gt;
The holding lever
A holding end holding or holding the semiconductor element seated in the seating recess in the seating recess and contacting the surface of the semiconductor element at the time of holding the semiconductor element; And
A contact terminal contacting a measurement terminal for outputting a signal for measuring a surface resistance of the semiconductor element; &Lt; RTI ID = 0.0 &gt;
Test trays for test handlers. A test tray through which a semiconductor element can be seated and circulates a closed path determined by a plurality of conveying devices;
A loading device for loading a semiconductor device into the test tray;
A pushing device for pushing the test tray toward the interface board of the tester so as to electrically connect the semiconductor device loaded on the test tray with the tester by the loading device; And
An unloading device for unloading a semiconductor element from a test tray on which loaded semiconductor elements have been tested; / RTI &gt;
Characterized in that the test tray is a test tray for a test handler according to claim 9
Test handler.

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