JP2000258496A - Inspection of semiconductor device and device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection method and a device thereof improving the possibility of relief from a defective item by reinspection when the item intrinsically good as a product capacity is determined as a defective item in inspection of a semiconductor. SOLUTION: In an inspection method for a semiconductor inspection device having a plurality of sockets, in which an inspected device is set for inspection, and a reinspection function, respective inspected devices determined as defective items in the inspection are sorted in every inspection socket (104). When the inspected device determined as a defective item is transferred to a reinspection tray, the device is arranged so as to be positioned in a tray of a reinspection socket other than the previous socket (105), so that in resinspection of the inspected device determined as a defective one in the inspection result, the inspected device is set in a socket other than a socket used for the previous inspection for reinspection (106).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for inspecting a semiconductor device, and more particularly to a method and an apparatus for reselecting a handler having a plurality of DUT sockets.

[0002]

2. Description of the Related Art In a semiconductor device inspection process, LS
A handler integrated with a test device such as an I tester is a DU
The tray and the DUT on which T (Device Under Test) is placed are transported and handled, the DUT is loaded and set in the socket, the test is executed, and based on the test result, the category (the DUT of the DUT based on the test result) is executed. A series of processing for sorting and unloading for each good / defective product classification and rank) is performed.

In a conventional handler apparatus having a function of retesting a DUT determined to be defective as a result of a test (inspection), a DUT determined to be defective after an initial test is performed.
Has a re-inspection tray (also called "re-inspection waiting tray")
After the inspection is completed, the DUT waiting for re-inspection stored in the re-inspection tray is re-inspected.

In this case, after the first inspection, the DUT determined to be defective moves from the socket where the inspection was performed to the tray for re-inspection as it is, so that the socket at the time of inspection and the socket at the time of re-inspection are the same. There are cases.

[0005] When re-inspection is performed using the same socket, a DUT that is originally a non-defective product is again judged as a defective product in terms of the actual performance of the product.

[0006]

As the operating frequency of a semiconductor device increases, the accuracy (capacity) of a test device and the required accuracy of a DUT measurement approach each other, and the maximum operating frequency of the semiconductor device increases. Some of them have surpassed the above-mentioned ability, and the characteristic variation between sockets, which has not been apparent in the past, has become remarkable.

That is, in a handler device having a plurality of sockets, there is a problem in that a measurement result obtained by inspection in one socket and a measurement result obtained by inspection in another socket are not uniform.

On the other hand, the measurement standard of each measurement item in a test program for inspecting a DUT in a test apparatus (a measurement standard for determining whether a measurement result is a pass or a failure and performing a ranking process according to the determination result) is a semiconductor standard. In consideration of measurement variation between sockets of an inspection device of a manufacturing apparatus, a correction value of the measurement standard is usually determined on the basis of a socket showing an electrical characteristic value under the best condition.

That is, in the inspection, a defective DUT is
Since the measurement standard is determined by setting the correction value so that the defective DUT is determined, that is, so that the defective DUT is not erroneously determined as a non-defective product, it is set in a socket indicating the worst-case electrical characteristic value and the inspection is performed. If the inspection is performed, the inspection result may not reach the range of a non-defective product, and the DUT may be determined to be defective, although the original performance of the DUT is non-defective.

For example, in the measurement of the signal propagation delay time of the input signal and the output signal of the DUT, the measurement result (t _pd1 ) of the signal propagation delay time of the DUT at the first socket showing the electric characteristic value of the best condition is obtained. When the correction is made based on the correction value (t _pdCAL ) based on the socket showing the electrical characteristic value of the best condition, the DUT becomes less than or equal to the non-defective measurement standard (t _pd max) and is judged to be non-defective. , The signal propagation delay time is measured by the second socket showing the worst-case electrical characteristic value, and the measurement result (t _pd2 ) is corrected by the correction value (t _pdCAL ). t
_pd max) may be exceeded. In this case, the failure is determined, and the failure is again caused even if the same socket is retested. Not only AC test but also DUT voltage and current measurement etc.
Also for the timing setting of the test apparatus in the C test and the function test, and the correction of the output signal level setting in the comparator, the inspection is performed by setting the worst-case electrical characteristic value in a socket (with a small margin with respect to the standard). Although the actual performance of the DUT is good, the measurement result does not reach the range of the good product, and the DUT is determined to be defective.

As described above, due to the characteristic variation between the sockets, it is not possible to judge the acceptability of the DUT and categorize the DUT correctly.

As an apparatus for avoiding performing a burn-in test for a long time by mounting a DUT in a defective socket,
For example, Japanese Patent Laying-Open No. 10-239388 discloses a configuration including a pretester for testing a DUT mounted on a socket of a burn-in board.

Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to remedy what was originally a non-defective product in terms of its ability in practice by re-inspection. An object of the present invention is to provide an inspection method and an apparatus that improve the possibility.

[0014]

In order to achieve the above object, the present invention provides a method of inspecting a semiconductor inspection apparatus having a plurality of sockets on which a device under test is set and inspected and having a re-inspection function. When retesting the device under test determined to be defective, the device under test is set in a socket different from the socket on which the test was performed, and the test is performed again.

In the present invention, when the device under test determined to be defective as a result of the test is placed in the re-test standby tray for re-test, the device is re-tested in a socket different from the socket at the time of the first test. So that it is placed on the re-inspection waiting tray.

[0016]

Embodiments of the present invention will be described. The present invention relates to a device under test (DeviceUnder Tes
t; DUT) is set, a power supply and an applied signal are supplied from the test apparatus, and a plurality of sockets for outputting an output signal of the DUT to the test apparatus are provided. As a result of the inspection, when the DUT determined to be defective is re-inspected, the DUT to be re-inspected is
It has a function of setting it in a socket different from the socket on which the previous inspection was performed and performing an inspection again.

[0017]

Embodiments of the present invention will be described with reference to the drawings. One embodiment of the present invention relates to a handler device having a plurality of sockets and having a function of performing a re-check
As a result of inspection of the DUT by a test device such as a tester, the DUT determined to be defective is classified into trays corresponding to sockets at the time of inspection before being moved to the tray for reinspection, and then relocated to the tray for reinspection. At the time, a function is provided to relocate to the re-examination tray so that a socket different from the first socket may be selected again.

The present invention relates to a known horizontal transport type handler apparatus, which is shown in FIG.
And a testing unit 10 that accommodates the DUT in a plurality of sockets and conducts a test by making an electrical connection between the DUT and the test apparatus.
Means (unloader) 11 for taking out a DUT determined as a non-defective product or a defective product from the result of the inspection at 0
Means 12 for storing DUTs determined to be non-defective and classifying DUTs determined to be defective for each tray corresponding to the socket at the time of inspection, and differentiating the DUT determined to be defective from the socket at the time of the first inspection. Means 13 for re-arranging the DUT in the re-inspection tray so as to be re-inspected in the socket, and means (loader) 14 for setting the DUTs stored in the re-inspection tray rearranged in the re-selection mode to a plurality of measurement sockets. ,
And the DUT moved to the plurality of sockets is retested.

FIGS. 1 to 4 are diagrams for explaining the operation of the inspection apparatus according to one embodiment of the present invention. The operation of one embodiment of the present invention will be described.

FIG. 1 shows an example of an arrangement of sockets of an inspection section according to an embodiment of the present invention. A DUT (Sample A-A) is supplied from an inspection tray to each of a plurality of sockets A-H. H) is stored, and an electrical test is performed by setting an electrical signal from a test device (not shown) to the DUT, determining a measurement result of the DUT, and the like. The test apparatus discriminates a non-defective product from a measurement result (for example, a DC test, an AC test, a function test, and the like).

As a result of the test, the DUT is classified as defective, non-defective, and defective, and the DUT determined to be non-defective is taken out of the socket and moved to a non-defective tray. At that time, as shown in FIG. 2, sorting is performed according to rank (good product 1 to good product n) based on the test result.

As a result of the test, the DUT determined to be defective is temporarily stored in a plurality of inspection trays corresponding to the plurality of sockets subjected to the electrical inspection.

The DUT primarily stored in the inspection tray is
When moving from a plurality of trays corresponding to the socket on which the previous inspection was performed to the re-inspection standby tray (also referred to simply as "re-inspection tray"), the socket to be re-inspected should be different from the previous socket. Is placed on the re-examination standby tray (see FIG. 3).

Then, as shown in FIG. 4, the DUT stored in the re-inspection waiting tray and waiting for the inspection is accommodated in the socket and re-inspected, and the final good / defective product is determined.

FIG. 5 is a flowchart showing a processing procedure according to one embodiment of the present invention. Referring to FIG. 5, after the first electrical characteristic test, DUTs determined to be non-defective are sorted and classified for each category (steps 101 to 102).

On the other hand, the DUT determined to be defective is classified into each socket for which the first electrical characteristic has been performed for each DUT (steps 103 and 104), and the first defective DUT is placed in a re-inspection tray. At this time, the sockets for re-inspection of the defect determination DUT are arranged in a tray different from that of the first socket (step 105). After the first measurement is completed, a defect determination DUT is set in each socket from the re-inspection tray, and re-inspection is performed (step 106). Based on the re-inspection result, good or bad is determined (steps 107 and 10).
8).

In the above embodiment, after the first electrical measurement test, a plurality of trays are prepared corresponding to the electrically tested sockets in order to temporarily store the DUT determined to be defective. However, instead of having a plurality of trays, the tray may be moved directly from the socket to the re-examination standby tray, and then arranged so that it can be set in a different socket from the first inspection.

[0028]

As described above, according to the present invention,
At the time of the re-inspection, the re-inspection is performed by setting the socket to a different socket from that at the time of the initial inspection, so that the DUT selection error due to the variation between the sockets is suppressed and the inspection accuracy is improved.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining an embodiment of the present invention.

FIG. 2 is a diagram for explaining an embodiment of the present invention.

FIG. 3 is a diagram for explaining an embodiment of the present invention.

FIG. 4 is a diagram for explaining one embodiment of the present invention.

FIG. 5 is a flowchart illustrating a processing procedure according to an embodiment of the present invention.

FIG. 6 is a block diagram for explaining the configuration of an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 10 inspection unit 11 extraction unit (unloader) 12 classification unit 13 rearrangement unit 14 mounting unit (loader) A to H socket

Claims (5)

[Claims] An inspection method for a semiconductor inspection apparatus having a plurality of sockets on which a device under test is set and inspected and having a re-inspection function, wherein a device under test determined to be defective as a result of the inspection is re-inspected. And re-arranging the device under test so that re-inspection is performed in a socket different from the socket in which the inspection is performed. 2. The method according to claim 1, wherein when the device under test determined to be defective as a result of the inspection is placed on a re-inspection tray for re-inspection, the device is re-inspected in a socket different from the socket at the time of the initial inspection. And disposing it on the re-inspection tray. 3. A test method for a semiconductor test apparatus having a plurality of sockets on which a device under test is set and subjected to a test and having a retest function, wherein each test device of the device under test determined to be defective as a result of the test. Is classified for each socket subjected to the inspection, and when the device under test determined to be defective is transferred to a re-inspection tray, the socket for which re-inspection is performed for the device under test determined to be defective last time. An inspection method for a semiconductor inspection apparatus, wherein the semiconductor inspection apparatus is disposed so as to be located on a tray different from a socket at the time of inspection. 4. A semiconductor inspection apparatus having a plurality of sockets on which a device under test is set and subjected to an inspection and having a re-inspection function. A semiconductor inspection apparatus comprising: means for setting a device under test in a socket different from the socket on which the inspection has been performed, and performing re-inspection. 5. A horizontal transfer type handler device,
Means for receiving the transported device under test (referred to as “DUT”) in a plurality of sockets and performing an electrical connection between the DUT and a test apparatus, and performing a test based on a result of the inspection; D determined as defective
Means for taking out a UT from a socket and selecting it, means for storing a DUT determined to be non-defective, means for classifying a DUT determined to be defective for each tray corresponding to the socket at the time of inspection, and a DUT determined to be defective Means for re-arranging the re-inspection tray in a re-inspection tray so as to be re-inspected in a socket different from the socket at the time of the initial inspection,
Means for setting a UT in the plurality of sockets.