KR20140044747A - 회로 접속 재료 및 그의 제조 방법, 및 이것을 이용한 실장체의 제조 방법 - Google Patents

회로 접속 재료 및 그의 제조 방법, 및 이것을 이용한 실장체의 제조 방법 Download PDF

Info

Publication number
KR20140044747A
KR20140044747A KR1020130117218A KR20130117218A KR20140044747A KR 20140044747 A KR20140044747 A KR 20140044747A KR 1020130117218 A KR1020130117218 A KR 1020130117218A KR 20130117218 A KR20130117218 A KR 20130117218A KR 20140044747 A KR20140044747 A KR 20140044747A
Authority
KR
South Korea
Prior art keywords
titanium oxide
anisotropic conductive
conductive film
polymerization initiator
circuit connection
Prior art date
Application number
KR1020130117218A
Other languages
English (en)
Korean (ko)
Inventor
히로시 하마치
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20140044747A publication Critical patent/KR20140044747A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
KR1020130117218A 2012-10-05 2013-10-01 회로 접속 재료 및 그의 제조 방법, 및 이것을 이용한 실장체의 제조 방법 KR20140044747A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-223476 2012-10-05
JP2012223476A JP6029922B2 (ja) 2012-10-05 2012-10-05 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法

Publications (1)

Publication Number Publication Date
KR20140044747A true KR20140044747A (ko) 2014-04-15

Family

ID=50403324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130117218A KR20140044747A (ko) 2012-10-05 2013-10-01 회로 접속 재료 및 그의 제조 방법, 및 이것을 이용한 실장체의 제조 방법

Country Status (3)

Country Link
JP (1) JP6029922B2 (ja)
KR (1) KR20140044747A (ja)
CN (1) CN103709955A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6331776B2 (ja) 2014-06-30 2018-05-30 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
KR102615097B1 (ko) * 2015-11-25 2023-12-18 가부시끼가이샤 레조낙 회로 접속용 접착제 조성물 및 구조체
JP2020041032A (ja) 2018-09-07 2020-03-19 デクセリアルズ株式会社 接続構造体の製造方法および接続フィルム
JP2024042257A (ja) * 2022-09-15 2024-03-28 株式会社レゾナック 接着剤組成物、接着剤フィルム、接続構造体及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5523139A (en) * 1978-08-07 1980-02-19 Kao Corp White photo-setting paint composition
EP0979854B1 (en) * 1997-03-31 2006-10-04 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP2001298047A (ja) * 2000-04-11 2001-10-26 Sanyo Chem Ind Ltd 異方性導電接合材料形成用組成物
JP2002079535A (ja) * 2000-06-28 2002-03-19 Ricoh Co Ltd 円筒成形型及びその製造方法並びに円筒膜の製造方法
US7033668B2 (en) * 2001-08-23 2006-04-25 Tesa Ag Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
JP2007224228A (ja) * 2006-02-27 2007-09-06 Hitachi Chem Co Ltd 回路接続材料並びに回路端子の接続構造体及び接続方法
GB2455917B (en) * 2006-08-08 2011-08-17 World Properties Inc Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
JP5013067B2 (ja) * 2007-01-22 2012-08-29 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電フィルム
WO2009147126A1 (de) * 2008-06-03 2009-12-10 Basf Se Titandioxid-zusammensetzung, die titandioxidnanoteilchen enthält, ihre herstellung und verwendung
KR101615797B1 (ko) * 2008-07-11 2016-04-26 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
CN102171306B (zh) * 2008-09-30 2014-08-13 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP2011165469A (ja) * 2010-02-09 2011-08-25 Sony Corp 半導体電極層及びその製造方法、並びに電気化学装置
JP2012082347A (ja) * 2010-10-13 2012-04-26 Yokohama Rubber Co Ltd:The 接着剤

Also Published As

Publication number Publication date
CN103709955A (zh) 2014-04-09
JP2014074139A (ja) 2014-04-24
JP6029922B2 (ja) 2016-11-24

Similar Documents

Publication Publication Date Title
TWI579865B (zh) 各向異性導電膜、連接方法、及接合體
TWI452401B (zh) 異向性導電膜及接合體及其製造方法
EP2645408B1 (en) Method of bonding a plurality of bonded members
JP4930623B2 (ja) 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
KR102649655B1 (ko) 접착제 조성물
WO2012105701A1 (ja) 導電性粒子及びこれを用いた異方性導電材料
JP5368760B2 (ja) 絶縁被覆導電性粒子、異方性導電材料及び接続構造体
KR20110099793A (ko) 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
JP7107231B2 (ja) 接着剤フィルム
JP5934528B2 (ja) 回路接続材料、及びそれを用いた実装体の製造方法
KR20140044747A (ko) 회로 접속 재료 및 그의 제조 방법, 및 이것을 이용한 실장체의 제조 방법
JP7314801B2 (ja) 接続構造体及びその製造方法
TW201239909A (en) Conductive particle, conductive particle manufacturing method, anisotropic conductive material, and connective structure
WO2011162137A1 (ja) 接合体及びその製造方法
JP2011049186A (ja) 異方性導電材料及びその製造方法
JP2019137866A (ja) 半導体用接着剤、並びに、半導体装置及びその製造方法
WO2011152421A1 (ja) 異方性導電膜及びその製造方法
JP2011233633A (ja) 回路接続材料及び回路部材の接続体
EP1657725B1 (en) Insulation-coated electroconductive particles
JPWO2018225191A1 (ja) 半導体用フィルム状接着剤、半導体装置の製造方法及び半導体装置
JP5816456B2 (ja) 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体
JP4635287B2 (ja) 異方性導電フィルム
TWI795388B (zh) 接著劑膜
JP7235611B2 (ja) 導電材料及び接続構造体
KR102674579B1 (ko) 절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid