KR20140010000A - 금속 나노입자 망 함유 투명 전도성 필름의 그라비어 인쇄 - Google Patents
금속 나노입자 망 함유 투명 전도성 필름의 그라비어 인쇄 Download PDFInfo
- Publication number
- KR20140010000A KR20140010000A KR1020137015440A KR20137015440A KR20140010000A KR 20140010000 A KR20140010000 A KR 20140010000A KR 1020137015440 A KR1020137015440 A KR 1020137015440A KR 20137015440 A KR20137015440 A KR 20137015440A KR 20140010000 A KR20140010000 A KR 20140010000A
- Authority
- KR
- South Korea
- Prior art keywords
- gravure
- nanowires
- ink
- cell
- transparent conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Methods (AREA)
- Manufacturing Of Electric Cables (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42321410P | 2010-12-15 | 2010-12-15 | |
| US61/423,214 | 2010-12-15 | ||
| US13/294,355 | 2011-11-11 | ||
| US13/294,355 US8763525B2 (en) | 2010-12-15 | 2011-11-11 | Gravure printing of transparent conductive films containing networks of metal nanoparticles |
| PCT/US2011/060492 WO2012082281A1 (en) | 2010-12-15 | 2011-11-12 | Gravure printing of transparent conductive films containing networks of metal nanoparticles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140010000A true KR20140010000A (ko) | 2014-01-23 |
Family
ID=46232665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137015440A Withdrawn KR20140010000A (ko) | 2010-12-15 | 2011-11-12 | 금속 나노입자 망 함유 투명 전도성 필름의 그라비어 인쇄 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8763525B2 (enExample) |
| EP (1) | EP2653016A1 (enExample) |
| JP (1) | JP5856625B2 (enExample) |
| KR (1) | KR20140010000A (enExample) |
| CN (1) | CN103262664B (enExample) |
| TW (1) | TW201231297A (enExample) |
| WO (1) | WO2012082281A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9441117B2 (en) * | 2012-03-20 | 2016-09-13 | Basf Se | Mixtures, methods and compositions pertaining to conductive materials |
| US10029916B2 (en) | 2012-06-22 | 2018-07-24 | C3Nano Inc. | Metal nanowire networks and transparent conductive material |
| US9920207B2 (en) | 2012-06-22 | 2018-03-20 | C3Nano Inc. | Metal nanostructured networks and transparent conductive material |
| US10020807B2 (en) | 2013-02-26 | 2018-07-10 | C3Nano Inc. | Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks |
| US11343911B1 (en) | 2014-04-11 | 2022-05-24 | C3 Nano, Inc. | Formable transparent conductive films with metal nanowires |
| CN110666154B (zh) * | 2014-04-11 | 2022-02-22 | 凯姆控股有限公司 | 控制纳米线形态的方法 |
| US9183968B1 (en) | 2014-07-31 | 2015-11-10 | C3Nano Inc. | Metal nanowire inks for the formation of transparent conductive films with fused networks |
| CN112930575B (zh) | 2019-05-31 | 2022-06-07 | 昭和电工株式会社 | 透明导电膜的制造方法 |
| WO2021131099A1 (ja) | 2019-12-27 | 2021-07-01 | 昭和電工株式会社 | 透明導電フィルムの製造方法 |
| JP6855648B1 (ja) | 2019-12-27 | 2021-04-07 | 昭和電工株式会社 | 透明導電フィルムの製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60231252D1 (de) * | 2001-12-17 | 2009-04-02 | Univ Northwestern | Strukturierung von solid-state-merkmalen durch nanolithographisches direktschreibedrucken |
| US6872645B2 (en) * | 2002-04-02 | 2005-03-29 | Nanosys, Inc. | Methods of positioning and/or orienting nanostructures |
| CA2572798A1 (en) * | 2004-07-07 | 2006-07-27 | Nanosys, Inc. | Systems and methods for harvesting and integrating nanowires |
| KR20120128155A (ko) * | 2005-08-12 | 2012-11-26 | 캄브리오스 테크놀로지즈 코포레이션 | 나노와이어 기반의 투명 도전체 |
| EP3595016A1 (en) * | 2006-10-12 | 2020-01-15 | Cambrios Film Solutions Corporation | Nanowire-based transparent conductors and method of making them |
| US8018568B2 (en) | 2006-10-12 | 2011-09-13 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
| EP2477229B1 (en) * | 2007-04-20 | 2021-06-23 | Cambrios Film Solutions Corporation | Composite transparent conductors and methods of forming the same |
| JP2009062523A (ja) * | 2007-08-10 | 2009-03-26 | Think Laboratory Co Ltd | 導電性インキ組成物 |
| GB0717055D0 (en) * | 2007-09-01 | 2007-10-17 | Eastman Kodak Co | An electronic device |
| WO2009063744A1 (ja) * | 2007-11-16 | 2009-05-22 | Konica Minolta Holdings, Inc. | 金属ナノワイヤの製造方法、金属ナノワイヤ及び透明導電体 |
| CN101553084B (zh) * | 2008-04-01 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | 线路基板及线路基板的制作方法 |
| CN102365753A (zh) * | 2008-10-30 | 2012-02-29 | 纳米太阳能公司 | 混合型透明导电电极 |
| JP2010250110A (ja) | 2009-04-16 | 2010-11-04 | Fujifilm Corp | 感光性組成物、並びに透明導電膜、表示素子及び集積型太陽電池 |
| JP5609008B2 (ja) * | 2009-05-12 | 2014-10-22 | コニカミノルタ株式会社 | 透明導電フィルム、透明導電フィルムの製造方法及び電子デバイス用透明電極 |
-
2011
- 2011-11-11 US US13/294,355 patent/US8763525B2/en not_active Expired - Fee Related
- 2011-11-12 JP JP2013544490A patent/JP5856625B2/ja not_active Expired - Fee Related
- 2011-11-12 KR KR1020137015440A patent/KR20140010000A/ko not_active Withdrawn
- 2011-11-12 EP EP11802185.6A patent/EP2653016A1/en not_active Withdrawn
- 2011-11-12 WO PCT/US2011/060492 patent/WO2012082281A1/en not_active Ceased
- 2011-11-12 CN CN201180060685.3A patent/CN103262664B/zh not_active Expired - Fee Related
- 2011-12-02 TW TW100144465A patent/TW201231297A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US8763525B2 (en) | 2014-07-01 |
| TW201231297A (en) | 2012-08-01 |
| EP2653016A1 (en) | 2013-10-23 |
| WO2012082281A1 (en) | 2012-06-21 |
| CN103262664A (zh) | 2013-08-21 |
| US20120152135A1 (en) | 2012-06-21 |
| CN103262664B (zh) | 2016-05-18 |
| JP2014507746A (ja) | 2014-03-27 |
| JP5856625B2 (ja) | 2016-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |