KR20140010000A - 금속 나노입자 망 함유 투명 전도성 필름의 그라비어 인쇄 - Google Patents

금속 나노입자 망 함유 투명 전도성 필름의 그라비어 인쇄 Download PDF

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Publication number
KR20140010000A
KR20140010000A KR1020137015440A KR20137015440A KR20140010000A KR 20140010000 A KR20140010000 A KR 20140010000A KR 1020137015440 A KR1020137015440 A KR 1020137015440A KR 20137015440 A KR20137015440 A KR 20137015440A KR 20140010000 A KR20140010000 A KR 20140010000A
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KR
South Korea
Prior art keywords
gravure
nanowires
ink
cell
transparent conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137015440A
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English (en)
Korean (ko)
Inventor
차오펑 조우
매튜 티 스테빈스
제니퍼 씨 도슨
캐리사 엘 에커트
개리 이 라벨
Original Assignee
케어스트림 헬스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 케어스트림 헬스 인코포레이티드 filed Critical 케어스트림 헬스 인코포레이티드
Publication of KR20140010000A publication Critical patent/KR20140010000A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Printing Methods (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020137015440A 2010-12-15 2011-11-12 금속 나노입자 망 함유 투명 전도성 필름의 그라비어 인쇄 Withdrawn KR20140010000A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US42321410P 2010-12-15 2010-12-15
US61/423,214 2010-12-15
US13/294,355 2011-11-11
US13/294,355 US8763525B2 (en) 2010-12-15 2011-11-11 Gravure printing of transparent conductive films containing networks of metal nanoparticles
PCT/US2011/060492 WO2012082281A1 (en) 2010-12-15 2011-11-12 Gravure printing of transparent conductive films containing networks of metal nanoparticles

Publications (1)

Publication Number Publication Date
KR20140010000A true KR20140010000A (ko) 2014-01-23

Family

ID=46232665

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015440A Withdrawn KR20140010000A (ko) 2010-12-15 2011-11-12 금속 나노입자 망 함유 투명 전도성 필름의 그라비어 인쇄

Country Status (7)

Country Link
US (1) US8763525B2 (enExample)
EP (1) EP2653016A1 (enExample)
JP (1) JP5856625B2 (enExample)
KR (1) KR20140010000A (enExample)
CN (1) CN103262664B (enExample)
TW (1) TW201231297A (enExample)
WO (1) WO2012082281A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9441117B2 (en) * 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
CN106573299B (zh) * 2014-04-11 2020-02-18 凯姆控股有限公司 控制纳米线形态的方法
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
KR102387063B1 (ko) 2019-05-31 2022-04-15 쇼와 덴코 가부시키가이샤 투명 도전 필름의 제조 방법
KR102316141B1 (ko) 2019-12-27 2021-10-22 쇼와 덴코 가부시키가이샤 투명 도전 필름의 제조 방법
JP6855648B1 (ja) 2019-12-27 2021-04-07 昭和電工株式会社 透明導電フィルムの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI287170B (en) * 2001-12-17 2007-09-21 Univ Northwestern Patterning of solid state features by direct write nanolithographic printing
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
WO2006078281A2 (en) * 2004-07-07 2006-07-27 Nanosys, Inc. Systems and methods for harvesting and integrating nanowires
EP1965438A3 (en) * 2005-08-12 2009-05-13 Cambrios Technologies Corporation Nanowires-based transparent conductors
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
CN102324462B (zh) * 2006-10-12 2015-07-01 凯博瑞奥斯技术公司 基于纳米线的透明导体及其应用
US20090321364A1 (en) * 2007-04-20 2009-12-31 Cambrios Technologies Corporation Systems and methods for filtering nanowires
JP2009062523A (ja) * 2007-08-10 2009-03-26 Think Laboratory Co Ltd 導電性インキ組成物
GB0717055D0 (en) * 2007-09-01 2007-10-17 Eastman Kodak Co An electronic device
JPWO2009063744A1 (ja) 2007-11-16 2011-03-31 コニカミノルタホールディングス株式会社 金属ナノワイヤの製造方法、金属ナノワイヤ及び透明導電体
CN101553084B (zh) * 2008-04-01 2010-12-08 富葵精密组件(深圳)有限公司 线路基板及线路基板的制作方法
JP2012507872A (ja) * 2008-10-30 2012-03-29 フェイ プーン、ハク ハイブリッド透明導電性電極
JP2010250110A (ja) * 2009-04-16 2010-11-04 Fujifilm Corp 感光性組成物、並びに透明導電膜、表示素子及び集積型太陽電池
JP5609008B2 (ja) * 2009-05-12 2014-10-22 コニカミノルタ株式会社 透明導電フィルム、透明導電フィルムの製造方法及び電子デバイス用透明電極

Also Published As

Publication number Publication date
EP2653016A1 (en) 2013-10-23
US20120152135A1 (en) 2012-06-21
CN103262664A (zh) 2013-08-21
US8763525B2 (en) 2014-07-01
JP2014507746A (ja) 2014-03-27
JP5856625B2 (ja) 2016-02-10
WO2012082281A1 (en) 2012-06-21
TW201231297A (en) 2012-08-01
CN103262664B (zh) 2016-05-18

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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000