JP2014507746A - 金属ナノ粒子のネットワークを含有する透明導電性フィルムのグラビア印刷 - Google Patents
金属ナノ粒子のネットワークを含有する透明導電性フィルムのグラビア印刷 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Printing Methods (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
LPI≧A−Bln(μ・Log10(U)) 式(1a)
LPI≦C/(Lm+3σ) 式(1b)
式中、
・AおよびBは、ポリマー結合剤および溶媒組成物に固有の定数である。
・Cは、グラビアセルパターンに固有の定数である。
・μは、センチポアズ単位のコーティング溶液粘性である。
・Uは、フィート/分に単位のグラビアコーティングウェブ速度である。
・Lmおよびσは、コーティング溶液においてそれぞれ採用される1次元ナノ粒子のミクロン(μm)単位の平均長および標準偏差である。
A=473ライン/インチ、および、B=67.6ライン/インチ
C=2.5×104μm・ライン/インチ
となることが分かった。
その全体が参照により本明細書に組み込まれる、2010年12月15日付けで出願された「GRAVURE PRINTING OF TRANSPARENT CONDUCTIVE FILMS CONTAINING NETWORKS OF METAL NANOPARTICLES」と題する米国仮出願第61/423,214号は、以下の8つの例示的な実施形態を開示した。
A.ナノワイヤーを備えるインクを調製することであって、前記ナノワイヤーが長さ分布を有し、前記分布が平均Lmおよび標準偏差σを有する、インクを調整することと、
表面および表面中の複数のくぼみを提供することであって、前記複数のくぼみが、LPI(ライン/インチ)の密度を有する、表面および表面中の複数のくぼみを提供することと、
前記複数のくぼみ中に前記インクを転送することと、
インクの少なくとも一部分を、前記くぼみから印刷媒体に転送することであって、LPIが、約2.5×104ミクロンライン/インチ÷(Lm+3σ)未満である、インクの少なくとも一部分を転送することと
を含む、方法。
B.ナノワイヤーのアスペクト比が約50よりも大きい、実施形態Aに記載の方法。
C.インクがポリマー結合剤をさらに備える、実施形態Aに記載の方法。
D.ポリマー結合剤が、少なくとも1つのセルロース系ポリマーを備える、実施形態Cに記載の方法。
E.印刷媒体が、表面に対してU(フィート/分)の速度で移動し、インクの粘性が、μ(cps)であり、LPIが約473〜67.6ln(μ・log10(U))ライン/インチよりも大きい、実施形態Cに記載の方法。
F.表面が輪転グラビアシリンダの外面である、実施形態Aに記載の方法。
G.実施形態Aの方法にしたがって生産される導電性フィルム。
H.実施形態Gに記載の導電性フィルムを備える物品。
以下の成分を備える銀ナノワイヤー分散溶液を準備した。
・銀ナノワイヤー(ノースカロライナ州、シャーロット、Blue Nano)
・セルロースアセテートブチレート(Eastman Chemical、EASTMAN(登録商標)CAB 171−15i)
・脂肪族ポリイソシアネート(Bayer、DESMODUR(登録商標)N3300)
・ネオデカン酸ビスマス(Aldrich)
・メチルエチルケトン(MEK)、乳酸エチル、イソプロパノール
以下成分を備える銀ナノワイヤー分散溶液を調製した。
・銀ナノワイヤー(少なくとも100本のワイヤの測定値に基づいて、平均直径51nm±5.4、平均長さ23.5の±10.0μm)
・セルロースアセテートブチレート(Eastman Chemical、EASTMAN(登録商標)CAB 381−20)
・プロピルアセテート、乳酸エチル、イソプロパノール
Claims (8)
- ナノワイヤーを備えるインクを提供することであって、前記ナノワイヤーが長さ分布を有し、前記分布が平均Lmおよび標準偏差σを有する、インクを提供することと、
表面および前記表面中の複数のくぼみを提供することであって、前記複数のくぼみが、LPI(ライン/インチ)の密度を有する、表面および表面中の複数のくぼみを提供することと、
前記複数のくぼみ中に前記インクを転送することと、
前記インクの少なくとも一部分を、前記くぼみから印刷媒体に転送することであって、LPIが、約2.5×104ミクロンライン/インチ÷(Lm+3σ)未満である、インクの少なくとも一部分を転送することと
を含む、方法。 - 前記ナノワイヤーのアスペクト比が約50よりも大きい、請求項1に記載の方法。
- 前記インクがポリマー結合剤をさらに備える、請求項1に記載の方法。
- 前記ポリマー結合剤が、少なくとも1つのセルロース系ポリマーを備える、請求項3に記載の方法。
- 前記印刷媒体が、前記表面に対してU(フィート/分)の速度で移動し、前記インクの粘性がμ(cps)であり、LPIが約473〜67.6ln(μ・log10(U))ライン/インチよりも大きい、請求項3に記載の方法。
- 前記表面が輪転グラビアシリンダの外面である、請求項1に記載の方法。
- 請求項1の方法にしたがって生産される導電性フィルム。
- 請求項7に記載した導電性フィルムを備える物品。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42321410P | 2010-12-15 | 2010-12-15 | |
US61/423,214 | 2010-12-15 | ||
US13/294,355 | 2011-11-11 | ||
US13/294,355 US8763525B2 (en) | 2010-12-15 | 2011-11-11 | Gravure printing of transparent conductive films containing networks of metal nanoparticles |
PCT/US2011/060492 WO2012082281A1 (en) | 2010-12-15 | 2011-11-12 | Gravure printing of transparent conductive films containing networks of metal nanoparticles |
Publications (3)
Publication Number | Publication Date |
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JP2014507746A true JP2014507746A (ja) | 2014-03-27 |
JP2014507746A5 JP2014507746A5 (ja) | 2014-12-25 |
JP5856625B2 JP5856625B2 (ja) | 2016-02-10 |
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ID=46232665
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Application Number | Title | Priority Date | Filing Date |
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JP2013544490A Expired - Fee Related JP5856625B2 (ja) | 2010-12-15 | 2011-11-12 | 金属ナノ粒子のネットワークを含有する透明導電性フィルムのグラビア印刷 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8763525B2 (ja) |
EP (1) | EP2653016A1 (ja) |
JP (1) | JP5856625B2 (ja) |
KR (1) | KR20140010000A (ja) |
CN (1) | CN103262664B (ja) |
TW (1) | TW201231297A (ja) |
WO (1) | WO2012082281A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015518063A (ja) * | 2012-03-20 | 2015-06-25 | シーシェル テクノロジー, リミテッド ライアビリティー カンパニーSeashell Technology, LLC | 伝導性材料に関する混合物、方法、および組成体 |
KR20210049944A (ko) | 2019-05-31 | 2021-05-06 | 쇼와 덴코 가부시키가이샤 | 투명 도전 필름의 제조 방법 |
KR20210084478A (ko) | 2019-12-27 | 2021-07-07 | 쇼와 덴코 가부시키가이샤 | 투명 도전 필름의 제조 방법 |
US11538603B2 (en) | 2019-12-27 | 2022-12-27 | Showa Denko K.K. | Method for producing transparent conducting film |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10029916B2 (en) | 2012-06-22 | 2018-07-24 | C3Nano Inc. | Metal nanowire networks and transparent conductive material |
US9920207B2 (en) | 2012-06-22 | 2018-03-20 | C3Nano Inc. | Metal nanostructured networks and transparent conductive material |
SG11201608454XA (en) * | 2014-04-11 | 2016-11-29 | Cam Holding Corp | Methods of controlling nanowire morphology |
US11343911B1 (en) | 2014-04-11 | 2022-05-24 | C3 Nano, Inc. | Formable transparent conductive films with metal nanowires |
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Also Published As
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WO2012082281A1 (en) | 2012-06-21 |
US8763525B2 (en) | 2014-07-01 |
CN103262664A (zh) | 2013-08-21 |
CN103262664B (zh) | 2016-05-18 |
EP2653016A1 (en) | 2013-10-23 |
TW201231297A (en) | 2012-08-01 |
US20120152135A1 (en) | 2012-06-21 |
KR20140010000A (ko) | 2014-01-23 |
JP5856625B2 (ja) | 2016-02-10 |
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