TW201231297A - Gravure printing of transparent conductive films containing networks of metal nanoparticles - Google Patents

Gravure printing of transparent conductive films containing networks of metal nanoparticles Download PDF

Info

Publication number
TW201231297A
TW201231297A TW100144465A TW100144465A TW201231297A TW 201231297 A TW201231297 A TW 201231297A TW 100144465 A TW100144465 A TW 100144465A TW 100144465 A TW100144465 A TW 100144465A TW 201231297 A TW201231297 A TW 201231297A
Authority
TW
Taiwan
Prior art keywords
coating
ink
gravure
line
indentations
Prior art date
Application number
TW100144465A
Other languages
English (en)
Chinese (zh)
Inventor
Chaofeng Zou
Mathew T Stebbins
Jennifer C Dawson
Karissa L Eckert
Gary E Labelle
Original Assignee
Carestream Health Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carestream Health Inc filed Critical Carestream Health Inc
Publication of TW201231297A publication Critical patent/TW201231297A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/10Intaglio printing ; Gravure printing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/0248Needles or elongated particles; Elongated cluster of chemically bonded particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/026Nanotubes or nanowires
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Printing Methods (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW100144465A 2010-12-15 2011-12-02 Gravure printing of transparent conductive films containing networks of metal nanoparticles TW201231297A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42321410P 2010-12-15 2010-12-15
US13/294,355 US8763525B2 (en) 2010-12-15 2011-11-11 Gravure printing of transparent conductive films containing networks of metal nanoparticles

Publications (1)

Publication Number Publication Date
TW201231297A true TW201231297A (en) 2012-08-01

Family

ID=46232665

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100144465A TW201231297A (en) 2010-12-15 2011-12-02 Gravure printing of transparent conductive films containing networks of metal nanoparticles

Country Status (7)

Country Link
US (1) US8763525B2 (enExample)
EP (1) EP2653016A1 (enExample)
JP (1) JP5856625B2 (enExample)
KR (1) KR20140010000A (enExample)
CN (1) CN103262664B (enExample)
TW (1) TW201231297A (enExample)
WO (1) WO2012082281A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9441117B2 (en) * 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
CN106573299B (zh) * 2014-04-11 2020-02-18 凯姆控股有限公司 控制纳米线形态的方法
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
KR102387063B1 (ko) 2019-05-31 2022-04-15 쇼와 덴코 가부시키가이샤 투명 도전 필름의 제조 방법
KR102316141B1 (ko) 2019-12-27 2021-10-22 쇼와 덴코 가부시키가이샤 투명 도전 필름의 제조 방법
JP6855648B1 (ja) 2019-12-27 2021-04-07 昭和電工株式会社 透明導電フィルムの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI287170B (en) * 2001-12-17 2007-09-21 Univ Northwestern Patterning of solid state features by direct write nanolithographic printing
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
WO2006078281A2 (en) * 2004-07-07 2006-07-27 Nanosys, Inc. Systems and methods for harvesting and integrating nanowires
EP1965438A3 (en) * 2005-08-12 2009-05-13 Cambrios Technologies Corporation Nanowires-based transparent conductors
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
CN102324462B (zh) * 2006-10-12 2015-07-01 凯博瑞奥斯技术公司 基于纳米线的透明导体及其应用
US20090321364A1 (en) * 2007-04-20 2009-12-31 Cambrios Technologies Corporation Systems and methods for filtering nanowires
JP2009062523A (ja) * 2007-08-10 2009-03-26 Think Laboratory Co Ltd 導電性インキ組成物
GB0717055D0 (en) * 2007-09-01 2007-10-17 Eastman Kodak Co An electronic device
JPWO2009063744A1 (ja) 2007-11-16 2011-03-31 コニカミノルタホールディングス株式会社 金属ナノワイヤの製造方法、金属ナノワイヤ及び透明導電体
CN101553084B (zh) * 2008-04-01 2010-12-08 富葵精密组件(深圳)有限公司 线路基板及线路基板的制作方法
JP2012507872A (ja) * 2008-10-30 2012-03-29 フェイ プーン、ハク ハイブリッド透明導電性電極
JP2010250110A (ja) * 2009-04-16 2010-11-04 Fujifilm Corp 感光性組成物、並びに透明導電膜、表示素子及び集積型太陽電池
JP5609008B2 (ja) * 2009-05-12 2014-10-22 コニカミノルタ株式会社 透明導電フィルム、透明導電フィルムの製造方法及び電子デバイス用透明電極

Also Published As

Publication number Publication date
EP2653016A1 (en) 2013-10-23
US20120152135A1 (en) 2012-06-21
CN103262664A (zh) 2013-08-21
US8763525B2 (en) 2014-07-01
JP2014507746A (ja) 2014-03-27
JP5856625B2 (ja) 2016-02-10
WO2012082281A1 (en) 2012-06-21
CN103262664B (zh) 2016-05-18
KR20140010000A (ko) 2014-01-23

Similar Documents

Publication Publication Date Title
TW201231297A (en) Gravure printing of transparent conductive films containing networks of metal nanoparticles
JP5818822B2 (ja) 増加ヘイズを有するナノ構造系透明導電体およびそれを備えるデバイス
JP6924789B2 (ja) パターン化された透明導電体の製造方法
KR102032108B1 (ko) 금속성 나노섬유 잉크, 실질적으로 투명한 전도체, 및 제조 방법
KR102145157B1 (ko) 기재 상에 투명 전도체를 제조하는 방법
CN104321828B (zh) 关于传导材料的混合物、方法以及组合物
CN105453001B (zh) 将电子部件粘结到图案化纳米线透明导体
US10392519B2 (en) Composition comprising silver nanowires and fibers of crystalline cellulose for the preparation of electroconductive transparent layers
KR102687588B1 (ko) 도전체, 도전성 구조물, 및 이를 포함하는 전자 소자
JP2018500194A (ja) 透明コーティングおよび透明導電性フィルムのための特性強化充填剤
JP6480428B2 (ja) パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ
US11052644B2 (en) Electrical conductors, production methods thereof, and electronic devices including the same
JP2008311642A (ja) アミン化合物を含むカーボンナノチューブ(cnt)薄膜及びその製造方法
CN111883286A (zh) 一种透明导电膜的制备方法及透明导电膜
CN111161906A (zh) 一种低电阻透明导电膜及其制备方法
JP5775438B2 (ja) 銀微粒子分散液