CN103262664B - 含有金属纳米粒子网络的透明导电膜的凹版印刷 - Google Patents

含有金属纳米粒子网络的透明导电膜的凹版印刷 Download PDF

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Publication number
CN103262664B
CN103262664B CN201180060685.3A CN201180060685A CN103262664B CN 103262664 B CN103262664 B CN 103262664B CN 201180060685 A CN201180060685 A CN 201180060685A CN 103262664 B CN103262664 B CN 103262664B
Authority
CN
China
Prior art keywords
gravure
nanowires
coating
transparent conductive
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180060685.3A
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English (en)
Chinese (zh)
Other versions
CN103262664A (zh
Inventor
C.邹
M.T.斯特宾斯
J.C.道森
K.L.埃克特
G.E.拉贝勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carestream Health Inc
Original Assignee
Carestream Health Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carestream Health Inc filed Critical Carestream Health Inc
Publication of CN103262664A publication Critical patent/CN103262664A/zh
Application granted granted Critical
Publication of CN103262664B publication Critical patent/CN103262664B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Printing Methods (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201180060685.3A 2010-12-15 2011-11-12 含有金属纳米粒子网络的透明导电膜的凹版印刷 Expired - Fee Related CN103262664B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US42321410P 2010-12-15 2010-12-15
US61/423,214 2010-12-15
US61/423214 2010-12-15
US13/294,355 2011-11-11
US13/294355 2011-11-11
US13/294,355 US8763525B2 (en) 2010-12-15 2011-11-11 Gravure printing of transparent conductive films containing networks of metal nanoparticles
PCT/US2011/060492 WO2012082281A1 (en) 2010-12-15 2011-11-12 Gravure printing of transparent conductive films containing networks of metal nanoparticles

Publications (2)

Publication Number Publication Date
CN103262664A CN103262664A (zh) 2013-08-21
CN103262664B true CN103262664B (zh) 2016-05-18

Family

ID=46232665

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180060685.3A Expired - Fee Related CN103262664B (zh) 2010-12-15 2011-11-12 含有金属纳米粒子网络的透明导电膜的凹版印刷

Country Status (7)

Country Link
US (1) US8763525B2 (enExample)
EP (1) EP2653016A1 (enExample)
JP (1) JP5856625B2 (enExample)
KR (1) KR20140010000A (enExample)
CN (1) CN103262664B (enExample)
TW (1) TW201231297A (enExample)
WO (1) WO2012082281A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9441117B2 (en) * 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
CN106573299B (zh) * 2014-04-11 2020-02-18 凯姆控股有限公司 控制纳米线形态的方法
US9183968B1 (en) 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
KR102387063B1 (ko) 2019-05-31 2022-04-15 쇼와 덴코 가부시키가이샤 투명 도전 필름의 제조 방법
KR102316141B1 (ko) 2019-12-27 2021-10-22 쇼와 덴코 가부시키가이샤 투명 도전 필름의 제조 방법
JP6855648B1 (ja) 2019-12-27 2021-04-07 昭和電工株式会社 透明導電フィルムの製造方法

Citations (4)

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US20090130433A1 (en) * 2007-11-16 2009-05-21 Konica Minolta Holdings, Inc. Manufacturing method of metal nanowire, metal nanowire and transparent electric conductor
CN101553084A (zh) * 2008-04-01 2009-10-07 富葵精密组件(深圳)有限公司 线路基板及线路基板的制作方法
CN101689568A (zh) * 2007-04-20 2010-03-31 凯博瑞奥斯技术公司 复合透明导体及其形成方法
US20100264378A1 (en) * 2009-04-16 2010-10-21 Fujifilm Corporation Photosensitive composition, transparent conductive film, display element and integrated solar battery

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Publication number Priority date Publication date Assignee Title
TWI287170B (en) * 2001-12-17 2007-09-21 Univ Northwestern Patterning of solid state features by direct write nanolithographic printing
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
WO2006078281A2 (en) * 2004-07-07 2006-07-27 Nanosys, Inc. Systems and methods for harvesting and integrating nanowires
EP1965438A3 (en) * 2005-08-12 2009-05-13 Cambrios Technologies Corporation Nanowires-based transparent conductors
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
CN102324462B (zh) * 2006-10-12 2015-07-01 凯博瑞奥斯技术公司 基于纳米线的透明导体及其应用
JP2009062523A (ja) * 2007-08-10 2009-03-26 Think Laboratory Co Ltd 導電性インキ組成物
GB0717055D0 (en) * 2007-09-01 2007-10-17 Eastman Kodak Co An electronic device
JP2012507872A (ja) * 2008-10-30 2012-03-29 フェイ プーン、ハク ハイブリッド透明導電性電極
JP5609008B2 (ja) * 2009-05-12 2014-10-22 コニカミノルタ株式会社 透明導電フィルム、透明導電フィルムの製造方法及び電子デバイス用透明電極

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101689568A (zh) * 2007-04-20 2010-03-31 凯博瑞奥斯技术公司 复合透明导体及其形成方法
US20090130433A1 (en) * 2007-11-16 2009-05-21 Konica Minolta Holdings, Inc. Manufacturing method of metal nanowire, metal nanowire and transparent electric conductor
CN101553084A (zh) * 2008-04-01 2009-10-07 富葵精密组件(深圳)有限公司 线路基板及线路基板的制作方法
US20100264378A1 (en) * 2009-04-16 2010-10-21 Fujifilm Corporation Photosensitive composition, transparent conductive film, display element and integrated solar battery

Also Published As

Publication number Publication date
EP2653016A1 (en) 2013-10-23
US20120152135A1 (en) 2012-06-21
CN103262664A (zh) 2013-08-21
US8763525B2 (en) 2014-07-01
JP2014507746A (ja) 2014-03-27
JP5856625B2 (ja) 2016-02-10
WO2012082281A1 (en) 2012-06-21
TW201231297A (en) 2012-08-01
KR20140010000A (ko) 2014-01-23

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Granted publication date: 20160518

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CF01 Termination of patent right due to non-payment of annual fee