CN101553084A - 线路基板及线路基板的制作方法 - Google Patents
线路基板及线路基板的制作方法 Download PDFInfo
- Publication number
- CN101553084A CN101553084A CNA2008103008090A CN200810300809A CN101553084A CN 101553084 A CN101553084 A CN 101553084A CN A2008103008090 A CNA2008103008090 A CN A2008103008090A CN 200810300809 A CN200810300809 A CN 200810300809A CN 101553084 A CN101553084 A CN 101553084A
- Authority
- CN
- China
- Prior art keywords
- tube
- base plate
- carbon nano
- metal
- circuit base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000002082 metal nanoparticle Substances 0.000 claims abstract description 59
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 43
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 22
- 238000007639 printing Methods 0.000 claims description 20
- 238000007641 inkjet printing Methods 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 239000002109 single walled nanotube Substances 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000004220 aggregation Methods 0.000 claims description 4
- 230000002776 aggregation Effects 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000002079 double walled nanotube Substances 0.000 claims description 4
- 229910021645 metal ion Inorganic materials 0.000 claims description 4
- 239000002048 multi walled nanotube Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 230000000844 anti-bacterial effect Effects 0.000 claims description 2
- 239000003899 bactericide agent Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 229960001484 edetic acid Drugs 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
- Y10T428/2462—Composite web or sheet with partial filling of valleys on outer surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/32—Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810300809.0A CN101553084B (zh) | 2008-04-01 | 2008-04-01 | 线路基板及线路基板的制作方法 |
US12/253,869 US8071887B2 (en) | 2008-04-01 | 2008-10-17 | Printed circuit board and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810300809.0A CN101553084B (zh) | 2008-04-01 | 2008-04-01 | 线路基板及线路基板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101553084A true CN101553084A (zh) | 2009-10-07 |
CN101553084B CN101553084B (zh) | 2010-12-08 |
Family
ID=41115395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810300809.0A Expired - Fee Related CN101553084B (zh) | 2008-04-01 | 2008-04-01 | 线路基板及线路基板的制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8071887B2 (zh) |
CN (1) | CN101553084B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102782054A (zh) * | 2010-03-04 | 2012-11-14 | 格尔德殿工业公司 | 制备一个涂覆物、涂层包括合金化cnt薄膜的方法 |
CN102993820A (zh) * | 2012-03-28 | 2013-03-27 | 杨阳 | 一种碳纳米材料/金属纳米材料复合纳米油墨 |
CN103262664A (zh) * | 2010-12-15 | 2013-08-21 | 卡尔斯特里姆保健公司 | 含有金属纳米粒子网络的透明导电膜的凹版印刷 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2009084155A1 (ja) * | 2007-12-27 | 2009-07-09 | Panasonic Corporation | 接合材料、電子部品および接合構造体 |
DE102009054427B4 (de) * | 2009-11-25 | 2014-02-13 | Kme Germany Ag & Co. Kg | Verfahren zum Aufbringen von Gemengen aus Kohlenstoff und Metallpartikeln auf ein Substrat, nach dem Verfahren erhältliches Substrat und dessen Verwendung |
US20120273255A1 (en) * | 2011-04-26 | 2012-11-01 | Tyco Electronics Corporation | Electrical Conductors Having Organic Compound Coatings |
US20130048342A1 (en) * | 2011-08-23 | 2013-02-28 | Tyco Electronics Corporation | Circuit board |
JP2013135089A (ja) * | 2011-12-27 | 2013-07-08 | Ishihara Chem Co Ltd | 導電膜形成方法、銅微粒子分散液及び回路基板 |
DE102012214440B3 (de) * | 2012-08-14 | 2013-10-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Planaroptisches Element, Sensorelement und Verfahren zu deren Herstellung |
CN106094366B (zh) * | 2016-08-23 | 2019-02-01 | 深圳市华星光电技术有限公司 | Ips型阵列基板的制作方法及ips型阵列基板 |
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US20060057742A1 (en) * | 2004-09-08 | 2006-03-16 | Hitachi Cable, Ltd. | Method of forming CNT containing wiring material and sputtering target material used for the method |
CN101089058A (zh) * | 2006-06-14 | 2007-12-19 | 三星电机株式会社 | 用于喷墨打印的导电油墨组合物 |
US20070298161A1 (en) * | 2003-12-12 | 2007-12-27 | Yoshihide Yamaguchi | Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board |
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JPH10265207A (ja) * | 1997-03-24 | 1998-10-06 | Kagaku Gijutsu Shinko Jigyodan | フラーレン含有構造体およびその製造方法 |
JP2003203450A (ja) * | 2001-12-28 | 2003-07-18 | Alps Electric Co Ltd | 磁気ヘッド |
JP2003257797A (ja) * | 2002-02-27 | 2003-09-12 | Toshiba Corp | 電気二重層キャパシタ |
JP4382364B2 (ja) * | 2002-04-24 | 2009-12-09 | 株式会社東芝 | 液体インク |
US20050156318A1 (en) * | 2004-01-15 | 2005-07-21 | Douglas Joel S. | Security marking and security mark |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US8248599B2 (en) * | 2006-06-21 | 2012-08-21 | University Of Dayton | Methods of polarization engineering and their applications |
DE502006003829D1 (de) * | 2006-10-31 | 2009-07-09 | Alcan Tech & Man Ltd | Werkstoffe enthaltend Kohlenstoffnanoröhrchen, Verfahren zu deren Herstellung und Verwendung der Werkstoffe |
CN101622712B (zh) * | 2006-11-07 | 2011-06-15 | 希百特股份有限公司 | 双端开关装置及其制造方法 |
CA2669224A1 (en) * | 2006-11-21 | 2008-10-23 | Ge Healthcare Bio-Sciences Corp. | Assembling and utilizing rfid sensors in containers |
JP4880533B2 (ja) * | 2007-07-03 | 2012-02-22 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電膜及びその製造方法、並びに接合体 |
US7742673B2 (en) * | 2007-09-28 | 2010-06-22 | General Electric Company | Thermal mangement article having thermal wave guide |
US20090142636A1 (en) * | 2007-11-30 | 2009-06-04 | Kiyoshi Handa | Carbon Fiber Warming System for Fiber Composite Gas Storage Cylinders |
US9564629B2 (en) * | 2008-01-02 | 2017-02-07 | Nanotek Instruments, Inc. | Hybrid nano-filament anode compositions for lithium ion batteries |
US8435676B2 (en) * | 2008-01-09 | 2013-05-07 | Nanotek Instruments, Inc. | Mixed nano-filament electrode materials for lithium ion batteries |
US20090186276A1 (en) * | 2008-01-18 | 2009-07-23 | Aruna Zhamu | Hybrid nano-filament cathode compositions for lithium metal or lithium ion batteries |
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2008
- 2008-04-01 CN CN200810300809.0A patent/CN101553084B/zh not_active Expired - Fee Related
- 2008-10-17 US US12/253,869 patent/US8071887B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070298161A1 (en) * | 2003-12-12 | 2007-12-27 | Yoshihide Yamaguchi | Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board |
US20060057742A1 (en) * | 2004-09-08 | 2006-03-16 | Hitachi Cable, Ltd. | Method of forming CNT containing wiring material and sputtering target material used for the method |
CN101089058A (zh) * | 2006-06-14 | 2007-12-19 | 三星电机株式会社 | 用于喷墨打印的导电油墨组合物 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102782054A (zh) * | 2010-03-04 | 2012-11-14 | 格尔德殿工业公司 | 制备一个涂覆物、涂层包括合金化cnt薄膜的方法 |
CN102782054B (zh) * | 2010-03-04 | 2017-06-06 | 格尔德殿工业公司 | 制备一个涂覆物、涂层包括合金化cnt薄膜的方法 |
CN103262664A (zh) * | 2010-12-15 | 2013-08-21 | 卡尔斯特里姆保健公司 | 含有金属纳米粒子网络的透明导电膜的凹版印刷 |
CN103262664B (zh) * | 2010-12-15 | 2016-05-18 | 卡尔斯特里姆保健公司 | 含有金属纳米粒子网络的透明导电膜的凹版印刷 |
CN102993820A (zh) * | 2012-03-28 | 2013-03-27 | 杨阳 | 一种碳纳米材料/金属纳米材料复合纳米油墨 |
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US20090242246A1 (en) | 2009-10-01 |
CN101553084B (zh) | 2010-12-08 |
US8071887B2 (en) | 2011-12-06 |
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