CN101553084A - 线路基板及线路基板的制作方法 - Google Patents

线路基板及线路基板的制作方法 Download PDF

Info

Publication number
CN101553084A
CN101553084A CNA2008103008090A CN200810300809A CN101553084A CN 101553084 A CN101553084 A CN 101553084A CN A2008103008090 A CNA2008103008090 A CN A2008103008090A CN 200810300809 A CN200810300809 A CN 200810300809A CN 101553084 A CN101553084 A CN 101553084A
Authority
CN
China
Prior art keywords
tube
base plate
carbon nano
metal
circuit base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2008103008090A
Other languages
English (en)
Other versions
CN101553084B (zh
Inventor
刘兴泽
白耀文
林承贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Peng Ding Polytron Technologies Inc
Avary Holding Shenzhen Co Ltd
Original Assignee
Honsentech Co Ltd
Fukui Precision Component Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honsentech Co Ltd, Fukui Precision Component Shenzhen Co Ltd filed Critical Honsentech Co Ltd
Priority to CN200810300809.0A priority Critical patent/CN101553084B/zh
Priority to US12/253,869 priority patent/US8071887B2/en
Publication of CN101553084A publication Critical patent/CN101553084A/zh
Application granted granted Critical
Publication of CN101553084B publication Critical patent/CN101553084B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/026Nanotubes or nanowires
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0263Details about a collection of particles
    • H05K2201/0272Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0323Carbon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612Composite web or sheet
    • Y10T428/2462Composite web or sheet with partial filling of valleys on outer surface
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/30Self-sustaining carbon mass or layer with impregnant or other layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/32Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明提供一种线路基板,其包括基材及形成于基材表面的导电线路,该导电线路包括碳纳米管与金属纳米粒子的复合物及镀覆于该复合物表面的金属。该镀覆金属填充于相邻两个金属纳米粒子的间隙,使该两个金属纳米粒子通过该金属完全结合,从而实现良好的电性导通。本发明还提供一种线路基板的制作方法。该线路基板具有良好的导电性,且减小导电线路与基材之间涨缩程度的差异。

Description

线路基板及线路基板的制作方法
技术领域
本发明涉及喷墨印刷技术领域,特别涉及一种线路基板及线路基板的制作方法。
背景技术
喷墨印刷(也称之为:喷墨打印)作为一种印刷工艺,其与平版印刷、丝网印刷一样可用于图形的转移。喷墨印刷为非接触印刷工艺,不需要像活字以及由照相方法制作的印版或软片那样印刷表面,只需将所需图形直接由计算机给出,再通过控制器控制喷墨印刷系统的喷嘴,将油墨颗粒由喷嘴喷出并逐点地形成图形。喷墨印刷可应用在电路板线路制作中,即喷墨印刷线路图形。该方法制作线路图形能够精确控制线路的位置及宽度,还降低原料浪费,是一种环保的印刷工艺。
目前,喷墨印刷线路图形是将以单分散的纳米颗粒为核心的金属纳米油墨直接喷射在线路基板表面形成导电线路。请参阅文献:李江,纳米油墨及其应用技术,材料与制备,2005,3:25-29。然而,喷射在线路基板表面的金属纳米油墨干燥后,还需经过300度高温烧结,使金属纳米颗粒烧结在一起,从而形成连续的导电线路。但是,烧结过程中,温度控制不佳会影响导电线路的连续性及导电性。如烧结温度过低,金属纳米颗粒不能完全被烧结在一起;相反地,烧结温度过高,则线路基板必须采用耐高温且不易受热变形材料制成。另外,由金属纳米油墨烧结后形成的导电线路为金属单质,其热膨胀系数与基材的热膨胀系数相差较大。在受热后,导电线路与基材之间发生不同程度的涨缩,其涨缩程度相差较大,使导电线路与基材易发生剥离,而引起最终电路板产品发生板翘。
发明内容
因此,有必要提供一种线路基板及线路基板的制作方法,避免烧结温度的影响,减小导电线路与基材之间涨缩程度的差异。
以下将以实施例说明一种线路基板及线路基板的制作方法。
所述线路基板包括基材及形成于基材表面的导电线路,该导电线路包括碳纳米管与金属纳米粒子的复合物及镀覆于该复合物表面的金属。该镀覆金属填充于相邻两个金属纳米粒子的间隙,使该两个金属纳米粒子通过该金属完全结合,从而实现良好的电性导通。
所述线路基板的制作方法,其包括以下步骤:将油墨通过喷墨印刷方式在线路基板的基材表面以形成线路图形,该油墨包括碳纳米管与金属纳米粒子的复合物。然后在所述线路图形的表面镀覆金属形成导电线路。
与现有技术相比,该线路基板的导电线路包括碳纳米管与金属纳米粒子的复合物及镀覆于该复合物表面的金属。该碳纳米管可减小金属单质组成的导电线路与基材的涨缩程度的差异,该金属纳米粒子可增加碳纳米管的导电性。镀覆于该复合物表面的金属填充于相邻两个金属纳米粒子的间隙,使该两个金属纳米粒子通过该金属完全结合,从而实现良好的电性导通。因此,该线路基板具有良好导电性的导电线路,且线路基板不易发生板翘。另外,该线路基板的制作方法通过镀覆金属的方法替代高温烧结,以形成具有良好导电性的导电线路,避免烧结温度的影响对线路基板的影响。
附图说明
图1是本技术方案实施例提供的基材的结构示意图。
图2是图1中基材形成线路图形的结构示意图。
图3是图1中基材形成导电线路的结构示意图。
具体实施方式
下面将结合附图及实施例对本技术方案实施例提供的线路基板及线路基板的制作方法作进一步详细说明。
请参阅图1至图3,本实施例提供的线路基板及线路基板的制作方法。
第一步:提供基材100。
如图1所示,本实施例中,基材100为需要进行线路制作的半成品。根据需要可以选择不同结构的基材100。例如,该基材100可为一层绝缘层,该绝缘层可采用聚酰亚胺、聚酯、液晶聚合物等绝缘材料制作而成。该基材100也可由多层线路板与一层绝缘层压合后所形成的复合结构。此外,基材100还可为半导体基片。本实施例中,基材100为需要制作单面线路的一层绝缘层。该基材100具有用于形成导电线路的表面110。当然,该基材100也可用于制作双面板,只要在基材100相对设置的两个表面上制作导电线路即可。
第二步:形成线路图形200于基材100的表面110。
为增加形成的线路图形200与基材100表面110的结合强度,在基材100形成线路图形200之前,可通过氧化处理、紫外线处理、等离子处理、微蚀处理等方法对基材100进行表面处理,以除去附着于表面110的污物、氧化物、油脂等。
如图2所示,分别在基材100的表面110通过喷墨印刷方式形成线路图形200。具体地,喷墨印刷系统在控制器的控制下根据所需制作的导电线路的图形,将油墨自喷嘴逐点喷洒到表面110,使其沉积在表面110形成线路图形200。该油墨包括碳纳米管与金属纳米粒子复合物。该包括碳纳米管与金属纳米粒子复合物的油墨形成的线路图形200与所需制作的导电线路的图形相同。
喷墨印刷设备的频率为1至20Hz,喷嘴的直径为1至100μm,墨滴的体积为1至100pL(pL为墨滴的体积单位,相当于10-15立方米)。由此喷墨印刷设备打印的线路图形200的线路宽度为5至500μm。其中,该喷墨印刷制作线路宽度为5至20μm的线路图形200为最佳。
该碳纳米管与金属纳米粒子的复合物是由金属纳米粒子覆着于碳纳米管的管壁外侧而形成。碳纳米管与金属纳米粒子复合后,碳纳米管可缓解金属单质组成的导电线路与基材100的涨缩程度的差异,同时金属纳米粒子可增加碳纳米管的导电性,因此采用包括碳纳米管与金属纳米粒子复合物的油墨制作的线路图形200具有较好的导电性,且缓解导电线路与基材100涨缩程度的不同。而单纯的金属纳米粒子直接形成的导电线路。该导电线路与基材的热膨胀系数相差较大,使最终电路板产品在受热后,其导电线路与基材的涨缩程度相差较大,易引起电路板板翘。而单纯的碳纳米管导电性较差,不能满足制作导电线路电导通的要求。
该碳纳米管与金属纳米粒子复合物可通过电沉积、化学镀、直接吸附金属纳米粒子等方法使金属纳米粒子覆着于碳纳米管的管壁外侧制备而成,也可以通过在碳纳米管的管壁外侧吸附金属离子,再将金属离子经过还原反应还原为金属纳米粒子,从而使金属纳米粒子覆着于碳纳米管的管壁外侧。具体制备方法及制备参数可参阅文献Jingbiao Cui,Charles P.Daghlian,and Ursula J.Gibson,Journal of the American Chemical Socity,2005,109,11456-11460;Bernadette M.Quinn,Cees Dekker,and Serge G.Lemay,Journalof the American Chemical Socity,2005,127,6146-6147;Dan Wang,Zi-Chen Li,andLiwei Chen,Journal of the American Chemical Socity,2006,128,15078-15079;Syed Mubeen,Syed Mubeen,Ting Zhang,Bongyoung Yoo,Marc A.Deshusses,andNosang V.Myung,Journal of the American Chemical Socity,2007,111,6321-6327。
碳纳米管可以为分散的单壁碳纳米管、双壁碳纳米管或多壁碳纳米管,也可以为单壁碳纳米管、双壁碳纳米管或多壁碳纳米管中至少两种碳纳米管的聚集体。该碳纳米管的长度小于500纳米,该碳纳米管聚集体的粒径小于1微米。金属纳米粒子可以为金、银、铜、铂、钯等的金属纳米粒子,其粒径在1纳米至500纳米之间。本实施例中,油墨包括铜覆着单壁碳纳米管形成的复合物。
含有碳纳米管与金属纳米粒子复合物的油墨是将碳纳米管与金属纳米粒子复合物均匀的分散到水、有机溶剂或水溶性介质中而制成。为进一步提高喷出的油墨颗粒与基材100表面110的结合能力,还可在制备过程中,向该油墨中加入表面活性剂、分散剂、保湿剂、防霉剂、杀菌剂及其它试剂,用以调节油墨的稳定性、表面张力、粘度等性能,从而形成与表面110具有较佳结合力的线路图形200。有机溶剂可以为丙酮、乙醇等,水溶性介质可以为去离子水、水溶性有机物或两者的混合物。而表面活性剂可为阳离子活性剂、阴离子活性剂、两性活性剂等,分散剂可为聚乙烯吡咯烷酮、聚乙烯醇等水溶性聚合物,保湿剂可为乙二醇、甘油等。由此得到的油墨,其室温时(即25度)的物理参数具体为:粘度为1至40mPa.s,表面张力20至60mN/m,分散于油墨中的固体颗粒(如:碳纳米管、金属纳米粒子等)的粒径小于2微米,PH值在7至8之间,且具有至少三个月的保存期。
第三步:形成导电线路300于基材100的表面110。
前一步骤中,碳纳米管与金属纳米粒子复合物经喷墨印刷系统喷射至基材100的表面110形成线路图形200时,该线路图形200为分布于表面110的碳纳米管与金属纳米粒子复合物油墨形成。该覆着于碳纳米管管壁外侧的金属纳米粒子虽然可增加碳纳米管的导电性,但是金属纳米粒子间不能完全结合,使形成的线路图形200的连续性变差,从而降低碳纳米管与金属纳米粒子复合物形成的线路图形200的导电性,使整个线路图形200可能无法达到良好的电性导通。
因此,如图3所示,在线路图形200的金属纳米粒子表面经过化学镀或其他镀覆方法镀覆金属,使线路图形200的金属纳米粒子通过金属形成连续的导电线路300。镀覆金属时,形成线路图形200的金属纳米粒子可作为镀覆反应的催化中心,并以该金属纳米粒子为中心在其表面镀覆金属。而没有完全结合的相邻两个金属纳米粒子间可由新镀覆的金属填充,使该两个金属纳米粒子通过该金属完全结合,从而实现良好的电性导通。该金属可与线路图形200的金属纳米粒子的种类相同或不同。本实施例中,采用化学镀的方法镀覆金属,该镀覆的金属与线路图形200的金属纳米粒子均由铜组成。即将线路图形200的表面直接浸入镀液中,通过化学反应镀覆铜单质。该镀液包括铜化合物、还原剂与络合剂。其中,铜化合物可为硫酸铜、氯化铜等;还原剂可为甲醛、乙醛酸等;络合剂可为乙二胺四乙酸、石酸钾钠等络合物。当然,还可在渡液中加入稳定剂、光亮剂等,以满足化学镀的需要。经化学镀铜后,基材100的表面110形成的铜线路(即导电线路300)的宽度为5至500μm,厚度为1至100μm,体积电阻率小于2μΩ.cm。优选地,在表面110形成线路宽度为5至20μm的导电线路300。
由于所镀金属与作为被镀件的线路图形200所包括的金属纳米粒子的组成相同,故可保证在线路图形200形成分布均匀的金属,从而得到线宽与厚度均匀的导电线路300。当然,所镀金属与线路图形200所包括的金属纳米粒子的种类不同时,只要选择合适的镀液即可。
由此完成线路基板400(如图3所示)的制作,以供后续加工使用。该线路基板400包括基材100及形成于基材100的表面110的导电线路300。该导电线路300包括碳纳米管与金属纳米粒子的复合物。
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (13)

1.一种线路基板,其包括基材及形成于基材表面的导电线路,其特征在于,所述导电线路包括碳纳米管与金属纳米粒子的复合物及镀覆于该复合物表面的金属,所述镀覆金属填充于相邻两个金属纳米粒子的间隙,使该两个金属纳米粒子通过该金属完全结合,从而实现良好的电性导通。
2.如权利要求1所述的线路基板,其特征在于,所述碳纳米管与金属纳米粒子的复合物由金属纳米粒子覆着于碳纳米管的管壁外侧而形成。
3.如权利要求1所述的线路基板,其特征在于,所述碳纳米管为单壁碳纳米管、双壁碳纳米管、多壁碳纳米管或单壁碳纳米管、双壁碳纳米管及多壁碳纳米管中至少两种碳纳米管的聚集体。
4.如权利要求3所述的线路基板,其特征在于,所述碳纳米管聚集体的粒径小于1微米。
5.如权利要求1所述的线路基板,其特征在于,所述碳纳米管的长度小于500纳米。
6.如权利要求1所述的线路基板,其特征在于,所述金属纳米粒子为金、银、铜、铂或钯的纳米粒子,
7.如权利要求1所述的线路基板,其特征在于,所述金属纳米粒子的粒径在1纳米至500纳米之间。
8.如权利要求1所述的线路基板,其特征在于,所述导电线路的线路宽度为5微米至20微米。
9.一种线路基板的制作方法,其包括以下步骤:将油墨通过喷墨印刷方式在线路基板的基材表面以形成线路图形,所述油墨包括碳纳米管与金属纳米粒子的复合物;在所述线路图形的表面镀覆金属形成导电线路。
10.如权利要求9所述的线路基板的制作方法,其特征在于,所述碳纳米管与金属纳米粒子的复合物通过在碳纳米管的管壁外侧吸附金属离子,再将金属离子还原为金属纳米粒子,从而使金属纳米粒子覆着于碳纳米管的管壁外侧。
11.如权利要求9所述的线路基板的制作方法,其特征在于,所述油墨进一步包括溶剂、表面活性剂、分散剂、保湿剂、防霉剂及杀菌剂。
12.如权利要求9所述的导电线路的制作方法,其特征在于,所述镀覆金属种类与所述金属纳米粒子的种类相同。
13.如权利要求9所述的线路基板的制作方法,其特征在于,所述线路图形的表面通过化学镀镀覆金属形成导电线路。
CN200810300809.0A 2008-04-01 2008-04-01 线路基板及线路基板的制作方法 Expired - Fee Related CN101553084B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200810300809.0A CN101553084B (zh) 2008-04-01 2008-04-01 线路基板及线路基板的制作方法
US12/253,869 US8071887B2 (en) 2008-04-01 2008-10-17 Printed circuit board and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810300809.0A CN101553084B (zh) 2008-04-01 2008-04-01 线路基板及线路基板的制作方法

Publications (2)

Publication Number Publication Date
CN101553084A true CN101553084A (zh) 2009-10-07
CN101553084B CN101553084B (zh) 2010-12-08

Family

ID=41115395

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810300809.0A Expired - Fee Related CN101553084B (zh) 2008-04-01 2008-04-01 线路基板及线路基板的制作方法

Country Status (2)

Country Link
US (1) US8071887B2 (zh)
CN (1) CN101553084B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102782054A (zh) * 2010-03-04 2012-11-14 格尔德殿工业公司 制备一个涂覆物、涂层包括合金化cnt薄膜的方法
CN102993820A (zh) * 2012-03-28 2013-03-27 杨阳 一种碳纳米材料/金属纳米材料复合纳米油墨
CN103262664A (zh) * 2010-12-15 2013-08-21 卡尔斯特里姆保健公司 含有金属纳米粒子网络的透明导电膜的凹版印刷

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009084155A1 (ja) * 2007-12-27 2009-07-09 Panasonic Corporation 接合材料、電子部品および接合構造体
DE102009054427B4 (de) * 2009-11-25 2014-02-13 Kme Germany Ag & Co. Kg Verfahren zum Aufbringen von Gemengen aus Kohlenstoff und Metallpartikeln auf ein Substrat, nach dem Verfahren erhältliches Substrat und dessen Verwendung
US20120273255A1 (en) * 2011-04-26 2012-11-01 Tyco Electronics Corporation Electrical Conductors Having Organic Compound Coatings
US20130048342A1 (en) * 2011-08-23 2013-02-28 Tyco Electronics Corporation Circuit board
JP2013135089A (ja) * 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
DE102012214440B3 (de) * 2012-08-14 2013-10-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Planaroptisches Element, Sensorelement und Verfahren zu deren Herstellung
CN106094366B (zh) * 2016-08-23 2019-02-01 深圳市华星光电技术有限公司 Ips型阵列基板的制作方法及ips型阵列基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060057742A1 (en) * 2004-09-08 2006-03-16 Hitachi Cable, Ltd. Method of forming CNT containing wiring material and sputtering target material used for the method
CN101089058A (zh) * 2006-06-14 2007-12-19 三星电机株式会社 用于喷墨打印的导电油墨组合物
US20070298161A1 (en) * 2003-12-12 2007-12-27 Yoshihide Yamaguchi Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10265207A (ja) * 1997-03-24 1998-10-06 Kagaku Gijutsu Shinko Jigyodan フラーレン含有構造体およびその製造方法
JP2003203450A (ja) * 2001-12-28 2003-07-18 Alps Electric Co Ltd 磁気ヘッド
JP2003257797A (ja) * 2002-02-27 2003-09-12 Toshiba Corp 電気二重層キャパシタ
JP4382364B2 (ja) * 2002-04-24 2009-12-09 株式会社東芝 液体インク
US20050156318A1 (en) * 2004-01-15 2005-07-21 Douglas Joel S. Security marking and security mark
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
US8248599B2 (en) * 2006-06-21 2012-08-21 University Of Dayton Methods of polarization engineering and their applications
DE502006003829D1 (de) * 2006-10-31 2009-07-09 Alcan Tech & Man Ltd Werkstoffe enthaltend Kohlenstoffnanoröhrchen, Verfahren zu deren Herstellung und Verwendung der Werkstoffe
CN101622712B (zh) * 2006-11-07 2011-06-15 希百特股份有限公司 双端开关装置及其制造方法
CA2669224A1 (en) * 2006-11-21 2008-10-23 Ge Healthcare Bio-Sciences Corp. Assembling and utilizing rfid sensors in containers
JP4880533B2 (ja) * 2007-07-03 2012-02-22 ソニーケミカル&インフォメーションデバイス株式会社 異方性導電膜及びその製造方法、並びに接合体
US7742673B2 (en) * 2007-09-28 2010-06-22 General Electric Company Thermal mangement article having thermal wave guide
US20090142636A1 (en) * 2007-11-30 2009-06-04 Kiyoshi Handa Carbon Fiber Warming System for Fiber Composite Gas Storage Cylinders
US9564629B2 (en) * 2008-01-02 2017-02-07 Nanotek Instruments, Inc. Hybrid nano-filament anode compositions for lithium ion batteries
US8435676B2 (en) * 2008-01-09 2013-05-07 Nanotek Instruments, Inc. Mixed nano-filament electrode materials for lithium ion batteries
US20090186276A1 (en) * 2008-01-18 2009-07-23 Aruna Zhamu Hybrid nano-filament cathode compositions for lithium metal or lithium ion batteries

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070298161A1 (en) * 2003-12-12 2007-12-27 Yoshihide Yamaguchi Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board
US20060057742A1 (en) * 2004-09-08 2006-03-16 Hitachi Cable, Ltd. Method of forming CNT containing wiring material and sputtering target material used for the method
CN101089058A (zh) * 2006-06-14 2007-12-19 三星电机株式会社 用于喷墨打印的导电油墨组合物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102782054A (zh) * 2010-03-04 2012-11-14 格尔德殿工业公司 制备一个涂覆物、涂层包括合金化cnt薄膜的方法
CN102782054B (zh) * 2010-03-04 2017-06-06 格尔德殿工业公司 制备一个涂覆物、涂层包括合金化cnt薄膜的方法
CN103262664A (zh) * 2010-12-15 2013-08-21 卡尔斯特里姆保健公司 含有金属纳米粒子网络的透明导电膜的凹版印刷
CN103262664B (zh) * 2010-12-15 2016-05-18 卡尔斯特里姆保健公司 含有金属纳米粒子网络的透明导电膜的凹版印刷
CN102993820A (zh) * 2012-03-28 2013-03-27 杨阳 一种碳纳米材料/金属纳米材料复合纳米油墨

Also Published As

Publication number Publication date
US20090242246A1 (en) 2009-10-01
CN101553084B (zh) 2010-12-08
US8071887B2 (en) 2011-12-06

Similar Documents

Publication Publication Date Title
CN101553084B (zh) 线路基板及线路基板的制作方法
Woo et al. Ink-Jet printing of Cu− Ag-based highly conductive tracks on a transparent substrate
JP6085270B2 (ja) プリント配線板用基板及びプリント配線板用基板の製造方法
CN101547567B (zh) 导电线路的制作方法
US20110062389A1 (en) Conductive material formed using light or thermal energy, method for forming the same and nano-scale composition
CN101580657A (zh) 油墨及利用该油墨制作导电线路的方法
CN101754585B (zh) 导电线路的制作方法
CN101640979A (zh) 导电线路的制作方法
KR101489206B1 (ko) 도금층을 포함하는 양면 연성 인쇄회로기판 및 이의 제조방법
JP2013067854A (ja) 銅複合粒子、複合金属銅粒子、銅複合粒子の製造方法、金属ペースト、金属導体を有する物品および金属導体を有する物品の製造方法
WO2009031849A2 (en) Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays
TWI383950B (zh) 奈米點狀材料的形成方法
JP5446097B2 (ja) 導電性基板及びその製造方法
JP6774898B2 (ja) 貫通電極を有する両面配線基板及びその製造方法
JP2009147121A (ja) 導電性部材の製造方法および導電性部材
JP2009068045A (ja) 金属多孔質構造体の製造方法
CN101597440B (zh) 油墨、利用该油墨制作导电线路的方法及线路板
CN101908388A (zh) 纳米点状材料的形成方法
Wu et al. Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method
KR101520412B1 (ko) 레이저와 인쇄방식이 하이브리드된 플렉서블 기판 및 이의 제조 방법
US20140083753A1 (en) Method of forming copper wiring, method of manufacturing wiring board, and wiring board
TWI357632B (en) Circuit substrate and method for manufacturing the
JP2005203484A (ja) 導電回路装置および導電回路装置の製造方法
CN101636043A (zh) 制作导电线路的方法
JP7032127B2 (ja) プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1

Co-patentee after: Zhen Ding Technology Co.,Ltd.

Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd.

Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1

Co-patentee before: Hongsheng Technology Co.,Ltd.

Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd.

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20170303

Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3

Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd.

Patentee after: Peng Ding Polytron Technologies Inc.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3

Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd.

Patentee before: Zhen Ding Technology Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan

Co-patentee after: Peng Ding Polytron Technologies Inc.

Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3

Co-patentee before: Peng Ding Polytron Technologies Inc.

Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101208