CN101640979A - 导电线路的制作方法 - Google Patents
导电线路的制作方法 Download PDFInfo
- Publication number
- CN101640979A CN101640979A CN200810303134A CN200810303134A CN101640979A CN 101640979 A CN101640979 A CN 101640979A CN 200810303134 A CN200810303134 A CN 200810303134A CN 200810303134 A CN200810303134 A CN 200810303134A CN 101640979 A CN101640979 A CN 101640979A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- silver
- printing ink
- circuit
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810303134A CN101640979A (zh) | 2008-07-28 | 2008-07-28 | 导电线路的制作方法 |
US12/494,279 US20100021652A1 (en) | 2008-07-28 | 2009-06-30 | Method of forming electrical traces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810303134A CN101640979A (zh) | 2008-07-28 | 2008-07-28 | 导电线路的制作方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101640979A true CN101640979A (zh) | 2010-02-03 |
Family
ID=41568890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810303134A Pending CN101640979A (zh) | 2008-07-28 | 2008-07-28 | 导电线路的制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100021652A1 (zh) |
CN (1) | CN101640979A (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102300414A (zh) * | 2011-08-22 | 2011-12-28 | 电子科技大学 | 一种印制电路的加成制备方法 |
CN102700250A (zh) * | 2012-02-01 | 2012-10-03 | 南京点面光电有限公司 | 一种电容式触摸屏引线的制备方法 |
CN103533764A (zh) * | 2012-07-05 | 2014-01-22 | 昆山联滔电子有限公司 | 非导电基板上形成导体线路的制造方法 |
CN104108248A (zh) * | 2013-04-19 | 2014-10-22 | 中国科学院理化技术研究所 | 液态金属喷墨打印设备及打印方法 |
CN104582278A (zh) * | 2014-09-04 | 2015-04-29 | 陈鹏 | 一种电路板及其制备方法 |
US10154596B2 (en) | 2015-04-02 | 2018-12-11 | Taiwan Green Point Enterprises Co., Ltd. | Catalyst for a catalytic ink and uses thereof |
CN109963406A (zh) * | 2017-12-25 | 2019-07-02 | 宏启胜精密电子(秦皇岛)有限公司 | 具内埋电阻的柔性电路板及其制作方法 |
CN110983763A (zh) * | 2019-12-18 | 2020-04-10 | 浙江蓝天制衣有限公司 | 一种适用于服装棉织物的化学镀铜的工艺 |
CN112469202A (zh) * | 2020-11-24 | 2021-03-09 | 绍兴德汇半导体材料有限公司 | 一种应用于覆铜陶瓷基板的选择性镀银方法 |
CN114488397A (zh) * | 2022-01-27 | 2022-05-13 | 苏州大学 | 一种基于印刷电路板的平面光波导结构及其制作方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102000416B1 (ko) * | 2016-05-09 | 2019-07-15 | 스트롱 포스 아이오티 포트폴리오 2016, 엘엘씨 | 산업용 사물 인터넷을 위한 방법들 및 시스템들 |
WO2018111885A1 (en) * | 2016-12-16 | 2018-06-21 | The Exone Company | Low residual carbon binder for binder jetting three-dimensional printing and methods for use of same |
US20210045252A1 (en) * | 2019-04-12 | 2021-02-11 | Averatek Corporation | Systems and methods for manufacturing |
US11681225B2 (en) * | 2020-02-27 | 2023-06-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Silver patterning and interconnect processes |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4023984A (en) * | 1973-02-02 | 1977-05-17 | Imperial Chemical Industries Limited | Azeotropic solvent composition for cleaning |
US4935267A (en) * | 1987-05-08 | 1990-06-19 | Nippondenso Co., Ltd. | Process for electrolessly plating copper and plating solution therefor |
TW312079B (zh) * | 1994-06-06 | 1997-08-01 | Ibm | |
US6682788B2 (en) * | 1998-04-30 | 2004-01-27 | Konica Corporation | Aqueous coating composition, coating method thereof, and ink-jet recording sheet |
JP4115050B2 (ja) * | 1998-10-07 | 2008-07-09 | キヤノン株式会社 | 電子線装置およびスペーサの製造方法 |
JP4482744B2 (ja) * | 2001-02-23 | 2010-06-16 | 株式会社日立製作所 | 無電解銅めっき液、無電解銅めっき方法、配線板の製造方法 |
KR20030059872A (ko) * | 2002-01-03 | 2003-07-12 | 삼성전자주식회사 | 금속 또는 금속산화물 미세 패턴의 제조방법 |
US20050006339A1 (en) * | 2003-07-11 | 2005-01-13 | Peter Mardilovich | Electroless deposition methods and systems |
-
2008
- 2008-07-28 CN CN200810303134A patent/CN101640979A/zh active Pending
-
2009
- 2009-06-30 US US12/494,279 patent/US20100021652A1/en not_active Abandoned
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102300414A (zh) * | 2011-08-22 | 2011-12-28 | 电子科技大学 | 一种印制电路的加成制备方法 |
CN102300414B (zh) * | 2011-08-22 | 2013-03-13 | 电子科技大学 | 一种印制电路的加成制备方法 |
CN102700250A (zh) * | 2012-02-01 | 2012-10-03 | 南京点面光电有限公司 | 一种电容式触摸屏引线的制备方法 |
CN103533764A (zh) * | 2012-07-05 | 2014-01-22 | 昆山联滔电子有限公司 | 非导电基板上形成导体线路的制造方法 |
CN104108248A (zh) * | 2013-04-19 | 2014-10-22 | 中国科学院理化技术研究所 | 液态金属喷墨打印设备及打印方法 |
CN104582278B (zh) * | 2014-09-04 | 2017-08-29 | 陈鹏 | 一种电路板及其制备方法 |
CN104582278A (zh) * | 2014-09-04 | 2015-04-29 | 陈鹏 | 一种电路板及其制备方法 |
US10154596B2 (en) | 2015-04-02 | 2018-12-11 | Taiwan Green Point Enterprises Co., Ltd. | Catalyst for a catalytic ink and uses thereof |
US11089692B2 (en) | 2015-04-02 | 2021-08-10 | Taiwan Green Point Enterprises Co., Ltd. | Catalytic ink comprising metallic material made from diamminesilver hydroxide, and uses thereof |
CN109963406A (zh) * | 2017-12-25 | 2019-07-02 | 宏启胜精密电子(秦皇岛)有限公司 | 具内埋电阻的柔性电路板及其制作方法 |
CN109963406B (zh) * | 2017-12-25 | 2021-10-19 | 宏启胜精密电子(秦皇岛)有限公司 | 具内埋电阻的柔性电路板及其制作方法 |
CN110983763A (zh) * | 2019-12-18 | 2020-04-10 | 浙江蓝天制衣有限公司 | 一种适用于服装棉织物的化学镀铜的工艺 |
CN112469202A (zh) * | 2020-11-24 | 2021-03-09 | 绍兴德汇半导体材料有限公司 | 一种应用于覆铜陶瓷基板的选择性镀银方法 |
CN114488397A (zh) * | 2022-01-27 | 2022-05-13 | 苏州大学 | 一种基于印刷电路板的平面光波导结构及其制作方法 |
CN114488397B (zh) * | 2022-01-27 | 2023-09-19 | 苏州大学 | 一种基于印刷电路板的平面光波导结构及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100021652A1 (en) | 2010-01-28 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100203 |