JP6480428B2 - パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ - Google Patents
パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ Download PDFInfo
- Publication number
- JP6480428B2 JP6480428B2 JP2016518723A JP2016518723A JP6480428B2 JP 6480428 B2 JP6480428 B2 JP 6480428B2 JP 2016518723 A JP2016518723 A JP 2016518723A JP 2016518723 A JP2016518723 A JP 2016518723A JP 6480428 B2 JP6480428 B2 JP 6480428B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- layer
- substrate
- interconnect circuit
- patterned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002070 nanowire Substances 0.000 title claims description 157
- 239000004020 conductor Substances 0.000 title description 32
- 239000011253 protective coating Substances 0.000 title description 3
- 239000010410 layer Substances 0.000 claims description 242
- 239000000758 substrate Substances 0.000 claims description 129
- 229920000642 polymer Polymers 0.000 claims description 91
- 239000000203 mixture Substances 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 55
- 239000011241 protective layer Substances 0.000 claims description 51
- 150000002898 organic sulfur compounds Chemical class 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 39
- 238000000576 coating method Methods 0.000 claims description 35
- 239000007788 liquid Substances 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 32
- 239000011254 layer-forming composition Substances 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 12
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 25
- 150000001356 alkyl thiols Chemical class 0.000 description 25
- 230000008569 process Effects 0.000 description 23
- 230000001681 protective effect Effects 0.000 description 22
- 239000000853 adhesive Substances 0.000 description 21
- 230000001070 adhesive effect Effects 0.000 description 21
- 239000000976 ink Substances 0.000 description 20
- 239000002904 solvent Substances 0.000 description 18
- 238000007639 printing Methods 0.000 description 17
- -1 rod Substances 0.000 description 17
- 150000003573 thiols Chemical class 0.000 description 17
- 239000006185 dispersion Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 238000000059 patterning Methods 0.000 description 14
- 238000009472 formulation Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004372 Polyvinyl alcohol Substances 0.000 description 10
- 150000001504 aryl thiols Chemical class 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 229920002451 polyvinyl alcohol Polymers 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- 239000004094 surface-active agent Substances 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000002042 Silver nanowire Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000007646 gravure printing Methods 0.000 description 5
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 5
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 5
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 5
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 239000004034 viscosity adjusting agent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000002082 metal nanoparticle Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229920000609 methyl cellulose Polymers 0.000 description 3
- 239000001923 methylcellulose Substances 0.000 description 3
- 235000010981 methylcellulose Nutrition 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000000230 xanthan gum Substances 0.000 description 3
- 229920001285 xanthan gum Polymers 0.000 description 3
- 235000010493 xanthan gum Nutrition 0.000 description 3
- 229940082509 xanthan gum Drugs 0.000 description 3
- IDOQDZANRZQBTP-UHFFFAOYSA-N 2-[2-(2,4,4-trimethylpentan-2-yl)phenoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=CC=C1OCCO IDOQDZANRZQBTP-UHFFFAOYSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- CWSZBVAUYPTXTG-UHFFFAOYSA-N 5-[6-[[3,4-dihydroxy-6-(hydroxymethyl)-5-methoxyoxan-2-yl]oxymethyl]-3,4-dihydroxy-5-[4-hydroxy-3-(2-hydroxyethoxy)-6-(hydroxymethyl)-5-methoxyoxan-2-yl]oxyoxan-2-yl]oxy-6-(hydroxymethyl)-2-methyloxane-3,4-diol Chemical compound O1C(CO)C(OC)C(O)C(O)C1OCC1C(OC2C(C(O)C(OC)C(CO)O2)OCCO)C(O)C(O)C(OC2C(OC(C)C(O)C2O)CO)O1 CWSZBVAUYPTXTG-UHFFFAOYSA-N 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 2
- 241000207199 Citrus Species 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 229920004929 Triton X-114 Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000007774 anilox coating Methods 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 235000020971 citrus fruits Nutrition 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 238000010017 direct printing Methods 0.000 description 2
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- ORTRWBYBJVGVQC-UHFFFAOYSA-N hexadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCS ORTRWBYBJVGVQC-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- UECUPGFJVNJNQA-UHFFFAOYSA-N 2-phenylbenzenethiol Chemical class SC1=CC=CC=C1C1=CC=CC=C1 UECUPGFJVNJNQA-UHFFFAOYSA-N 0.000 description 1
- 229920003026 Acene Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical class OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- ADJJLNODXLXTIH-UHFFFAOYSA-N adamantane-1-thiol Chemical compound C1C(C2)CC3CC2CC1(S)C3 ADJJLNODXLXTIH-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000004815 dispersion polymer Substances 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- VFNGKCDDZUSWLR-UHFFFAOYSA-N disulfuric acid Chemical class OS(=O)(=O)OS(O)(=O)=O VFNGKCDDZUSWLR-UHFFFAOYSA-N 0.000 description 1
- NLEBIOOXCVAHBD-QKMCSOCLSA-N dodecyl beta-D-maltoside Chemical compound O[C@@H]1[C@@H](O)[C@H](OCCCCCCCCCCCC)O[C@H](CO)[C@H]1O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 NLEBIOOXCVAHBD-QKMCSOCLSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000013545 self-assembled monolayer Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000007767 slide coating Methods 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000011410 subtraction method Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000007944 thiolates Chemical class 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 239000012991 xanthate Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823871—Complementary field-effect transistors, e.g. CMOS interconnection or wiring or contact manufacturing related aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/89—Deposition of materials, e.g. coating, cvd, or ald
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/953—Detector using nanostructure
- Y10S977/956—Of mechanical property
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
- Liquid Crystal (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
A.電子アセンブリを製造する方法であって、
有機硫黄化合物を含む保護層をパターン化された導電性相互接続回路の少なくとも一部へ適用することであって、導電性相互接続回路は、基材上の導電層に電気接続され、該導電層は、ナノワイヤを含む、ことと、
電子部品の電気接点を保護層と係合して、電子部品とパターン化された導電層とを電気接続することと、を含む、方法。
B.有機硫黄化合物は、アルキルチオール類とアリールチオール類とのうち少なくとも一方から選択される、実施形態Aに記載の方法。
C.有機硫黄化合物は、アルキルチオールである、実施形態A又はBに記載の方法。
D.パターン化された導電層は、透明である、実施形態A〜Cのいずれか一実施形態に記載の方法。
E.方法であって、
ナノワイヤを含む導電層で基材をコーティングすることと、
導電性相互接続材料のパターンを導電層上に適用して、基材上に、露出した導電層の1つ又は2つ以上の第1の領域及び導電性相互接続材料の1つ又は2つ以上の第2の領域を生成することと、
導電性相互接続材料を固化又は硬化して、パターン化された相互接続回路を形成することと、
パターン化された相互接続回路の少なくとも一部に有機硫黄化合物を含む保護層形成組成物を適用することと、
液体の剥離可能なポリマー(strippable polymer)層形成組成物でパターン化された相互接続回路及び保護層形成組成物をオーバコートすることと、
剥離可能なポリマー層形成組成物を固化又は硬化させて、剥離可能なポリマー層を形成することと、
剥離可能なポリマー層を基材から剥離することと、
基材の1つ又は2つ以上の第1の領域における基材から露出した導電層を除去して、基材上にパターン化された導電層を形成することと、を含み、パターン化された導電層は、パターン化された相互接続回路によって少なくとも部分的に覆われ、パターン化された相互接続回路は、保護層によって少なくとも部分的に覆われている、方法。
F.剥離可能なポリマー層形成組成物でオーバコートする前に保護層形成組成物を乾燥させて、保護層を形成することを更に含む、実施形態Eに記載の方法。
G.方法であって、
ナノワイヤを含む導電層で基材をコーティングすることと、
導電性相互接続材料で導電層上にパターンを適用して、基材上に露出した導電層の1つ又は2つ以上の第1の領域及び導電性相互接続材料の1つ又は2つ以上の第2の領域を生成することと、
導電性相互接続材料を固化又は硬化して、パターン化された相互接続回路を形成することと、
パターンを液体の剥離可能なポリマー層形成組成物でオーバコートすることであって、剥離可能なポリマー層形成組成物は、有機硫黄化合物を含む、ことと、
剥離可能なポリマー層形成組成物を固化又は硬化させて、剥離可能なポリマー層を形成することと、
剥離可能なポリマー層を基材から剥離することと、
基材の1つ又は2つ以上の第1の領域における基材から露出した導電層を除去して、基材上にパターン化された導電層を形成することと、を含み、パターン化された導電層は、パターン化された相互接続回路によって少なくとも部分的に覆われ、パターン化された相互接続回路は、有機硫黄化合物を含む保護層によって少なくとも部分的に覆われている、方法。
H.実施形態A〜Gのいずれかによって製造される電子アセンブリ。
I.電子アセンブリであって、
導電性ナノワイヤのパターンを上に含む基材であって、導電性ナノワイヤは、導電性相互接続回路に電気接続され、導電性相互接続回路の少なくとも一部は、有機硫黄化合物を含む保護層によって覆われている、基材と、
保護層と接触している電子部品の電気接点と、を備える、電子アセンブリ。
J.基材と電子部品との間に導電層を更に含む、実施形態Iに記載の電子アセンブリ。
K.導電層は、導電性接着剤を含む、実施形態Jに記載の電子アセンブリ。
L.電子部品は、フレキシブル回路を含む、実施形態I〜Kのいずれか一実施形態に記載の電子アセンブリ。
M.有機硫黄化合物は、アルキルチオール類とアリールチオール類とのうち少なくとも一方から選択される、実施形態I〜Lのいずれか一実施形態に記載の電子アセンブリ。
N.有機硫黄化合物は、アルキルチオールである、実施形態I〜Mのいずれか一実施形態に記載の電子アセンブリ。
O.
液晶ディスプレイと、
電子アセンブリであって、
液晶ディスプレイ上のガラス基材であって、ガラス基材は、導電性ナノワイヤのパターンを上に含み、導電性ナノワイヤは、パターン化された導電性相互接続回路に電気接続され、相互接続回路の少なくとも一部は、有機硫黄化合物を含む保護層によって覆われている、ガラス基材と、
保護層と接触しているフレキシブル回路の電気接点と、を含む、電子アセンブリと、
電子アセンブリを覆う可撓性のある透明面と、を備える、タッチスクリーン。
P.基材とフレキシブル回路との間に導電層を更に含む、実施形態Oに記載のディスプレイ。
Q.導電層は、導電性接着剤を含む、実施形態Pに記載のディスプレイ。
R.有機硫黄化合物は、アルキルチオール類とアリールチオール類とのうち少なくとも一方から選択される、実施形態O〜Qのいずれか一実施形態に記載のディスプレイ。
S.有機硫黄化合物は、アルキルチオールである、実施形態O〜Rのいずれか一実施形態に記載のディスプレイ。
フィルムの主面上に銀ナノワイヤ溶液でコーティングされた5ミルのポリエチレンテレフタレート(PET)基材(DuPont Melinex ST−504)上にナノシルバーの相互接続部が印刷された。
ナノシルバーの相互接続部がフィルムの主面に銀ナノワイヤ溶液でコーティングされた5ミルのポリエチレンテレフタレート(PET)基材(DuPont Melinex ST−504)上に印刷された。
[項目1]
電子アセンブリを製造する方法であって、
有機硫黄化合物を含む保護層をパターン化された導電性相互接続回路の少なくとも一部へ適用することであって、該導電性相互接続回路は、基材上の導電層に電気接続され、該導電層は、ナノワイヤを含む、ことと、
電子部品の電気接点を該保護層と係合して、該電子部品と該パターン化された導電層とを電気接続することと、を含む、方法。
[項目2]
前記有機硫黄化合物は、アルキルチオール類とアリールチオール類とのうち少なくとも一方から選択される、項目1に記載の方法。
[項目3]
前記有機硫黄化合物は、アルキルチオールである、項目1又は2に記載の方法。
[項目4]
前記パターン化された導電層は、透明である、項目1〜3のいずれか一項に記載の方法。
[項目5]
方法であって、
ナノワイヤを含む導電層で基材をコーティングすることと、
導電性相互接続材料のパターンを該導電層上に適用して、該基材上に、露出した導電層の1つ又は2つ以上の第1の領域及び導電性相互接続材料の1つ又は2つ以上の第2の領域を生成することと、
該導電性相互接続材料を固化又は硬化して、パターン化された相互接続回路を形成することと、
該パターン化された相互接続回路の少なくとも一部に有機硫黄化合物を含む保護層形成組成物を適用することと、
液体の剥離可能なポリマー層形成組成物で該パターン化された相互接続回路及び該保護層形成組成物をオーバコートすることと、
該剥離可能なポリマー層形成組成物を固化又は硬化させて、剥離可能なポリマー層を形成することと、
該剥離可能なポリマー層を該基材から剥離することと、
該基材の該1つ又は2つ以上の第1の領域において該基材から該露出した導電層を除去して、該基材上にパターン化された導電層を形成することと、を含み、該パターン化された導電層は、該パターン化された相互接続回路によって少なくとも部分的に覆われ、該パターン化された相互接続回路は、該保護層によって少なくとも部分的に覆われている、方法。
[項目6]
前記剥離可能なポリマー層形成組成物でオーバコートする前に、前記保護層形成組成物を乾燥させて、保護層を形成することを更に含む、項目5に記載の方法。
[項目7]
方法であって、
ナノワイヤを含む導電層で基材をコーティングすることと、
導電性相互接続材料で該導電層上にパターンを適用して、該基材上に、露出した導電層の1つ又は2つ以上の第1の領域及び導電性相互接続材料の1つ又は2つ以上の第2の領域を生成することと、
該導電性相互接続材料を固化又は硬化して、パターン化された相互接続回路を形成することと、
該パターンを液体の剥離可能なポリマー層形成組成物でオーバコートすることであって、該剥離可能なポリマー層形成組成物は、有機硫黄化合物を含む、ことと、
該剥離可能なポリマー層形成組成物を固化又は硬化させて、剥離可能なポリマー層を形成することと、
該剥離可能なポリマー層を該基材から剥離することと、
該基材の該1つ又は2つ以上の第1の領域において該基材から該露出した導電層を除去して、該基材上にパターン化された導電層を形成することと、を含み、該パターン化された導電層は、該パターン化された相互接続回路によって少なくとも部分的に覆われ、該パターン化された相互接続回路は、該有機硫黄化合物を含む保護層によって少なくとも部分的に覆われている、方法。
[項目8]
項目1〜7のいずれか一項に記載の方法に従って製造される電子アセンブリ。
[項目9]
電子アセンブリであって、
導電性ナノワイヤのパターンを上に含む基材であって、該導電性ナノワイヤは、導電性相互接続回路に電気接続され、該導電性相互接続回路の少なくとも一部は、有機硫黄化合物を含む保護層によって覆われている、基材と、
該保護層と接触している電子部品の電気接点と、を備える、電子アセンブリ。
[項目10]
前記基材と前記電子部品との間に導電層を更に備える、項目9に記載の電子アセンブリ。
[項目11]
前記導電層は、導電性接着剤を含む、項目10に記載の電子アセンブリ。
[項目12]
前記電子部品は、フレキシブル回路を含む、項目9〜11のいずれか一項に記載の電子アセンブリ。
[項目13]
前記有機硫黄化合物は、アルキルチオール類とアリールチオール類とのうち少なくとも一方から選択される、項目9〜12のいずれか一項に記載の電子アセンブリ。
[項目14]
前記有機硫黄化合物は、アルキルチオールである、項目9〜13のいずれか一項に記載の電子アセンブリ。
[項目15]
液晶ディスプレイと、
電子アセンブリであって、
該液晶ディスプレイ上のガラス基材であって、該ガラス基材は、導電性ナノワイヤのパターンを上に含み、該導電性ナノワイヤは、パターン化された導電性相互接続回路に電気接続され、該相互接続回路の少なくとも一部は、有機硫黄化合物を含む保護層によって覆われている、ガラス基材と、
該保護層と接触しているフレキシブル回路の電気接点と、を含む、電子アセンブリと、
該電子アセンブリを覆う可撓性のある透明な表面と、を備える、タッチスクリーンディスプレイ。
[項目16]
前記基材と前記フレキシブル回路との間に導電層を更に含む、項目15に記載のディスプレイ。
[項目17]
前記導電層は、導電性接着剤を含む、項目16に記載のディスプレイ。
[項目18]
前記有機硫黄化合物は、アルキルチオール類とアリールチオール類とのうち少なくとも一方から選択される、項目15〜17のいずれか一項に記載のディスプレイ。
[項目19]
前記有機硫黄化合物は、アルキルチオールである、項目15〜18のいずれか一項に記載のディスプレイ。
Claims (5)
- 方法であって、
ナノワイヤを含む導電層で基材をコーティングすることと、
導電性相互接続材料のパターンを該導電層上に適用して、該基材上に、露出した導電層の1つ又は2つ以上の第1の領域及び導電性相互接続材料の1つ又は2つ以上の第2の領域を生成することと、
該導電性相互接続材料を固化又は硬化して、パターン化された相互接続回路を形成することと、
該パターン化された相互接続回路の少なくとも一部に有機硫黄化合物を含む保護層形成組成物を適用することと、
液体の剥離可能なポリマー層形成組成物で該パターン化された相互接続回路及び該保護層形成組成物をオーバコートすることと、
該剥離可能なポリマー層形成組成物を固化又は硬化させて、剥離可能なポリマー層を形成することと、
該剥離可能なポリマー層を該基材から剥離することと、
該基材の該1つ又は2つ以上の第1の領域において該基材から該露出した導電層を除去して、該基材上にパターン化された導電層を形成することと、を含み、該パターン化された導電層は、該パターン化された相互接続回路によって少なくとも部分的に覆われ、該パターン化された相互接続回路は、該保護層によって少なくとも部分的に覆われている、方法。 - 前記剥離可能なポリマー層形成組成物でオーバコートする前に、前記保護層形成組成物を乾燥させて、保護層を形成することを更に含む、請求項1に記載の方法。
- 請求項1〜2のいずれか一項に記載の方法に従って製造される電子アセンブリ。
- 液晶ディスプレイと、
電子アセンブリであって、
該液晶ディスプレイ上のガラス基材であって、該ガラス基材は、導電性ナノワイヤのパターンを上に含み、該導電性ナノワイヤのパターンは、パターン化された導電性相互接続回路によって覆われかつ該パターン化された導電性相互接続回路に電気接続され、該相互接続回路の少なくとも一部は、有機硫黄化合物を含む保護層によって覆われている、ガラス基材と、
該保護層と接触しているフレキシブル回路の電気接点と、を含む、電子アセンブリと、
該電子アセンブリを覆う可撓性のある透明な表面と、を備え、
前記導電性相互接続回路は導電性インクによって形成されている、タッチスクリーンディスプレイ。 - 前記基材と前記フレキシブル回路との間に導電層を更に含む、請求項4に記載のディスプレイ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361884954P | 2013-09-30 | 2013-09-30 | |
US61/884,954 | 2013-09-30 | ||
PCT/US2014/056768 WO2015047944A1 (en) | 2013-09-30 | 2014-09-22 | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016535433A JP2016535433A (ja) | 2016-11-10 |
JP2016535433A5 JP2016535433A5 (ja) | 2017-10-19 |
JP6480428B2 true JP6480428B2 (ja) | 2019-03-13 |
Family
ID=52744376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016518723A Active JP6480428B2 (ja) | 2013-09-30 | 2014-09-22 | パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ |
Country Status (8)
Country | Link |
---|---|
US (1) | US10362685B2 (ja) |
EP (1) | EP3053012B1 (ja) |
JP (1) | JP6480428B2 (ja) |
KR (1) | KR102264357B1 (ja) |
CN (1) | CN105593796B (ja) |
BR (1) | BR112016006975A2 (ja) |
SG (1) | SG11201602419WA (ja) |
WO (1) | WO2015047944A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102543985B1 (ko) * | 2015-10-27 | 2023-06-14 | 삼성전자주식회사 | 전도막 및 이를 포함하는 전자 소자 |
JP6654954B2 (ja) * | 2016-03-31 | 2020-02-26 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
GB2551502A (en) * | 2016-06-17 | 2017-12-27 | M-Solv Ltd | Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display |
US10327332B2 (en) * | 2016-10-06 | 2019-06-18 | Microsoft Technology Licensing, Llc | Connecting a flexible circuit to other structures |
WO2018145106A1 (en) * | 2017-02-06 | 2018-08-09 | Carnegie Mellon University | A flexible circuit and a method of manufacture |
CN110825253A (zh) * | 2018-08-13 | 2020-02-21 | 南昌欧菲光科技有限公司 | 触控组件和触摸显示屏 |
CN114698254A (zh) * | 2020-12-31 | 2022-07-01 | 天材创新材料科技(厦门)有限公司 | 叠构结构及触控感应器 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3660088A (en) * | 1970-09-16 | 1972-05-02 | Grace W R & Co | Photo-resist process |
JPS5388163A (en) * | 1977-01-14 | 1978-08-03 | Esu Kei Kk | Method of producing printed circuit board |
DE3029521A1 (de) * | 1980-08-04 | 1982-03-04 | Helmuth 2058 Lauenburg Schmoock | Schaltung mit aufgedruckten leiterbahnen und verfahren zu deren herstellung |
JPS62154793A (ja) * | 1985-12-27 | 1987-07-09 | 三菱レイヨン株式会社 | パタ−ン印刷基材の製法 |
US6975067B2 (en) | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
US20040152240A1 (en) * | 2003-01-24 | 2004-08-05 | Carlos Dangelo | Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits |
US7175876B2 (en) | 2003-06-27 | 2007-02-13 | 3M Innovative Properties Company | Patterned coating method employing polymeric coatings |
CN102250506B (zh) | 2005-08-12 | 2014-07-09 | 凯博瑞奥斯技术公司 | 基于纳米线的透明导体 |
US8018568B2 (en) | 2006-10-12 | 2011-09-13 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
US8764996B2 (en) * | 2006-10-18 | 2014-07-01 | 3M Innovative Properties Company | Methods of patterning a material on polymeric substrates |
WO2008127313A2 (en) * | 2006-11-17 | 2008-10-23 | The Regents Of The University Of California | Electrically conducting and optically transparent nanowire networks |
US8026903B2 (en) | 2007-01-03 | 2011-09-27 | Apple Inc. | Double-sided touch sensitive panel and flex circuit bonding |
JP5041214B2 (ja) * | 2007-06-15 | 2012-10-03 | ソニー株式会社 | 金属薄膜の形成方法および電子デバイスの製造方法 |
JP5543367B2 (ja) * | 2007-12-19 | 2014-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | マイクロコンタクトプリンティング用のインク溶液 |
KR101727444B1 (ko) | 2008-02-28 | 2017-04-14 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 터치 스크린 센서 |
US8425792B2 (en) | 2008-02-28 | 2013-04-23 | 3M Innovative Properties Company | Methods of patterning a conductor on a substrate |
KR20100028306A (ko) * | 2008-09-04 | 2010-03-12 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
WO2010061206A1 (en) | 2008-11-03 | 2010-06-03 | Cambridge Enterprise Limited | Method of patterning an electronic of photonic material |
KR101219139B1 (ko) | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 |
KR20130048717A (ko) * | 2010-02-24 | 2013-05-10 | 캄브리오스 테크놀로지즈 코포레이션 | 나노와이어 기반의 투명 도전체 및 이를 패터닝하는 방법 |
KR101314779B1 (ko) * | 2010-08-18 | 2013-10-08 | 엘지디스플레이 주식회사 | 정전용량 방식 터치 스크린 패널 및 그 제조방법 |
SG178823A1 (en) | 2010-08-27 | 2012-05-30 | Dowa Electronics Materials Co Ltd | Low-temperature sintered silver nanoparticle composition and electronic articles formed usingk the same |
CN103109391B (zh) * | 2010-09-24 | 2016-07-20 | 加利福尼亚大学董事会 | 纳米线-聚合物复合材料电极 |
CN103238130B (zh) * | 2011-02-04 | 2016-06-29 | 信越聚合物株式会社 | 静电电容式传感器片及其制造方法 |
EP2697684B1 (en) | 2011-04-15 | 2015-05-20 | 3M Innovative Properties Company | Transparent electrode for electronic displays |
US9198298B2 (en) * | 2011-04-26 | 2015-11-24 | Nippon Mektron, Ltd. | Method for manufacturing transparent printed circuit and method for manufacturing transparent touch panel |
US9603242B2 (en) * | 2011-12-21 | 2017-03-21 | 3M Innovative Properties Company | Laser patterning of silver nanowire-based transparent electrically conducting coatings |
WO2013133272A1 (ja) | 2012-03-06 | 2013-09-12 | デクセリアルズ株式会社 | 透明導電膜、導電性素子、組成物、入力装置、表示装置および電子機器 |
SG11201504125UA (en) | 2012-12-07 | 2015-06-29 | 3M Innovative Properties Co | Method of making transparent conductors on a substrate |
EP3028126B1 (en) * | 2013-07-31 | 2020-10-07 | 3M Innovative Properties Company | Bonding electronic components to patterned nanowire transparent conductors |
-
2014
- 2014-09-22 KR KR1020167010931A patent/KR102264357B1/ko active IP Right Grant
- 2014-09-22 WO PCT/US2014/056768 patent/WO2015047944A1/en active Application Filing
- 2014-09-22 BR BR112016006975A patent/BR112016006975A2/pt not_active Application Discontinuation
- 2014-09-22 CN CN201480053997.5A patent/CN105593796B/zh not_active Expired - Fee Related
- 2014-09-22 EP EP14850091.1A patent/EP3053012B1/en active Active
- 2014-09-22 JP JP2016518723A patent/JP6480428B2/ja active Active
- 2014-09-22 US US15/025,696 patent/US10362685B2/en active Active
- 2014-09-22 SG SG11201602419WA patent/SG11201602419WA/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3053012A1 (en) | 2016-08-10 |
US20160249461A1 (en) | 2016-08-25 |
WO2015047944A1 (en) | 2015-04-02 |
SG11201602419WA (en) | 2016-04-28 |
JP2016535433A (ja) | 2016-11-10 |
EP3053012A4 (en) | 2017-05-03 |
US10362685B2 (en) | 2019-07-23 |
CN105593796B (zh) | 2019-01-04 |
KR102264357B1 (ko) | 2021-06-15 |
BR112016006975A2 (pt) | 2017-08-01 |
CN105593796A (zh) | 2016-05-18 |
KR20160063368A (ko) | 2016-06-03 |
EP3053012B1 (en) | 2019-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6480428B2 (ja) | パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ | |
JP6426737B2 (ja) | 電子的構成要素とパターン化ナノワイヤ透明伝導体との接合 | |
US10831233B2 (en) | Method of making transparent conductors on a substrate | |
KR101362863B1 (ko) | 투명 도전층 패턴의 형성 방법 | |
JP6457528B2 (ja) | 以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ | |
US20190114003A1 (en) | Nanowire contact pads with enhanced adhesion to metal interconnects | |
JP2014191894A (ja) | 透明導電フィルム及びタッチパネル | |
US11284521B2 (en) | Electronic devices comprising a via and methods of forming such electronic devices | |
US20190357360A1 (en) | Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170906 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170906 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181108 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190108 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190207 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6480428 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |