SG11201602419WA - Protective coating for printed conductive pattern on patterned nanowire transparent conductors - Google Patents
Protective coating for printed conductive pattern on patterned nanowire transparent conductorsInfo
- Publication number
- SG11201602419WA SG11201602419WA SG11201602419WA SG11201602419WA SG11201602419WA SG 11201602419W A SG11201602419W A SG 11201602419WA SG 11201602419W A SG11201602419W A SG 11201602419WA SG 11201602419W A SG11201602419W A SG 11201602419WA SG 11201602419W A SG11201602419W A SG 11201602419WA
- Authority
- SG
- Singapore
- Prior art keywords
- conductive pattern
- protective coating
- transparent conductors
- printed conductive
- nanowire transparent
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title 1
- 239000002070 nanowire Substances 0.000 title 1
- 239000011253 protective coating Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823871—Complementary field-effect transistors, e.g. CMOS interconnection or wiring or contact manufacturing related aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/89—Deposition of materials, e.g. coating, cvd, or ald
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/953—Detector using nanostructure
- Y10S977/956—Of mechanical property
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361884954P | 2013-09-30 | 2013-09-30 | |
PCT/US2014/056768 WO2015047944A1 (en) | 2013-09-30 | 2014-09-22 | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201602419WA true SG11201602419WA (en) | 2016-04-28 |
Family
ID=52744376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201602419WA SG11201602419WA (en) | 2013-09-30 | 2014-09-22 | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
Country Status (8)
Country | Link |
---|---|
US (1) | US10362685B2 (ja) |
EP (1) | EP3053012B1 (ja) |
JP (1) | JP6480428B2 (ja) |
KR (1) | KR102264357B1 (ja) |
CN (1) | CN105593796B (ja) |
BR (1) | BR112016006975A2 (ja) |
SG (1) | SG11201602419WA (ja) |
WO (1) | WO2015047944A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102543985B1 (ko) * | 2015-10-27 | 2023-06-14 | 삼성전자주식회사 | 전도막 및 이를 포함하는 전자 소자 |
JP6654954B2 (ja) * | 2016-03-31 | 2020-02-26 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
GB2551502A (en) * | 2016-06-17 | 2017-12-27 | M-Solv Ltd | Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display |
US10327332B2 (en) * | 2016-10-06 | 2019-06-18 | Microsoft Technology Licensing, Llc | Connecting a flexible circuit to other structures |
WO2018145106A1 (en) * | 2017-02-06 | 2018-08-09 | Carnegie Mellon University | A flexible circuit and a method of manufacture |
CN110825253A (zh) * | 2018-08-13 | 2020-02-21 | 南昌欧菲光科技有限公司 | 触控组件和触摸显示屏 |
CN114698254A (zh) * | 2020-12-31 | 2022-07-01 | 天材创新材料科技(厦门)有限公司 | 叠构结构及触控感应器 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3660088A (en) | 1970-09-16 | 1972-05-02 | Grace W R & Co | Photo-resist process |
JPS5388163A (en) * | 1977-01-14 | 1978-08-03 | Esu Kei Kk | Method of producing printed circuit board |
DE3029521A1 (de) * | 1980-08-04 | 1982-03-04 | Helmuth 2058 Lauenburg Schmoock | Schaltung mit aufgedruckten leiterbahnen und verfahren zu deren herstellung |
JPS62154793A (ja) * | 1985-12-27 | 1987-07-09 | 三菱レイヨン株式会社 | パタ−ン印刷基材の製法 |
US6975067B2 (en) | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
US20040152240A1 (en) * | 2003-01-24 | 2004-08-05 | Carlos Dangelo | Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits |
US7175876B2 (en) | 2003-06-27 | 2007-02-13 | 3M Innovative Properties Company | Patterned coating method employing polymeric coatings |
CA2618794A1 (en) | 2005-08-12 | 2007-02-22 | Cambrios Technologies Corporation | Nanowires-based transparent conductors |
US8018568B2 (en) * | 2006-10-12 | 2011-09-13 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
US8764996B2 (en) * | 2006-10-18 | 2014-07-01 | 3M Innovative Properties Company | Methods of patterning a material on polymeric substrates |
WO2008127313A2 (en) | 2006-11-17 | 2008-10-23 | The Regents Of The University Of California | Electrically conducting and optically transparent nanowire networks |
US8026903B2 (en) | 2007-01-03 | 2011-09-27 | Apple Inc. | Double-sided touch sensitive panel and flex circuit bonding |
JP5041214B2 (ja) * | 2007-06-15 | 2012-10-03 | ソニー株式会社 | 金属薄膜の形成方法および電子デバイスの製造方法 |
JP5543367B2 (ja) * | 2007-12-19 | 2014-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | マイクロコンタクトプリンティング用のインク溶液 |
KR101720919B1 (ko) | 2008-02-28 | 2017-03-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 터치 스크린 센서 |
WO2009108771A2 (en) | 2008-02-28 | 2009-09-03 | 3M Innovative Properties Company | Methods of patterning a conductor on a substrate |
KR20100028306A (ko) * | 2008-09-04 | 2010-03-12 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
WO2010061206A1 (en) * | 2008-11-03 | 2010-06-03 | Cambridge Enterprise Limited | Method of patterning an electronic of photonic material |
KR101219139B1 (ko) * | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 |
CN102834936B (zh) | 2010-02-24 | 2015-05-20 | 凯博瑞奥斯技术公司 | 基于纳米线的透明导体及对其进行构图的方法 |
KR101314779B1 (ko) * | 2010-08-18 | 2013-10-08 | 엘지디스플레이 주식회사 | 정전용량 방식 터치 스크린 패널 및 그 제조방법 |
KR20170063991A (ko) | 2010-08-27 | 2017-06-08 | 도와 일렉트로닉스 가부시키가이샤 | 저온 소결성 은 나노 입자 조성물 및 상기 조성물을 이용하여 형성된 전자 물품 |
CN103109391B (zh) * | 2010-09-24 | 2016-07-20 | 加利福尼亚大学董事会 | 纳米线-聚合物复合材料电极 |
US9482693B2 (en) * | 2011-02-04 | 2016-11-01 | Shin-Etsu Polymer Co., Ltd. | Capacitive sensor sheet and production method thereof |
US9835913B2 (en) | 2011-04-15 | 2017-12-05 | 3M Innovative Properties Company | Transparent electrode for electronic displays |
US9198298B2 (en) * | 2011-04-26 | 2015-11-24 | Nippon Mektron, Ltd. | Method for manufacturing transparent printed circuit and method for manufacturing transparent touch panel |
CN104094362B (zh) * | 2011-12-21 | 2017-01-18 | 3M创新有限公司 | 基于银纳米线的透明导电涂层的激光图案化 |
US20150017457A1 (en) | 2012-03-06 | 2015-01-15 | Dexerials Corporation | Transparent conductive film, conductive element, composition, input device, display device and electronic instrument |
CN104838342B (zh) | 2012-12-07 | 2018-03-13 | 3M创新有限公司 | 在基板上制作透明导体的方法 |
EP3028126B1 (en) * | 2013-07-31 | 2020-10-07 | 3M Innovative Properties Company | Bonding electronic components to patterned nanowire transparent conductors |
-
2014
- 2014-09-22 JP JP2016518723A patent/JP6480428B2/ja active Active
- 2014-09-22 SG SG11201602419WA patent/SG11201602419WA/en unknown
- 2014-09-22 BR BR112016006975A patent/BR112016006975A2/pt not_active Application Discontinuation
- 2014-09-22 CN CN201480053997.5A patent/CN105593796B/zh active Active
- 2014-09-22 WO PCT/US2014/056768 patent/WO2015047944A1/en active Application Filing
- 2014-09-22 US US15/025,696 patent/US10362685B2/en active Active
- 2014-09-22 KR KR1020167010931A patent/KR102264357B1/ko active IP Right Grant
- 2014-09-22 EP EP14850091.1A patent/EP3053012B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2015047944A1 (en) | 2015-04-02 |
EP3053012A1 (en) | 2016-08-10 |
US10362685B2 (en) | 2019-07-23 |
CN105593796A (zh) | 2016-05-18 |
US20160249461A1 (en) | 2016-08-25 |
KR20160063368A (ko) | 2016-06-03 |
JP2016535433A (ja) | 2016-11-10 |
BR112016006975A2 (pt) | 2017-08-01 |
JP6480428B2 (ja) | 2019-03-13 |
EP3053012B1 (en) | 2019-10-23 |
CN105593796B (zh) | 2019-01-04 |
EP3053012A4 (en) | 2017-05-03 |
KR102264357B1 (ko) | 2021-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201602419WA (en) | Protective coating for printed conductive pattern on patterned nanowire transparent conductors | |
EP2948960A4 (en) | SOFT CONDUCTIVE INK | |
EP3042251A4 (en) | Wearable electronic device | |
EP3050035A4 (en) | Wearable electronic device | |
BR302013003154S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003177S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003133S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003134S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003175S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003136S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003139S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003131S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003155S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
BR302013003121S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
EP2991083A4 (en) | METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE PATTERN AND SUBSTRATE WITH ELECTRICALLY CONDUCTIVE PATTERN | |
BR302013003178S1 (pt) | Padrão ornamental aplicado em interface gráfica | |
EP2980681A4 (en) | METHOD FOR PRODUCING A TRANSPARENT CONDUCTIVE SUBSTRATE AND TRANSPARENT CONDUCTIVE SUBSTRATE | |
EP2957996A4 (en) | LADDER RAIL LAMINATE AND ELECTRONIC DEVICE THEREWITH | |
SG11201603375TA (en) | Microcontact printing stamps with functional features | |
EP3032383A4 (en) | Light-transmitting conductive member and patterning method thereof | |
FI20125087A (fi) | Menetelmä ja järjestely sähköisesti johtavan kuvion tuottamiseksi pinnalle | |
EP2985750A4 (en) | CONDUCTIVE FILM, DISPLAY DEVICE HAVING THE SAME, AND EVALUATION AND DETERMINATION METHOD FOR A CONDUCTIVE FILM WIRING PATTERN | |
IL240272A (en) | Tagging templates | |
EP3033652A4 (en) | Pattern foil printing | |
LT2989642T (lt) | Laido žymeklis |