KR20130124880A - 무전해 동 도금욕 및 무전해 동 도금 방법 - Google Patents

무전해 동 도금욕 및 무전해 동 도금 방법 Download PDF

Info

Publication number
KR20130124880A
KR20130124880A KR1020130007542A KR20130007542A KR20130124880A KR 20130124880 A KR20130124880 A KR 20130124880A KR 1020130007542 A KR1020130007542 A KR 1020130007542A KR 20130007542 A KR20130007542 A KR 20130007542A KR 20130124880 A KR20130124880 A KR 20130124880A
Authority
KR
South Korea
Prior art keywords
copper plating
electroless copper
plating bath
plating
concentration
Prior art date
Application number
KR1020130007542A
Other languages
English (en)
Korean (ko)
Inventor
다카히로 이시자키
도모하루 나카야마
데루유키 홋타
Original Assignee
우에무라 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우에무라 고교 가부시키가이샤 filed Critical 우에무라 고교 가부시키가이샤
Publication of KR20130124880A publication Critical patent/KR20130124880A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020130007542A 2012-05-07 2013-01-23 무전해 동 도금욕 및 무전해 동 도금 방법 KR20130124880A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-105924 2012-05-07
JP2012105924A JP6030848B2 (ja) 2012-05-07 2012-05-07 無電解銅めっき浴及び無電解銅めっき方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020200016929A Division KR102092929B1 (ko) 2012-05-07 2020-02-12 무전해 동 도금욕 및 무전해 동 도금 방법

Publications (1)

Publication Number Publication Date
KR20130124880A true KR20130124880A (ko) 2013-11-15

Family

ID=49512720

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130007542A KR20130124880A (ko) 2012-05-07 2013-01-23 무전해 동 도금욕 및 무전해 동 도금 방법
KR1020200016929A KR102092929B1 (ko) 2012-05-07 2020-02-12 무전해 동 도금욕 및 무전해 동 도금 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020200016929A KR102092929B1 (ko) 2012-05-07 2020-02-12 무전해 동 도금욕 및 무전해 동 도금 방법

Country Status (5)

Country Link
US (1) US20130295294A1 (ja)
JP (1) JP6030848B2 (ja)
KR (2) KR20130124880A (ja)
CN (1) CN103388138B (ja)
TW (1) TWI593824B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6645881B2 (ja) 2016-03-18 2020-02-14 上村工業株式会社 銅めっき液及び銅めっき方法
CN105648426B (zh) * 2016-03-23 2017-03-15 深圳市松柏实业发展有限公司 沉铜组合液
JP7064115B2 (ja) * 2016-08-15 2022-05-10 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 電解銅めっきのための酸性水性組成物
CN108336473A (zh) * 2018-02-06 2018-07-27 北京宏诚创新科技有限公司 铜-铝纳米接面常温制程方法
US20220049357A1 (en) * 2019-04-10 2022-02-17 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing same
DE112021005992T5 (de) 2020-11-10 2023-08-24 Meltex Inc. Lösung für die stromlose kupferplattierung
CN113463074B (zh) * 2021-06-03 2022-06-14 广东硕成科技股份有限公司 一种沉铜组合物及沉铜方法
CN115440989A (zh) * 2022-09-30 2022-12-06 楚能新能源股份有限公司 一种锂离子电池用负极集流体、极片及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition
NL7304650A (ja) * 1973-04-04 1974-10-08
US4143186A (en) * 1976-09-20 1979-03-06 Amp Incorporated Process for electroless copper deposition from an acidic bath
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
USH325H (en) * 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
US4374009A (en) * 1981-09-28 1983-02-15 Xerox Corporation Electrochemical post treatment of perpendicular magnetic recording media
JPH05195237A (ja) * 1992-01-21 1993-08-03 Hitachi Ltd ホルマリンを用いない化学銅めっき方法
JP2001131761A (ja) * 1999-11-02 2001-05-15 Murata Mfg Co Ltd 無電解銅めっき浴、無電解銅めっき方法および電子部品
JP2004273315A (ja) * 2003-03-10 2004-09-30 Sharp Corp イオン発生装置、空気調節装置および荷電装置

Also Published As

Publication number Publication date
KR20200020750A (ko) 2020-02-26
JP2013234343A (ja) 2013-11-21
KR102092929B1 (ko) 2020-03-24
CN103388138A (zh) 2013-11-13
TW201346068A (zh) 2013-11-16
JP6030848B2 (ja) 2016-11-24
TWI593824B (zh) 2017-08-01
CN103388138B (zh) 2018-07-24
US20130295294A1 (en) 2013-11-07

Similar Documents

Publication Publication Date Title
KR102092929B1 (ko) 무전해 동 도금욕 및 무전해 동 도금 방법
CA2875317C (en) Plating bath for electroless deposition of nickel layers
JP5136746B2 (ja) アルミニウム又はアルミニウム合金の表面処理方法
JP6980017B2 (ja) 錫めっき浴および錫もしくは錫合金を基材の表面に析出させる方法
JP5699794B2 (ja) アルミニウム酸化皮膜用除去液及びアルミニウム又はアルミニウム合金の表面処理方法
JP2000144441A (ja) 無電解金めっき方法及びそれに使用する無電解金めっき液
KR20070037312A (ko) 범프 형성용 비시안계 전해 금 도금욕
KR20180044923A (ko) 금의 무전해 도금을 위한 도금욕 조성물 및 금 층을 침착시키는 방법
US20080206474A1 (en) Stabilization and Performance of Autocatalytic Electroless Processes
JP5583896B2 (ja) パラジウムおよびパラジウム合金の高速めっき方法
JP6448634B2 (ja) スズを金でドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置
KR101873626B1 (ko) 무전해 도금하기 위한 구리 표면을 활성화하는 방법
JP4822519B2 (ja) 半導体ウェハーの前処理剤及び前処理方法
JP7012135B2 (ja) 無電解銅めっき及び不動態化の阻止
JP2001192886A (ja) 金−錫合金電気めっき浴
JP7111410B1 (ja) 無電解銅めっき液
EP3792374B1 (en) Electroless copper plating bath
JP6043996B2 (ja) ノーシアン無電解金めっき浴

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
E601 Decision to refuse application
E801 Decision on dismissal of amendment
A107 Divisional application of patent