KR20130039170A - Light emitting device package - Google Patents

Abstract

An embodiment includes a light emitting device and a cavity formed on a lead frame on which the light emitting device is disposed, and including a body including a resin and glass fiber, wherein the content of the glass fiber is the content of the resin. It provides a light emitting device package of 0.2 times to 0.7 times.

Description

A light emitting device package

Embodiments relate to a light emitting device package.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As described in Publication No. 10-2008-0060114, the light emitting device package describes a light emitting device and a light emitting device in which the light emitting device and the light emitting device are disposed, and the resin material filled in the cavity and the cavity.

In recent years, research has been conducted on the light emitting device package to prevent peeling from occurring at the interface between the resin and the body.

The embodiment provides a light emitting device package that is easy to prevent interfacial peeling and moisture penetration by lowering the change of expansion and contraction caused by heat between the body and the resin material and between the body and the lead frame.

The light emitting device package according to the embodiment, the cavity is formed on the light emitting device and the lead frame on which the light emitting device is disposed, and includes a body containing crystalline resin and glass fiber, the content of the glass fiber Silver, the content of the crystalline resin may be 0.2 times to 0.7 times.

In the light emitting device package according to the embodiment, by controlling the content of the glass fiber included in the body to lower the thermal expansion of the body, the thermal expansion of the body and the lead frame can be similar to prevent moisture ingress, between the body and the resin There is an advantage in that the interface can be prevented from peeling off.

1 is a perspective view showing a light emitting device package according to an embodiment.
FIG. 2 is a cross-sectional view illustrating a cut surface of the light emitting device package illustrated in FIG. 1.
3 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
4 is a cross-sectional view showing a section AA ′ of the lighting apparatus shown in FIG. 3.
5 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the first embodiment.
6 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the second embodiment.

In the description of the present embodiment, when one element is described as being formed on an "on or under" of another element, the above (above) or below (below) ( on or under includes both the two elements are in direct contact with each other (directly) or one or more other elements are formed indirectly between the two elements (indirectly). Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Thus, the size of each component does not fully reflect its actual size.

In addition, angles and directions mentioned in the process of describing the structure of the light emitting device package herein are based on those described in the drawings. In the description of the structure constituting the light emitting device package in the specification, when the reference point and the positional relationship with respect to the angle is not clearly mentioned, reference is made to related drawings.

1 is a perspective view showing a light emitting device package according to an embodiment.

1 is a transparent perspective view illustrating a part of a light emitting device package. In the embodiment, the light emitting device package may be a top view type, but may be a side view type, but is not limited thereto.

Referring to FIG. 1, the light emitting device package 100 may include a light emitting device 10 and a body 20 on which the light emitting device 10 is disposed.

The body 20 may include a first partition wall 22 disposed in a first direction (not shown) and a second partition wall 24 disposed in a second direction (not shown) that crosses the first direction. The first and second barrier ribs 22 and 24 may be integrally formed with each other, and may be formed by injection molding, an etching process, or the like, without being limited thereto.

That is, the first and second barrier ribs 22 and 24 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, liquid crystal polymer (PSG, photo sensitive glass), polyamide 9T (PA9T), neogeotactic polystyrene (SPS), metal, sapphire (Al2O3), beryllium oxide (BeO), ceramic, and at least one printed circuit board (PCB) Can be formed.

In an embodiment, the body 20 is, for example, polyphthalamide ( PPA: Polyphthalamide) Glass  Fiber ( Glass Fiber It will be described as including).

Where Polyphthalamide  Heat Expansion rate  50 to 70 ppm / C can be said Glass  The content of fiber is Polyphthalamide  0.1 to 0.8 times the content, 5 to 7 ppm Of / C Thermal expansion rate  Can have

At this time, the body included in the 20 Glass  The content of the fiber is the first and second lead frames (to be described later) 13, 14) Thermal expansion rate  It may be varied in consideration, but is not limited thereto.

That is, the included in the body 20 Glass  Fiber increases in stiffness with increasing content stiffness ) And strength ( strength ) Increases, which will be described later Of resinous material (18)  Because the elastic modulus is low Of resin (18)  The rate of deformation by expansion and contraction can be lowered.

In other words, the above Polyphthalamide  remind Glass  Fiber Thermal expansion  topping Thermal expansion rate  The amount of expansion and contraction caused by heat In large  1, 2 Lead Lame (13, 14) and Resin Interfacial delamination between 18 may occur, but Glass  Reminding the content of fiber Polyphthalamide  By 0.1 to 0.8 times the content, the expansion and contraction amount of the body 20 is first, second Of the leadframes (13, 14) Coefficient of thermal expansion  By maintaining the same or 1.1 times to 3 times the thermal expansion, it is possible to prevent the moisture to flow into the body (20).

Thus, the body 20 is in the light emitting element 10 Generated  As the amount of expansion and contraction caused by heat is lowered, Medial side Resin Interfacial separation between the 18 can be prevented, and the body 20 and the first and second Leadframe Flowing in between (13, 14) Flux  And moisture.

The upper and upper surfaces of the first and second partitions 22 and 24 may have various shapes such as triangles, squares, polygons, and circles, depending on the use and design of the light emitting device 10, but the present invention is not limited thereto.

In addition, the first and second partitions 22 and 24 form a cavity s in which the light emitting device 10 is disposed, and the cross-sectional shape of the cavity s may be formed in a cup shape, a concave container shape, or the like. The first and second partitions 22 and 24 constituting the cavity s may be inclined downward.

In addition, the planar shape of the cavity s may have various shapes such as triangles, squares, polygons, and circles, without being limited thereto.

First and second lead frames 13 and 14 may be disposed on the lower surface of the body 20, and the first and second lead frames 13 and 14 may be formed of a metal material, for example, titanium (Ti) or copper. (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), It may include one or more materials or alloys of indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe). .

In addition, the first and second lead frames 13 and 14 may be formed to have a single layer or a multilayer structure, and the present invention is not limited thereto and may have a thermal expansion rate of 13 ppm / C to 15 ppm / C.

Inner surfaces of the first and second barrier ribs 22 and 24 are formed to be inclined at a predetermined inclination angle with respect to any one of the first and second lead frames 13 and 14, and according to the inclination angle, The reflection angle of the light emitted may vary, and thus the directivity angle of the light emitted to the outside may be adjusted. The concentration of light emitted from the light emitting device 10 to the outside increases as the directivity of the light decreases, while the concentration of light emitted from the light emitting device 10 to the outside decreases as the directivity of the light increases.

The inner surface of the body 20 may have a plurality of inclination angles, but is not limited thereto.

The first and second lead frames 13 and 14 are electrically connected to the light emitting device 10, and are connected to the positive and negative poles of an external power source (not shown), respectively, to provide the light emitting device 10. ) Can be powered.

In an embodiment, the light emitting device 10 is disposed on the first lead frame 13, and the second lead frame 14 is described as being spaced apart from the first lead frame 13. Die-bonded with the first lead frame 13 and wire-bonded by the second lead frame 14 and a wire (not shown), so that power can be supplied from the first and second lead frames 13 and 14.

Here, the light emitting device 10 may be bonded to the first lead frame 13 and the second lead frame 14 with different polarities.

In addition, the light emitting device 10 may be wire-bonded or die-bonded to each of the first and second lead frames 13 and 14, and the connection method is not limited.

In the embodiment, the light emitting device 10 is described as being disposed in the first lead frame 13, but is not limited thereto.

The light emitting device 10 may be adhered to the first lead frame 13 by an adhesive member (not shown).

Here, an insulating dam 16 may be formed between the first and second lead frames 13 and 14 to prevent electrical shorts (shorts) of the first and second lead frames 13 and 14.

In an embodiment, the insulating dam 16 may be formed in a semicircular shape at an upper portion thereof, but is not limited thereto.

The body 13 may be formed with a cathode mark 17. The cathode mark 17 distinguishes the polarity of the light emitting element 10, that is, the polarity of the first and second lead frames 13 and 14, so that the cathode marks 17 are confused when the first and second lead frames 13 and 14 are electrically connected. May be used to prevent this.

The light emitting device 10 may be a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode emitting red, green, blue, or white light, or an ultraviolet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. There may be a plurality of light emitting devices 10 mounted on the frame 13, and at least one light emitting device 10 may be mounted on the first and second lead frames 13 and 14, respectively. The number and mounting positions of 10) are not limited.

The body 20 may include a resin material 18 filled in the cavity s. That is, the resin material 18 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

At this time, Of resin (18) The coefficient of thermal expansion  100 ppm / C to 210 ppm / C.

In addition, the resin material 18 may be formed in a film form, and may include at least one of a phosphor and a light diffusing material, and a light transmitting material that does not include the phosphor and the light diffusing material, for example, a transparent epoxy and silicon based material. At least one of the resin may be included, but is not limited thereto.

FIG. 2 is a cross-sectional view illustrating a cut surface of the light emitting device package illustrated in FIG. 1.

FIG. 2 omits or briefly describes a configuration that overlaps with FIG. 1.

Referring to FIG. 2, the light emitting device package 100 is electrically connected to the light emitting device 10 and forms a cavity s on the first and second lead frames 13 and 14 spaced apart from each other. 20) and a resin 18 filled in the cavity s.

The light emitting device package 100 is described in detail with reference to FIG. 1, and a detailed description thereof will be omitted.

At this time, the body 20 may include a polyphthalamide resin ( PPA , 20a) and glass fiber ( glass fiber, 20b).

Here, the polyphthalamide resin 20a may have a higher amount of thermal expansion and contraction, that is, a higher coefficient of thermal expansion than that of the glass fiber 20b .

At this time, the thermal expansion rate of the body 20 may be lowered according to the content of the glass fiber 20b, the rigidity and elastic force of the glass fiber 20b may increase as the content is increased.

The body 20 may reduce deformation due to the expansion force and the contraction force of the resin material 18 as the rigidity and elastic force are increased.

In this case, the thermal expansion rate of the body 20 may be the same as the thermal expansion rate of the first lead frame 13 or may adjust the content of the glass fiber 20b to be 1.1 times to 3 times.

For example, the body 20 is the first expansion force (fa1) is applied to the first lead frame 13 due to the heat generated by the light emission of the light emitting element 10, the first lead frame 13 is the body The second expansion force fa2 may be applied in the direction (20).

In this case, when the first and second expansion forces fa1 and fa2 are identical to each other, the first and second expansion forces fa1 and fa2 may be uniformly contracted to a minimum state when the contraction proceeds, and the first expansion force fa1 is 1.1 to 3 times greater than the second expansion force fa2. When doubled, the interface peeling between the body 20 and the first lead frame 13 may not occur when shrinkage is performed.

As described above, the resin material 18 may include the silicone resin 18a and the phosphor 18b.

In the embodiment, the resin 18 is represented by a silicone-based resin and a phosphor, but may be a transparent epoxy and a light diffusing material, and may include at least two or more, but is not limited thereto.

At this time, the resin material 18 filled in the cavity (s) of the body 20 may be 100ppm / C to 210ppm /, which may be the thermal expansion rate of the silicone-based resin (18a), without being limited thereto.

The resin material 18 adhered to the inner surface of the body 20 may be expanded in the direction of the body 20 by the heat generated when light is emitted from the light emitting device 10, that is, at a third expansion force fa3 toward the interface. As described above, the body 20 may be inflated at the interface with the first expansion force fa1.

At this time, the thermal expansion rate of the body 20 is lower than the thermal expansion rate of the resin material 18, so that peeling does not occur at the interface, and when the body 20 and the resin material 18 are contracted, the body 20 The shrinkage of the resin is also lowered, so that the amount of expansion and contraction of the body 20 and the resin material 18 at the interface is not large, thereby reducing the interface peeling.

3 is a perspective view showing a lighting device including a light emitting device package according to the embodiment, Figure 4 is a cross-sectional view showing a cross-section A 'A of the lighting device shown in FIG.

Hereinafter, in order to describe the shape of the lighting apparatus 300 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 300, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 4 is a cross-sectional view of the lighting apparatus 300 of FIG. 3 cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. As shown in FIG.

3 and 4, the lighting device 300 may include a body 310, a cover 330 fastened to the body 310, and a closing cap 350 positioned at both ends of the body 310. have.

The lower surface of the body 310 is fastened to the light emitting device module 340, the body 310 is conductive so that the heat generated in the light emitting device package 344 can be discharged to the outside through the upper surface of the body 310 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device module 340 may include a light emitting device array (not shown) including a light emitting device package 344 and a printed circuit board 342.

The light emitting device package 344 may be mounted on the PCB 342 in a multi-colored, multi-row array to form an array. The light emitting device package 344 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. The PCB 342 may be a metal core PCB (MCPCB) or a PCB made of FR4.

The cover 330 may be formed in a circular shape to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the light emitting device module 340 from the outside and the like. In addition, the cover 330 may include diffusing particles to prevent glare of the light generated from the light emitting device package 344, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 330 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 330.

On the other hand, since the light generated from the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 344. The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 350 is located at both ends of the body 310 may be used for sealing the power supply (not shown). In addition, the closing cap 350 is formed with a power pin 352, the lighting device 300 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

5 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the first embodiment.

5 is an edge-light method, and the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

The liquid crystal display panel 410 may display an image using light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 412 may implement a color of an image displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to the printed circuit board 418 on which a plurality of circuit components are mounted through the driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 may convert the light provided from the light emitting device module 420, the light emitting device module 420 into a surface light source, and provide the light guide plate 430 to the liquid crystal display panel 410. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 430 and the plurality of films 450, 464, 466 to uniform the luminance distribution of the light provided from the 430 and improve the vertical incidence ( 447).

The light emitting device module 420 may include a PCB substrate 422 such that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 may be mounted to form an array.

On the other hand, the backlight unit 470 is a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410, and a prism film 450 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 464 for protecting the prism film 450.

6 is an exploded perspective view of a liquid crystal display including the light emitting device package according to the second embodiment.

However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6 illustrates a direct method, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 5, a detailed description thereof will be omitted.

The backlight unit 570 includes a plurality of light emitting device modules 523, a reflective sheet 524, a lower chassis 530 in which the light emitting device modules 523 and the reflective sheet 524 are accommodated, and an upper portion of the light emitting device module 523. It may include a diffusion plate 540 and a plurality of optical film 560 disposed in the.

The light emitting device module 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

The reflective sheet 524 reflects the light generated from the light emitting device package 522 in the direction in which the liquid crystal display panel 510 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 523 is incident on the diffusion plate 540, the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the lighting device 300 and the liquid crystal display device (400, 500) may be included in the lighting system, in addition to the light emitting device package, and the purpose of the lighting may also be included in the lighting system.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (10)

A light emitting element; And
A cavity is formed on a lead frame in which the light emitting device is disposed, the body including a resin and glass fiber;
The content of the glass fiber,
Light emitting device package of 0.2 to 0.7 times the earth content of the resin. The method of claim 1, wherein the thermal expansion of the glass fiber,
Light emitting device package of 0.1 to 0.8 times the thermal expansion of the resin. The method of claim 1, wherein the thermal expansion of the glass fiber,
5 to 8 ppm / C light emitting device package. The method of claim 1,
Thermal expansion of the body,
Equal to the thermal expansion of the lead frame,
Or 1.1 to 3 times greater than the thermal expansion of the lead frame. The thermal expansion of the lead frame according to claim 1,
13 ppm / C to 15 ppm / C light emitting device package. The method of claim 1, wherein the lead frame,
And a first lead frame and a second lead frame electrically connected to the light emitting device and spaced apart from each other. The method of claim 1, wherein the resin,
Polyphthalamide (PPA: Polyphthalamide), Silicon (Si), Aluminum (Al), Aluminum Nitride (AlN), AlOx, Liquid Crystal Polymer (PSG, photo sensitive glass), Polyamide 9T (PA9T), Syndiotactic Polystyrene ( SPS), a metal material, sapphire (Al 2 O 3), beryllium oxide (BeO) comprising at least one light emitting device package. The method of claim 1, wherein the resin is,
A light emitting device package comprising at least one of a phosphor and a light diffuser. The method of claim 1,
The resin material,
At least one of a transparent epoxy and a silicone-based resin,
Thermal expansion of the resin,
100 ppm / C to 210 ppm / C light emitting device package. 10. An illumination system comprising the light emitting device package of any one of claims 1-9.

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