KR20120101357A - 광학 센서를 위한 광 신호 송신기 및 광 수신기 - Google Patents

광학 센서를 위한 광 신호 송신기 및 광 수신기 Download PDF

Info

Publication number
KR20120101357A
KR20120101357A KR1020127010615A KR20127010615A KR20120101357A KR 20120101357 A KR20120101357 A KR 20120101357A KR 1020127010615 A KR1020127010615 A KR 1020127010615A KR 20127010615 A KR20127010615 A KR 20127010615A KR 20120101357 A KR20120101357 A KR 20120101357A
Authority
KR
South Korea
Prior art keywords
optical
printed circuit
circuit board
light source
semiconductor based
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127010615A
Other languages
English (en)
Korean (ko)
Inventor
프랭크 라흐너
토마스 보엘켈
Original Assignee
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지멘스 악티엔게젤샤프트 filed Critical 지멘스 악티엔게젤샤프트
Publication of KR20120101357A publication Critical patent/KR20120101357A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/02—Prospecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Geophysics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Lasers (AREA)
KR1020127010615A 2009-10-29 2010-10-28 광학 센서를 위한 광 신호 송신기 및 광 수신기 Ceased KR20120101357A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009051188.1 2009-10-29
DE200910051188 DE102009051188A1 (de) 2009-10-29 2009-10-29 Lichtsignalgeber und Lichtempfänger für einen optischen Sensor

Publications (1)

Publication Number Publication Date
KR20120101357A true KR20120101357A (ko) 2012-09-13

Family

ID=43797830

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127010615A Ceased KR20120101357A (ko) 2009-10-29 2010-10-28 광학 센서를 위한 광 신호 송신기 및 광 수신기

Country Status (6)

Country Link
US (1) US8851733B2 (enExample)
EP (1) EP2494384A2 (enExample)
JP (1) JP2013509699A (enExample)
KR (1) KR20120101357A (enExample)
DE (1) DE102009051188A1 (enExample)
WO (1) WO2011051370A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009051188A1 (de) 2009-10-29 2011-05-19 Siemens Aktiengesellschaft Lichtsignalgeber und Lichtempfänger für einen optischen Sensor
TWI511005B (zh) * 2013-12-20 2015-12-01 Qisda Corp 顯示裝置及其紅外線觸控模組
DE102016107153B4 (de) * 2016-04-18 2018-10-18 Sick Ag Optoelektronischer Sensor
CN106547033B (zh) * 2016-09-28 2018-08-07 西北工业大学 一种可移动的微纳偏振光栅阵列装置及其使用方法
DE202016106394U1 (de) 2016-11-15 2018-02-16 Sick Ag Mehrstrahllichtschranke
DE102016121913A1 (de) 2016-11-15 2018-05-17 Sick Ag Mehrstrahllichtschranke
DE102019118978B4 (de) * 2019-07-12 2025-09-18 OSRAM CONTINENTAL GmbH Optische Anordnung und Fahrzeug
CN112216656B (zh) * 2020-09-02 2021-07-06 珠海越亚半导体股份有限公司 一种具有定向光电传输通道的空腔基板及其制造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4407967C2 (de) 1994-03-10 1997-11-20 Leuze Electronic Gmbh & Co Elektronische Vorrichtung
EP0718974B1 (de) * 1994-12-22 2002-08-28 Optosys Ag Näherungsschalter
JPH09318853A (ja) 1996-03-29 1997-12-12 Sony Corp 光送受信装置および光通信ネットワーク
JPH10256648A (ja) 1997-03-13 1998-09-25 Hitachi Ltd レーザダイオード・モジュール
DE19858247C1 (de) * 1998-12-17 2000-01-27 Leuze Electronic Gmbh & Co Optoelektronische Vorrichtung zum Erfassen von Gegenständen in einem Überwachungsbereich
DE19947889C2 (de) * 1999-10-05 2003-03-06 Infineon Technologies Ag Optoelektronisches, bidirektionales Sende- und Empfangsmodul in Leadframe-Technik
AT5153U1 (de) 2001-03-22 2002-03-25 Avl List Gmbh Optischer sensor zur erfassung von verbrennungsvorgängen
DE10308085B4 (de) * 2002-03-08 2006-09-07 Leuze Electronic Gmbh & Co Kg Optoelektronische Vorrichtung
JP2004061799A (ja) * 2002-07-29 2004-02-26 Canon Inc 二次元光導波装置、およびそれを用いた光電融合配線基板
KR100449876B1 (ko) * 2002-12-05 2004-09-22 삼성전기주식회사 블록형 다채널 광신호를 연결할 수 있는 다층인쇄회로기판 및 그 방법
KR100451635B1 (ko) * 2002-12-10 2004-10-08 삼성전기주식회사 섬유 블록과 파이프 블록, 및 이를 이용하여 다층인쇄회로기판의 층간 광신호를 연결하는 방법
KR100499005B1 (ko) * 2002-12-27 2005-07-01 삼성전기주식회사 다채널 블록형 광원소자가 패키징된 인쇄회로기판
KR100528972B1 (ko) * 2003-10-27 2005-11-16 한국전자통신연구원 테이퍼진 광도파로가 내장된 광 인쇄회로기판 시스템
DE102004028814A1 (de) 2004-06-15 2006-01-05 Siemens Ag Leiterplatte und Verfahren zum Herstellen einer Leiterplatte
US7228020B2 (en) * 2004-08-31 2007-06-05 Finisar Corporation Optoelectronic arrangement having a surface-mountable semiconductor module and a cooling element
US7350934B2 (en) * 2005-05-03 2008-04-01 Delphi Technologies, Inc. Illuminated display system
AT503027B1 (de) * 2006-05-08 2007-07-15 Austria Tech & System Tech Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
AT503585B1 (de) 2006-05-08 2007-11-15 Austria Tech & System Tech Leiterplattenelement sowie verfahren zu dessen herstellung
JP2008084396A (ja) 2006-09-27 2008-04-10 Matsushita Electric Ind Co Ltd 半導体装置および半導体装置の製造方法、光ピックアップ装置および光ディスクドライブ装置
WO2008047286A2 (en) * 2006-10-16 2008-04-24 Koninklijke Philips Electronics N.V. Light emitting diode lighting device
CN101529156B (zh) * 2006-10-16 2012-03-21 皇家飞利浦电子股份有限公司 照明设备
AT505834B1 (de) * 2007-09-21 2009-09-15 Austria Tech & System Tech Leiterplattenelement
US7541058B2 (en) * 2007-10-09 2009-06-02 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate with internal optical pathway
DE102009051188A1 (de) 2009-10-29 2011-05-19 Siemens Aktiengesellschaft Lichtsignalgeber und Lichtempfänger für einen optischen Sensor

Also Published As

Publication number Publication date
DE102009051188A1 (de) 2011-05-19
EP2494384A2 (de) 2012-09-05
WO2011051370A2 (de) 2011-05-05
US8851733B2 (en) 2014-10-07
US20120218766A1 (en) 2012-08-30
WO2011051370A3 (de) 2012-04-19
JP2013509699A (ja) 2013-03-14

Similar Documents

Publication Publication Date Title
KR20120101357A (ko) 광학 센서를 위한 광 신호 송신기 및 광 수신기
US9134224B2 (en) Gas component detection device
US20060110110A1 (en) Optical turn system for optoelectronic modules
JP2017523467A (ja) 縦方向アライメント機構を含む発光体および光検出モジュール
JP2005234052A (ja) 光送受信モジュール
JP2013509699A5 (enExample)
CN101569023A (zh) 用于光电子器件的壳体和光电子器件在壳体中的布置
US6097521A (en) Optoelectronic module for bidirectional optical data transmission
JPWO2014136414A1 (ja) デバイス
JP2005234053A (ja) 光配線基板および光配線基板の製造方法
KR101386794B1 (ko) 광검출장치
CN110622308A (zh) 光电子传感器模块和制造光电子传感器模块的方法
JP7036236B2 (ja) 触覚及び近接センサ
USRE38280E1 (en) Optoelectronic module for bidirectional optical data transmission
JP4604036B2 (ja) 光学モジュールおよび光学システム
JP7123599B2 (ja) 受発光装置及び光学式濃度測定装置
JP5266859B2 (ja) 光電センサ
US20050276546A1 (en) Bidirectional emitting and receiving module
JP5823419B2 (ja) 光モジュールの製造方法
TWM461794U (zh) 光學裝置
KR101317586B1 (ko) 광검출장치
JP2009016698A (ja) フォトリフレクタ
TW201518690A (zh) 包括遠心成像系統之光學編碼器模組
JPS5982779A (ja) 光集積回路実装方法
TW201518691A (zh) 光學編碼器模組

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20120425

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20150909

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20161115

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20170621

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20161115

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I