Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
  • G01V8/00—Prospecting or detecting by optical means
  • G01V8/10—Detecting, e.g. by using light barriers
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
  • G01V8/00—Prospecting or detecting by optical means
  • G01V8/02—Prospecting
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
  • G01V8/00—Prospecting or detecting by optical means
  • G01V8/10—Detecting, e.g. by using light barriers
  • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/144—Stacked arrangements of planar printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/04—Assemblies of printed circuits
  • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Definitions

• the invention relates to a light signal transmitter for an optical sensor, in particular for a light barrier or a light sensor for an industrial automation system, according to the preamble of patent claim 1, and a light receiver ⁇ according to the preamble of patent claim 10.
• Optical sensors are used in many non-industrial and above all industrial applications, in particular in industrial automation arrangements, in many forms for detecting the presence or absence of Ge ⁇ objects or persons.
• Knownstrasbei ⁇ games are light barriers or light sensors in which from a light signal transmitter, that is, a light source, a light beam is emitted and is received by a photocell, a lichtemp ⁇ sensitive semiconductor device or a similar sensor ⁇ element; as light sensors are called "Refle ⁇ xionslicht Heen", one in which light source and receiver (sensor) are inte- grated with each other in a single device.
• a beam shaping of the light at the light signal transmitter must be (transmitter).
• LED semiconductor laser diode
• an optical system for example with egg ⁇ ner lens or a lens system ( "objective").
• object the actual light source
• a relatively small spot of light is generated, which ensures high switching and repeatability for the entry of OBJEK ⁇ th in the light beam and a mutual interference of similar adjacent systems installed reduced (ie, the signal to noise ratio improved), and the possible The acquisition distance is increased.
• the object is achieved by a light signal transmitter for an optical sensor according to claim 1 and by a
• a semiconductor-based light source preferably a semiconducting ⁇ ter-laser diode
• a printed circuit board wherein the light from the light source parallel to a plane of
• Circuit board is radiated and wherein in the or next to the circuit board, an element for beam deflection is provided.
• a similar construction is proposed for the light receiver (light detector).
• the solution of the problem provides in particular a light signal ⁇ encoder for an optical sensor, in particular for a light barrier or a light sensor for an industrial automation system, wherein a semiconductor-based light source is used to generate the light.
• the semiconductor-based light source is arranged in a space between outer layers of a multilayer printed circuit board, wherein the light exit direction of the semiconductor-based Light source is aligned substantially parallel to the layers of the circuit board, and wherein a deflection unit for deflecting the light emitted from the semiconductor-based light source light is provided in a direction substantially perpendicular to the layers of the circuit board.
• an equally flat-building light receiver can be produced as a receiver for an optical sensor arrangement, wherein instead of the semiconductor-based light source, a semi ⁇ based light sensor (CCD chip, CMOS chip) is used, the photosensitive surface substantially senk ⁇ is aligned right to the layers of the circuit board. Since ⁇ is in the deflection unit which to erfas- send by the sensor light from an incident direction which is perpendicular to the circuit board, vice ⁇ deflected in the plane of the circuit board so that the light can strike the light-sensitive sensor.
• Advantageous embodiments of the light signal transmitter according to the invention are specified in the dependent claims. The features and advantages described therein apply mutatis ⁇ Telss for corresponding embodiments of a light receiver according to the invention.
• the deflection element is arranged together with the semiconducting ⁇ terbas striving light source in the (a) space advantageous.
• the entire light signal transmitter can be manufactured as a single component or as a single portion of a circuit board also anderwei- tig used and mounted oh ⁇ ne that aligned the printed circuit board with the light source to the deflection element at an installation of the optical sensor or the light signal transmitter would have to be, or vice versa.
• This procedure is also advantageous for the production, because, first a lower layer (lower layer, carrier ⁇ layer) with the middle layers (layers), the semiconductor-based light source and the deflection element provided who the can ⁇ before (last the topmost layer of upper äuße- layer) is laminated.
• the deflecting element is arranged outside the construction space and thus also outside the printed circuit board.
• the circuit board on the front side an outlet opening for the light, which may also be provided with a transparent closure element.
• the transparent closure element can also be used as an optical lens or the like. be designed to form the steel or unfold the effect of an optical aperture, or be designed as an optical filter.
• the substantially transparent sealing element color filter
• a polarizing filter linear polarizing filter or circular polarizing filter
• the corresponding light receiver can be provided with just such a filtering, whereby better disturbance intervals can be achieved.
• Common deflecting elements are prisms or mirrors.
• the "mirror” may, in particular in the embodiment may be formed the reflection surface convex or concave for focusing or on ⁇ widening of the light beam
• the curvature need not necessarily be rotationally symmetrical;. Rather, they are also more complex geometries can be used advantageously, for example, ellipsoids, or a so-called saddle shape.
• conventional semiconductor laser diodes radiate the light asymmetrically, such geometries can also be selected for the reflection layer of prisms, results in advantages in the production (assembly) if the deflection element and at least one optical lens are too summarizes an op ⁇ tikmodul.
• such optical module may even before its installation in the space with the semi- conductor-based light source are connected (for example by gluing), so that in the assembly (assembly) of the components in the space, the optically active elements no longer need to be re-aligned.
• the semiconductor-based light source is for heat dissipation before ⁇ geous with at least one contact surface of the circuit board in contact. It can be provided between the contact surface of the circuit board and a surface of the semiconductor-based light source, an element for heat transfer and to compensate for distances, for example, a thermal pad or a thermal paste.
• the semiconductor-based light source is advantageously electrically connected to printed circuit boards, contact surfaces or solder pads of the printed circuit board by means of bonding ("chip bonding") or through plated-through holes, thus eliminating the need for expensive soldering or the provision of spring contacts or the like in the cases in which the semiconductor-based light source ⁇ ( "die”) is used as a housing-less chip.
• Such "non-precision" elements have particularly small outer Ab ⁇ measurements and are therefore particularly well suited for mounting in the flat space between the outer layers of a circuit board.
• FIG. 1 shows a light signal transmitter with a semiconductor-based light source and a deflecting element in a construction space between the outer layers of a multilayer printed circuit board
• 2 shows a corresponding to the figure 1 arrangement in which an optical module is provided with a deflecting element and a plurality of lenses in the space
• Figure 3 shows a light signal with a semiconductor-based light source in a space between the outer layers of a multilayer printed circuit board, wherein the deflection outside the Porterplat ⁇ tenan angel is arranged.
• a light signal transmitter is shown in a sectional view.
• a five-layer printed circuit board LP LAY is shown, wherein an installation space for the operative elements of the light signal transmitter is seen in a ⁇ Be ⁇ rich, in which only outer layers LAY are present.
• a semiconductor-based light source is provided, here: a laser diode LD.
• the laser diode LD ⁇ is electrically connected to a solder pad LPD of the lower outer layer LAY the circuit board and lies with its housing surfaces on cooling surfaces of the circuit board LP KF on.
• the upper region of the laser diode LD has a heat conducting pad WLP between the laser diode LD and the cooling surface KF, which in addition to the heat transfer also fills a gap between the laser diode LD and the upper layer LAY of the printed circuit board LP serves.
• FIG 1 are further electronic components EBT to se ⁇ hen, which are not inevitably with the function of Lichtsig ⁇ nalgebers related.
• the emitter EM of Laserdi- ode LD is aligned with its surface perpendicular to a base ⁇ surface of the printed circuit board LP, which means that he ⁇ witnessed light is parallel to the layers of the circuit board emit ⁇ out (in Figure 1: to the left) ,
• a beam SG is shown schematically in Figure 1 - lenses L are provided; are here to a schematic representation, instead of be ⁇ recorded two lenses L more complex lens systems can be ⁇ sets.
• Steering element UE provided in inclined position a mirror, which makes the emitted light in a direction perpendicular to the planes of the circuit board LP (here: upward).
• the light passes through an opening in the upper layer (upper layer) of the printed circuit board LP, in which exporting ⁇ approximately for this opening as a transparent closure element FS ( "Fil ⁇ terusion"), a further used for steel molding having lens L.
• the surface of the deflection element UE here: Spie ⁇ gel
• Characterized a ⁇ For mung (focusing) is achieved in addition the emitted light beam.
• the laser diode LD is a "non-gehaustes" semiconductor device, that is, that the frameless “The” directly to the printed circuit board LP and a solder pad used as a contact ⁇ surface LPD is wired.
• the technique of Used "chip bonding"; Other contacting techniques are also usable.
• the arrangement according to the invention can also be constructed from individual stacked or stacked printed circuit boards ("printed circuit board stacking") shown in which the optical elements are combined into one optical module OM the remaining components substantially correspond to the arrangement of Figure 1, so that the components and their be ⁇ reference numbers will be explained at this point again in the -.., based on the In this case, however, no lens is used as the element for beam shaping (focusing), but only an opening ASP ("recess"), which means that the optical module OM does not have to fit exactly onto the opening ASP or in an alternative embodiment, the transparent Cover B ⁇ submerged (closure element FS) of the top n layer LAY the Lei ⁇ terplatte LP are aligned.
• printed circuit board stacking printed circuit board stacking
• FIG. 3 shows an embodiment of the light signal transmitter in which only the semiconductor-based light source and optionally a lens L or a lens system (lens) is integrated in the printed circuit board LP, but not the deflection element UE and optionally further optical elements.
• the optical elements in particular the deflecting element UE, can be dimensioned larger. This solution is particularly before ⁇ part way in the cases where the printed circuit board LP see again in a separate housing G with receptacles AOE for the optical elements is installed.
• Spacers AH between the housing G and the upper layer OL and the lower layer UL of the printed circuit board LP serve on the one hand, the fixation of the printed circuit board LP, and on the other the exact alignment of the printed circuit board LP and thus of the light emitter EM on the deflection element UE and other external optical elements.
• a light receiver (light detector) for an optical sensor can also be constructed.
• a semiconductor-based light detector for example a CCD sensor or a CMOS sensor, is used.
• the beam path SG of the light is the same, wherein of course the beam direction is reversed.

Landscapes

• Physics & Mathematics (AREA)
• Life Sciences & Earth Sciences (AREA)
• General Life Sciences & Earth Sciences (AREA)
• General Physics & Mathematics (AREA)
• Geophysics (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Optical Couplings Of Light Guides (AREA)
• Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
• Photometry And Measurement Of Optical Pulse Characteristics (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
• Structure Of Printed Boards (AREA)
• Semiconductor Lasers (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=43797830

Family Applications (1)

Country Status (6)

Families Citing this family (8)

Family Cites Families (24)

• 2009
  • 2009-10-29 DE DE200910051188 patent/DE102009051188A1/de not_active Ceased
• 2010
  • 2010-10-28 EP EP10775774A patent/EP2494384A2/de not_active Withdrawn
  • 2010-10-28 WO PCT/EP2010/066318 patent/WO2011051370A2/de not_active Ceased
  • 2010-10-28 JP JP2012535820A patent/JP2013509699A/ja active Pending
  • 2010-10-28 KR KR1020127010615A patent/KR20120101357A/ko not_active Ceased
  • 2010-10-28 US US13/504,987 patent/US8851733B2/en not_active Expired - Fee Related

Non-Patent Citations (1)

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