JP2013509699A - 光学的センサのための光発信器および光受信器 - Google Patents

光学的センサのための光発信器および光受信器 Download PDF

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Publication number
JP2013509699A
JP2013509699A JP2012535820A JP2012535820A JP2013509699A JP 2013509699 A JP2013509699 A JP 2013509699A JP 2012535820 A JP2012535820 A JP 2012535820A JP 2012535820 A JP2012535820 A JP 2012535820A JP 2013509699 A JP2013509699 A JP 2013509699A
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JP
Japan
Prior art keywords
optical
printed circuit
circuit board
light source
semiconductor
Prior art date
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Pending
Application number
JP2012535820A
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English (en)
Japanese (ja)
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JP2013509699A5 (enExample
Inventor
ラーナー、フランク
フェルケル、トーマス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JP2013509699A publication Critical patent/JP2013509699A/ja
Publication of JP2013509699A5 publication Critical patent/JP2013509699A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/02—Prospecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

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  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Geophysics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Lasers (AREA)
JP2012535820A 2009-10-29 2010-10-28 光学的センサのための光発信器および光受信器 Pending JP2013509699A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009051188.1 2009-10-29
DE200910051188 DE102009051188A1 (de) 2009-10-29 2009-10-29 Lichtsignalgeber und Lichtempfänger für einen optischen Sensor
PCT/EP2010/066318 WO2011051370A2 (de) 2009-10-29 2010-10-28 Lichtsignalgeber und lichtempfänger für einen optischen sensor

Publications (2)

Publication Number Publication Date
JP2013509699A true JP2013509699A (ja) 2013-03-14
JP2013509699A5 JP2013509699A5 (enExample) 2014-07-31

Family

ID=43797830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012535820A Pending JP2013509699A (ja) 2009-10-29 2010-10-28 光学的センサのための光発信器および光受信器

Country Status (6)

Country Link
US (1) US8851733B2 (enExample)
EP (1) EP2494384A2 (enExample)
JP (1) JP2013509699A (enExample)
KR (1) KR20120101357A (enExample)
DE (1) DE102009051188A1 (enExample)
WO (1) WO2011051370A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022042484A (ja) * 2020-09-02 2022-03-14 ズハイ アクセス セミコンダクター シーオー．，エルティーディー 指向性光電伝送路を有するキャビティ基板およびその製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009051188A1 (de) 2009-10-29 2011-05-19 Siemens Aktiengesellschaft Lichtsignalgeber und Lichtempfänger für einen optischen Sensor
TWI511005B (zh) * 2013-12-20 2015-12-01 Qisda Corp 顯示裝置及其紅外線觸控模組
DE102016107153B4 (de) * 2016-04-18 2018-10-18 Sick Ag Optoelektronischer Sensor
CN106547033B (zh) * 2016-09-28 2018-08-07 西北工业大学 一种可移动的微纳偏振光栅阵列装置及其使用方法
DE202016106394U1 (de) 2016-11-15 2018-02-16 Sick Ag Mehrstrahllichtschranke
DE102016121913A1 (de) 2016-11-15 2018-05-17 Sick Ag Mehrstrahllichtschranke
DE102019118978B4 (de) * 2019-07-12 2025-09-18 OSRAM CONTINENTAL GmbH Optische Anordnung und Fahrzeug

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4407967A1 (de) * 1994-03-10 1995-10-05 Leuze Electronic Gmbh & Co Elektronische Vorrichtung
JPH09318853A (ja) * 1996-03-29 1997-12-12 Sony Corp 光送受信装置および光通信ネットワーク
JPH10256648A (ja) * 1997-03-13 1998-09-25 Hitachi Ltd レーザダイオード・モジュール
US20020134138A1 (en) * 2001-03-22 2002-09-26 Harald Philipp Optical sensor or emitter used for monitoring combustion processes
DE10308085A1 (de) * 2002-03-08 2003-10-02 Leuze Electronic Gmbh & Co Optoelektronische Vorrichtung
DE102004028814A1 (de) * 2004-06-15 2006-01-05 Siemens Ag Leiterplatte und Verfahren zum Herstellen einer Leiterplatte
WO2007128022A2 (de) * 2006-05-08 2007-11-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement und methode der herstellung
WO2007128021A1 (de) * 2006-05-08 2007-11-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
JP2008084396A (ja) * 2006-09-27 2008-04-10 Matsushita Electric Ind Co Ltd 半導体装置および半導体装置の製造方法、光ピックアップ装置および光ディスクドライブ装置
WO2009036478A2 (de) * 2007-09-21 2009-03-26 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement und verfahren zu dessen herstellung

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EP0718974B1 (de) * 1994-12-22 2002-08-28 Optosys Ag Näherungsschalter
DE19858247C1 (de) * 1998-12-17 2000-01-27 Leuze Electronic Gmbh & Co Optoelektronische Vorrichtung zum Erfassen von Gegenständen in einem Überwachungsbereich
DE19947889C2 (de) * 1999-10-05 2003-03-06 Infineon Technologies Ag Optoelektronisches, bidirektionales Sende- und Empfangsmodul in Leadframe-Technik
JP2004061799A (ja) * 2002-07-29 2004-02-26 Canon Inc 二次元光導波装置、およびそれを用いた光電融合配線基板
KR100449876B1 (ko) * 2002-12-05 2004-09-22 삼성전기주식회사 블록형 다채널 광신호를 연결할 수 있는 다층인쇄회로기판 및 그 방법
KR100451635B1 (ko) * 2002-12-10 2004-10-08 삼성전기주식회사 섬유 블록과 파이프 블록, 및 이를 이용하여 다층인쇄회로기판의 층간 광신호를 연결하는 방법
KR100499005B1 (ko) * 2002-12-27 2005-07-01 삼성전기주식회사 다채널 블록형 광원소자가 패키징된 인쇄회로기판
KR100528972B1 (ko) * 2003-10-27 2005-11-16 한국전자통신연구원 테이퍼진 광도파로가 내장된 광 인쇄회로기판 시스템
US7228020B2 (en) * 2004-08-31 2007-06-05 Finisar Corporation Optoelectronic arrangement having a surface-mountable semiconductor module and a cooling element
US7350934B2 (en) * 2005-05-03 2008-04-01 Delphi Technologies, Inc. Illuminated display system
WO2008047286A2 (en) * 2006-10-16 2008-04-24 Koninklijke Philips Electronics N.V. Light emitting diode lighting device
CN101529156B (zh) * 2006-10-16 2012-03-21 皇家飞利浦电子股份有限公司 照明设备
US7541058B2 (en) * 2007-10-09 2009-06-02 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate with internal optical pathway
DE102009051188A1 (de) 2009-10-29 2011-05-19 Siemens Aktiengesellschaft Lichtsignalgeber und Lichtempfänger für einen optischen Sensor

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4407967A1 (de) * 1994-03-10 1995-10-05 Leuze Electronic Gmbh & Co Elektronische Vorrichtung
JPH09318853A (ja) * 1996-03-29 1997-12-12 Sony Corp 光送受信装置および光通信ネットワーク
JPH10256648A (ja) * 1997-03-13 1998-09-25 Hitachi Ltd レーザダイオード・モジュール
US20020134138A1 (en) * 2001-03-22 2002-09-26 Harald Philipp Optical sensor or emitter used for monitoring combustion processes
DE10308085A1 (de) * 2002-03-08 2003-10-02 Leuze Electronic Gmbh & Co Optoelektronische Vorrichtung
DE102004028814A1 (de) * 2004-06-15 2006-01-05 Siemens Ag Leiterplatte und Verfahren zum Herstellen einer Leiterplatte
WO2007128022A2 (de) * 2006-05-08 2007-11-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement und methode der herstellung
WO2007128021A1 (de) * 2006-05-08 2007-11-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
JP2008084396A (ja) * 2006-09-27 2008-04-10 Matsushita Electric Ind Co Ltd 半導体装置および半導体装置の製造方法、光ピックアップ装置および光ディスクドライブ装置
WO2009036478A2 (de) * 2007-09-21 2009-03-26 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement und verfahren zu dessen herstellung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022042484A (ja) * 2020-09-02 2022-03-14 ズハイ アクセス セミコンダクター シーオー．，エルティーディー 指向性光電伝送路を有するキャビティ基板およびその製造方法
JP7423579B2 (ja) 2020-09-02 2024-01-29 ズハイ アクセス セミコンダクター シーオー．，エルティーディー 指向性光電伝送路を有するキャビティ基板およびその製造方法

Also Published As

Publication number Publication date
DE102009051188A1 (de) 2011-05-19
EP2494384A2 (de) 2012-09-05
KR20120101357A (ko) 2012-09-13
WO2011051370A2 (de) 2011-05-05
US8851733B2 (en) 2014-10-07
US20120218766A1 (en) 2012-08-30
WO2011051370A3 (de) 2012-04-19

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