KR20120095787A - 기판 세정 장치, 기판 세정 방법, 표시 장치의 제조 장치 및 표시 장치의 제조 방법 - Google Patents

기판 세정 장치, 기판 세정 방법, 표시 장치의 제조 장치 및 표시 장치의 제조 방법 Download PDF

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Publication number
KR20120095787A
KR20120095787A KR1020120014691A KR20120014691A KR20120095787A KR 20120095787 A KR20120095787 A KR 20120095787A KR 1020120014691 A KR1020120014691 A KR 1020120014691A KR 20120014691 A KR20120014691 A KR 20120014691A KR 20120095787 A KR20120095787 A KR 20120095787A
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KR
South Korea
Prior art keywords
substrate
cleaning liquid
cleaning
brush
board
Prior art date
Application number
KR1020120014691A
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English (en)
Korean (ko)
Inventor
히데아키 데라카도
요시히로 안도
유키노부 니시베
하루미치 히로세
요시타카 야마모토
고이치 다나카
준이치 다나카
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
샤프 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤, 샤프 가부시키가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20120095787A publication Critical patent/KR20120095787A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020120014691A 2011-02-21 2012-02-14 기판 세정 장치, 기판 세정 방법, 표시 장치의 제조 장치 및 표시 장치의 제조 방법 KR20120095787A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-034582 2011-02-21
JP2011034582A JP2012170872A (ja) 2011-02-21 2011-02-21 基板洗浄装置、基板洗浄方法、表示装置の製造装置及び表示装置の製造方法

Publications (1)

Publication Number Publication Date
KR20120095787A true KR20120095787A (ko) 2012-08-29

Family

ID=46659368

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120014691A KR20120095787A (ko) 2011-02-21 2012-02-14 기판 세정 장치, 기판 세정 방법, 표시 장치의 제조 장치 및 표시 장치의 제조 방법

Country Status (4)

Country Link
JP (1) JP2012170872A (zh)
KR (1) KR20120095787A (zh)
CN (1) CN102646616A (zh)
TW (1) TW201239971A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101455242B1 (ko) * 2012-06-29 2014-11-03 주식회사 신생테크 미세기포를 이용한 세척 방법 및 시스템
CN108580407A (zh) * 2018-01-23 2018-09-28 滁州英诺信电器有限公司 印刷前基材清洁工艺
CN112570332A (zh) * 2019-09-27 2021-03-30 株式会社斯库林集团 基板处理装置
WO2021201441A1 (ko) * 2020-03-31 2021-10-07 스템코 주식회사 기판의 이물질 제거 장치 및 방법

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CN103157629B (zh) * 2013-03-21 2015-03-18 贵州开磷（集团）有限责任公司 一种磷石膏输送管状皮带清洗方法
US9704729B2 (en) * 2013-06-13 2017-07-11 K.C. Tech Co., Ltd. Substrate cleaning apparatus and method and brush assembly used therein
JP2015112506A (ja) * 2013-12-09 2015-06-22 日東精工株式会社 洗浄装置
CN103913072B (zh) * 2014-04-09 2016-01-20 宝钢工程技术集团有限公司 一种自清洁观察窗装置
CN114798653A (zh) * 2014-11-24 2022-07-29 康宁股份有限公司 用于基材表面清洁的方法和设备
JP6543534B2 (ja) * 2015-08-26 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN105116574B (zh) * 2015-09-25 2018-09-11 京东方科技集团股份有限公司 一种基板传送装置及基板清洗设备
CN106944381A (zh) * 2016-01-06 2017-07-14 中芯国际集成电路制造(上海)有限公司 晶圆清洗装置及其清洗方法
KR102185140B1 (ko) * 2016-12-28 2020-12-01 시바우라 메카트로닉스 가부시키가이샤 기판 처리 장치 및 기판 처리 방법
CN108499927A (zh) * 2017-02-27 2018-09-07 上海艾展电子有限公司 一种废旧线束清洗设备
JP2019150801A (ja) * 2018-03-06 2019-09-12 シャープ株式会社 洗浄装置
CN110544647A (zh) * 2018-11-06 2019-12-06 北京北方华创微电子装备有限公司 金属互连清洗装置及清洗方法
CN110813853B (zh) * 2019-09-23 2021-12-10 马鞍山市龙腾机电科技有限公司 专用于电机外壳的静电泡沫清洗方法
CN110586566A (zh) * 2019-10-09 2019-12-20 苏州敬天爱人环境科技有限公司 一种微纳米气泡清理装置
CN112023544A (zh) * 2020-09-10 2020-12-04 李作乐 一种橡胶加工的废气处理净化塔
CN114554715B (zh) * 2022-01-11 2023-06-27 福建闽威科技股份有限公司 一种电路板表面处理方法
JP2024017903A (ja) * 2022-07-28 2024-02-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243735A (ja) * 1999-02-18 2000-09-08 Toshiba Corp 基板及びブラシ洗浄装置及び洗浄方法
JP4602567B2 (ja) * 2000-12-15 2010-12-22 芝浦メカトロニクス株式会社 基板の洗浄装置
CN101604625B (zh) * 2005-04-20 2011-06-01 飞思卡尔半导体公司 清洗电路衬底的设备
JP5252861B2 (ja) * 2007-01-15 2013-07-31 芝浦メカトロニクス株式会社 基板の処理装置
JP5053115B2 (ja) * 2008-02-05 2012-10-17 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101455242B1 (ko) * 2012-06-29 2014-11-03 주식회사 신생테크 미세기포를 이용한 세척 방법 및 시스템
CN108580407A (zh) * 2018-01-23 2018-09-28 滁州英诺信电器有限公司 印刷前基材清洁工艺
CN112570332A (zh) * 2019-09-27 2021-03-30 株式会社斯库林集团 基板处理装置
CN112570332B (zh) * 2019-09-27 2023-01-17 株式会社斯库林集团 基板处理装置
WO2021201441A1 (ko) * 2020-03-31 2021-10-07 스템코 주식회사 기판의 이물질 제거 장치 및 방법

Also Published As

Publication number Publication date
CN102646616A (zh) 2012-08-22
JP2012170872A (ja) 2012-09-10
TW201239971A (en) 2012-10-01

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