KR20120049826A - 위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체 - Google Patents

위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체 Download PDF

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Publication number
KR20120049826A
KR20120049826A KR1020110115802A KR20110115802A KR20120049826A KR 20120049826 A KR20120049826 A KR 20120049826A KR 1020110115802 A KR1020110115802 A KR 1020110115802A KR 20110115802 A KR20110115802 A KR 20110115802A KR 20120049826 A KR20120049826 A KR 20120049826A
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KR
South Korea
Prior art keywords
image
inspection
recipe
measurement
magnification
Prior art date
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Withdrawn
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KR1020110115802A
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English (en)
Korean (ko)
Inventor
요지 가또
Original Assignee
올림푸스 가부시키가이샤
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Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Publication of KR20120049826A publication Critical patent/KR20120049826A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020110115802A 2010-11-09 2011-11-08 위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체 Withdrawn KR20120049826A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-250948 2010-11-09
JP2010250948A JP5653724B2 (ja) 2010-11-09 2010-11-09 位置合わせ装置、位置合わせ方法および位置合わせプログラム

Publications (1)

Publication Number Publication Date
KR20120049826A true KR20120049826A (ko) 2012-05-17

Family

ID=46267519

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110115802A Withdrawn KR20120049826A (ko) 2010-11-09 2011-11-08 위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체

Country Status (4)

Country Link
JP (1) JP5653724B2 (enrdf_load_stackoverflow)
KR (1) KR20120049826A (enrdf_load_stackoverflow)
CN (1) CN102565082A (enrdf_load_stackoverflow)
TW (1) TW201229500A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9852500B2 (en) * 2015-07-15 2017-12-26 GM Global Technology Operations LLC Guided inspection of an installed component using a handheld inspection device
CN110268266B (zh) * 2017-02-08 2022-11-29 富士胶片株式会社 免疫检查装置
CN113125434B (zh) * 2019-12-31 2024-11-19 深圳迈瑞生物医疗电子股份有限公司 图像分析系统和控制拍摄样本图像的方法
CN112919106A (zh) * 2021-01-29 2021-06-08 中山市美鼎机械制造有限公司 一种线路板光学智能检测设备
JP7701216B2 (ja) * 2021-08-27 2025-07-01 株式会社Ｓｃｒｅｅｎホールディングス 描画システム、描画方法およびプログラム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634233B2 (ja) * 1987-05-26 1994-05-02 株式会社安川電機 階層化構造的テンプレ−ト・マッチング方法
JP3246616B2 (ja) * 1992-10-01 2002-01-15 株式会社ニコン 位置合わせ方法
JP2001201338A (ja) * 2000-01-20 2001-07-27 Jeol Ltd 座標リンク機構
JP3993817B2 (ja) * 2002-12-11 2007-10-17 株式会社日立製作所 欠陥組成分析方法及び装置
JP4847685B2 (ja) * 2004-04-16 2011-12-28 株式会社日立ハイテクノロジーズ パターンサーチ方法
JP5059297B2 (ja) * 2005-05-09 2012-10-24 株式会社日立ハイテクノロジーズ 電子線式観察装置
JP2008152555A (ja) * 2006-12-18 2008-07-03 Olympus Corp 画像認識方法及び画像認識装置
JP2008311668A (ja) * 2008-07-07 2008-12-25 Hitachi High-Technologies Corp 基板又は半導体ウエーハに形成されたパターンの，重ね合わせ誤差検査装置及び重ね合わせ誤差検査方法
JP2010107412A (ja) * 2008-10-31 2010-05-13 Toshiba Corp 欠陥観察装置、欠陥観察方法
JP5315076B2 (ja) * 2009-02-06 2013-10-16 株式会社日立ハイテクノロジーズ 電子線の影響を考慮した半導体検査方法及び装置

Also Published As

Publication number Publication date
JP5653724B2 (ja) 2015-01-14
JP2012103072A (ja) 2012-05-31
CN102565082A (zh) 2012-07-11
TW201229500A (en) 2012-07-16

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20111108

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid