TW201229500A - Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon - Google Patents
Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon Download PDFInfo
- Publication number
- TW201229500A TW201229500A TW100138492A TW100138492A TW201229500A TW 201229500 A TW201229500 A TW 201229500A TW 100138492 A TW100138492 A TW 100138492A TW 100138492 A TW100138492 A TW 100138492A TW 201229500 A TW201229500 A TW 201229500A
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- inspection
- magnification
- field
- unit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000007689 inspection Methods 0.000 claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000005259 measurement Methods 0.000 claims abstract description 66
- 238000003384 imaging method Methods 0.000 claims description 36
- 238000004364 calculation method Methods 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 abstract description 9
- 238000009472 formulation Methods 0.000 abstract description 8
- 238000004904 shortening Methods 0.000 abstract description 3
- 230000000007 visual effect Effects 0.000 abstract 3
- 230000003287 optical effect Effects 0.000 description 27
- 238000012545 processing Methods 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
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- 238000004458 analytical method Methods 0.000 description 2
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- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
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- 241001330002 Bambuseae Species 0.000 description 1
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- 229910000831 Steel Inorganic materials 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010250948A JP5653724B2 (ja) | 2010-11-09 | 2010-11-09 | 位置合わせ装置、位置合わせ方法および位置合わせプログラム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201229500A true TW201229500A (en) | 2012-07-16 |
Family
ID=46267519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100138492A TW201229500A (en) | 2010-11-09 | 2011-10-24 | Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5653724B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20120049826A (enrdf_load_stackoverflow) |
| CN (1) | CN102565082A (enrdf_load_stackoverflow) |
| TW (1) | TW201229500A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI819658B (zh) * | 2021-08-27 | 2023-10-21 | 日商斯庫林集團股份有限公司 | 描繪系統、描繪方法以及記錄有程式的程式產品 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9852500B2 (en) * | 2015-07-15 | 2017-12-26 | GM Global Technology Operations LLC | Guided inspection of an installed component using a handheld inspection device |
| CN110268266B (zh) * | 2017-02-08 | 2022-11-29 | 富士胶片株式会社 | 免疫检查装置 |
| CN113125434B (zh) * | 2019-12-31 | 2024-11-19 | 深圳迈瑞生物医疗电子股份有限公司 | 图像分析系统和控制拍摄样本图像的方法 |
| CN112919106A (zh) * | 2021-01-29 | 2021-06-08 | 中山市美鼎机械制造有限公司 | 一种线路板光学智能检测设备 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634233B2 (ja) * | 1987-05-26 | 1994-05-02 | 株式会社安川電機 | 階層化構造的テンプレ−ト・マッチング方法 |
| JP3246616B2 (ja) * | 1992-10-01 | 2002-01-15 | 株式会社ニコン | 位置合わせ方法 |
| JP2001201338A (ja) * | 2000-01-20 | 2001-07-27 | Jeol Ltd | 座標リンク機構 |
| JP3993817B2 (ja) * | 2002-12-11 | 2007-10-17 | 株式会社日立製作所 | 欠陥組成分析方法及び装置 |
| JP4847685B2 (ja) * | 2004-04-16 | 2011-12-28 | 株式会社日立ハイテクノロジーズ | パターンサーチ方法 |
| JP5059297B2 (ja) * | 2005-05-09 | 2012-10-24 | 株式会社日立ハイテクノロジーズ | 電子線式観察装置 |
| JP2008152555A (ja) * | 2006-12-18 | 2008-07-03 | Olympus Corp | 画像認識方法及び画像認識装置 |
| JP2008311668A (ja) * | 2008-07-07 | 2008-12-25 | Hitachi High-Technologies Corp | 基板又は半導体ウエーハに形成されたパターンの，重ね合わせ誤差検査装置及び重ね合わせ誤差検査方法 |
| JP2010107412A (ja) * | 2008-10-31 | 2010-05-13 | Toshiba Corp | 欠陥観察装置、欠陥観察方法 |
| JP5315076B2 (ja) * | 2009-02-06 | 2013-10-16 | 株式会社日立ハイテクノロジーズ | 電子線の影響を考慮した半導体検査方法及び装置 |
-
2010
- 2010-11-09 JP JP2010250948A patent/JP5653724B2/ja not_active Expired - Fee Related
-
2011
- 2011-10-24 TW TW100138492A patent/TW201229500A/zh unknown
- 2011-11-08 KR KR1020110115802A patent/KR20120049826A/ko not_active Withdrawn
- 2011-11-09 CN CN2011103530218A patent/CN102565082A/zh active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI819658B (zh) * | 2021-08-27 | 2023-10-21 | 日商斯庫林集團股份有限公司 | 描繪系統、描繪方法以及記錄有程式的程式產品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5653724B2 (ja) | 2015-01-14 |
| JP2012103072A (ja) | 2012-05-31 |
| KR20120049826A (ko) | 2012-05-17 |
| CN102565082A (zh) | 2012-07-11 |
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