KR20110076879A - 열처리 프로세스 동안 반도체 웨이퍼를 지지하기 위한 웨이퍼 홀더 - Google Patents

열처리 프로세스 동안 반도체 웨이퍼를 지지하기 위한 웨이퍼 홀더 Download PDF

Info

Publication number
KR20110076879A
KR20110076879A KR1020117006017A KR20117006017A KR20110076879A KR 20110076879 A KR20110076879 A KR 20110076879A KR 1020117006017 A KR1020117006017 A KR 1020117006017A KR 20117006017 A KR20117006017 A KR 20117006017A KR 20110076879 A KR20110076879 A KR 20110076879A
Authority
KR
South Korea
Prior art keywords
wafer
fibers
shaft
holder
semiconductor
Prior art date
Application number
KR1020117006017A
Other languages
English (en)
Korean (ko)
Inventor
존 에이. 피트니
토마스 에이. 토랙
Original Assignee
엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠이엠씨 일렉트로닉 머티리얼즈, 인크. filed Critical 엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Publication of KR20110076879A publication Critical patent/KR20110076879A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/90—Supporting structure having work holder receiving apertures or projections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020117006017A 2008-09-16 2009-09-14 열처리 프로세스 동안 반도체 웨이퍼를 지지하기 위한 웨이퍼 홀더 KR20110076879A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/211,516 US8186661B2 (en) 2008-09-16 2008-09-16 Wafer holder for supporting a semiconductor wafer during a thermal treatment process
US12/211,516 2008-09-16

Publications (1)

Publication Number Publication Date
KR20110076879A true KR20110076879A (ko) 2011-07-06

Family

ID=41225991

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117006017A KR20110076879A (ko) 2008-09-16 2009-09-14 열처리 프로세스 동안 반도체 웨이퍼를 지지하기 위한 웨이퍼 홀더

Country Status (6)

Country Link
US (1) US8186661B2 (fr)
EP (1) EP2327091A1 (fr)
JP (1) JP2012503312A (fr)
KR (1) KR20110076879A (fr)
TW (1) TW201025492A (fr)
WO (1) WO2010033454A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8186661B2 (en) * 2008-09-16 2012-05-29 Memc Electronic Materials, Inc. Wafer holder for supporting a semiconductor wafer during a thermal treatment process
US8758553B2 (en) 2010-10-05 2014-06-24 Skyworks Solutions, Inc. Fixtures and methods for unbonding wafers by shear force
US8888085B2 (en) 2010-10-05 2014-11-18 Skyworks Solutions, Inc. Devices and methodologies for handling wafers
US8758552B2 (en) 2010-06-07 2014-06-24 Skyworks Solutions, Inc. Debonders and related devices and methods for semiconductor fabrication
JP5545090B2 (ja) * 2010-07-13 2014-07-09 株式会社Ｓｕｍｃｏ ウェーハ支持治具及び軸状部材並びにシリコンウェーハの熱処理方法
US20120080832A1 (en) 2010-10-05 2012-04-05 Skyworks Solutions, Inc. Devices for methodologies related to wafer carriers
CA2862436A1 (fr) * 2011-12-30 2013-07-04 3M Innovative Properties Company Actionneur de vide et son procede d'utilisation
DE102012100927A1 (de) * 2012-02-06 2013-08-08 Roth & Rau Ag Prozessmodul
US20160131194A1 (en) * 2014-11-07 2016-05-12 Forum Us, Inc. Swivel joint disassembly tool and method for same
JP6369297B2 (ja) * 2014-11-12 2018-08-08 株式会社Sumco 半導体ウェーハの支持方法及びその支持装置
KR102365819B1 (ko) 2015-07-17 2022-02-21 삼성전자주식회사 웨이퍼 클램핑 장치
US10755955B2 (en) * 2018-02-12 2020-08-25 Applied Materials, Inc. Substrate transfer mechanism to reduce back-side substrate contact
CN108396300B (zh) * 2018-03-02 2021-01-22 京东方科技集团股份有限公司 一种蒸镀基板分离装置及蒸镀装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1852189A (en) * 1930-10-13 1932-04-05 Powell Edward Brush
US4007509A (en) * 1975-03-03 1977-02-15 Odhner Oliver R Blackboard eraser
DE3410130C1 (de) * 1984-03-20 1985-10-10 Philips Patentverwaltung Gmbh, 2000 Hamburg Werkstuecktraeger fuer Leiterplatten
JPS6159851A (ja) * 1984-08-31 1986-03-27 Nippon Telegr & Teleph Corp <Ntt> 半導体ウエハ保持装置
JPS6191936A (ja) * 1984-10-12 1986-05-10 Toshiba Ceramics Co Ltd バツクサイドダメ−ジ加工治具
US4799659A (en) * 1987-07-22 1989-01-24 Northern Telecom Limited Pin insertion support member for circuit boards
JP2651617B2 (ja) 1989-02-10 1997-09-10 東京エレクトロン株式会社 板状物の載置装置
US5067695A (en) * 1989-05-08 1991-11-26 Micron Technology, Inc. Circuit board support apparatus for use with circuit board lead trimmer
JP3155147B2 (ja) 1994-04-26 2001-04-09 大日本スクリーン製造株式会社 基板処理装置
US5605574A (en) * 1995-09-20 1997-02-25 Kabushiki Kaisha Toshiba Semiconductor wafer support apparatus and method
US6214122B1 (en) * 1997-03-17 2001-04-10 Motorola, Inc. Rapid thermal processing susceptor
JPH11106293A (ja) * 1997-10-03 1999-04-20 Super Silicon Kenkyusho:Kk エピタキシャルウエハ製造方法及び装置
JP2000012655A (ja) * 1998-06-17 2000-01-14 Tokyo Electron Ltd 基板の保持装置
US6497403B2 (en) * 2000-12-28 2002-12-24 Memc Electronic Materials, Inc. Semiconductor wafer holder
JP2003257881A (ja) * 2002-03-07 2003-09-12 Shin Etsu Handotai Co Ltd 熱処理用ボート及びウエーハの熱処理方法
US9627244B2 (en) * 2002-12-20 2017-04-18 Mattson Technology, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece
JP2004259792A (ja) 2003-02-25 2004-09-16 Nikon Corp 吸着装置、吸着装置用シート、研磨装置、半導体デバイス及び半導体デバイス製造方法
JP4363401B2 (ja) * 2003-03-26 2009-11-11 信越半導体株式会社 熱処理用ウェーハ支持具及び熱処理装置
JP4646502B2 (ja) * 2003-07-28 2011-03-09 京セラ株式会社 ウェハ支持部材
JP2008117892A (ja) * 2006-11-02 2008-05-22 Toshiba Corp 半導体製造装置および半導体装置の製造方法
JP2008273687A (ja) * 2007-04-27 2008-11-13 Dainippon Printing Co Ltd 平板状基材の搬送装置
AT506430A1 (de) * 2008-01-23 2009-09-15 3S Swiss Solar Systems Ag Distanzelement für plattenfírmige elemente
US8186661B2 (en) * 2008-09-16 2012-05-29 Memc Electronic Materials, Inc. Wafer holder for supporting a semiconductor wafer during a thermal treatment process

Also Published As

Publication number Publication date
TW201025492A (en) 2010-07-01
US20100065696A1 (en) 2010-03-18
WO2010033454A1 (fr) 2010-03-25
US8186661B2 (en) 2012-05-29
EP2327091A1 (fr) 2011-06-01
JP2012503312A (ja) 2012-02-02

Similar Documents

Publication Publication Date Title
KR20110076879A (ko) 열처리 프로세스 동안 반도체 웨이퍼를 지지하기 위한 웨이퍼 홀더
JP4786177B2 (ja) サセプタを含む処理チャンバ内で半導体基板を加熱するプロセスおよびシステム
TWI352400B (en) Susceptor for improving throughput and reducing wa
US8476560B2 (en) Thermal processing furnace
KR20010099630A (ko) 반도체 기판의 열처리 방법 및 장치
US4966549A (en) Wafer hanger useful for thermally treating semiconductor wafers
US11830724B2 (en) Apparatus and method for manufacturing a wafer
TW518636B (en) Wafer support of semiconductor manufacturing system
KR101273843B1 (ko) 히터 지지 장치
TWI446969B (zh) A silicon resin supporting device and a silicon resin heating and quench unit using the supporting device
JP6952633B2 (ja) 基板加熱装置及びこれを用いた基板処理装置
KR20100105892A (ko) 세라믹 패들
US8878107B2 (en) Multi-level and vertical assembling type PTFE heater and methods of manufacture thereof
JPH04304652A (ja) 熱処理装置用ボート
JP6014237B1 (ja) サファイア単結晶部材製造装置
KR100645929B1 (ko) 열처리 장치의 히터 어셈블리
JP2010123637A (ja) ウェーハ熱処理装置
JP2504550Y2 (ja) 単結晶引上げ装置
JPH08107079A (ja) 縦型ウェ−ハボ−ト及び縦型熱処理炉
KR200382567Y1 (ko) 열처리 장치의 히터 어셈블리
JP3777964B2 (ja) 熱処理用基板支持具
KR200325997Y1 (ko) Ｒｔｐ장비의 웨이퍼트레이
JP3370416B2 (ja) 温度計
JP4497785B2 (ja) 拡散炉用熱電対
JP2010087152A (ja) ウエハボート

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid