KR20110027727A - 금속 층에 도포하기 위한 분산액 - Google Patents
금속 층에 도포하기 위한 분산액 Download PDFInfo
- Publication number
- KR20110027727A KR20110027727A KR1020107029887A KR20107029887A KR20110027727A KR 20110027727 A KR20110027727 A KR 20110027727A KR 1020107029887 A KR1020107029887 A KR 1020107029887A KR 20107029887 A KR20107029887 A KR 20107029887A KR 20110027727 A KR20110027727 A KR 20110027727A
- Authority
- KR
- South Korea
- Prior art keywords
- component
- dispersion
- metal
- weight
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 122
- 239000002184 metal Substances 0.000 title claims abstract description 122
- 239000006185 dispersion Substances 0.000 title claims abstract description 83
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- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000011230 binding agent Substances 0.000 claims abstract description 26
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- 239000002904 solvent Substances 0.000 claims abstract description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 150000002739 metals Chemical class 0.000 claims description 22
- -1 allyl ester Chemical class 0.000 claims description 21
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- 239000011888 foil Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 17
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- 238000009713 electroplating Methods 0.000 claims description 9
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
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- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000011133 lead Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
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- 230000005415 magnetization Effects 0.000 claims 1
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- 239000011248 coating agent Substances 0.000 description 8
- 229910000365 copper sulfate Inorganic materials 0.000 description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 8
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Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/04—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C09D127/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
Landscapes
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- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Wood Science & Technology (AREA)
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- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
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| EP08157846.0 | 2008-06-09 | ||
| EP08157846 | 2008-06-09 |
Publications (1)
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| KR20110027727A true KR20110027727A (ko) | 2011-03-16 |
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| CN (1) | CN102089371B (enExample) |
| BR (1) | BRPI0914908A2 (enExample) |
| CA (1) | CA2727215A1 (enExample) |
| TW (1) | TWI470041B (enExample) |
| WO (1) | WO2009150116A1 (enExample) |
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| US9080259B2 (en) | 2009-06-30 | 2015-07-14 | Basf Se | Polyamide fibers with dyeable particles and production thereof |
| CN102576575B (zh) | 2009-09-04 | 2015-11-25 | 巴斯夫欧洲公司 | 用于印刷电极的组合物 |
| SG183160A1 (en) | 2010-02-17 | 2012-09-27 | Basf Se | Process for producing electrically conductive bonds between solar cells |
| JP2012209148A (ja) * | 2011-03-30 | 2012-10-25 | Sony Corp | 導電性粒子、導電性ペースト、及び、回路基板 |
| DE102011016335B4 (de) * | 2011-04-07 | 2013-10-02 | Universität Konstanz | Nickelhaltige und ätzende druckbare Paste sowie Verfahren zur Bildung von elektrischen Kontakten beim Herstellen einer Solarzelle |
| US8720776B2 (en) * | 2011-11-10 | 2014-05-13 | Paul Llewellyn Greene | X-ray security system |
| US10072177B2 (en) | 2014-11-06 | 2018-09-11 | E I Du Pont De Nemours And Company | Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics |
| CN104449230A (zh) * | 2014-12-09 | 2015-03-25 | 泰兴市和庆机械配件厂 | 一种笔记本外壳涂料、制备方法及其应用 |
| WO2017102574A1 (en) * | 2015-12-18 | 2017-06-22 | Agfa-Gevaert | A metallic nanoparticle dispersion |
| JP6706505B2 (ja) * | 2016-02-09 | 2020-06-10 | 積水フーラー株式会社 | プライマー組成物 |
| JP6333305B2 (ja) | 2016-04-28 | 2018-05-30 | 大同メタル工業株式会社 | 摺動部材 |
| WO2017219344A1 (en) * | 2016-06-24 | 2017-12-28 | Dow Global Technologies Llc | Metalized polyurethane composite and process of preparing the same |
| CN106604623B (zh) * | 2016-12-13 | 2021-01-26 | 苏州城邦达力材料科技有限公司 | 一种电磁屏蔽膜及其制备方法 |
| EP3666809B1 (en) * | 2018-12-10 | 2024-02-07 | Henkel AG & Co. KGaA | Polyurethane adhesive with semi-crystalline and highly crystalline polyesters |
| TWI694121B (zh) * | 2019-02-12 | 2020-05-21 | 台灣中油股份有限公司 | 石墨烯-奈米銀粒子-高分子溶液、其製備方法及其用途 |
| US11319613B2 (en) | 2020-08-18 | 2022-05-03 | Enviro Metals, LLC | Metal refinement |
| JP7536299B2 (ja) * | 2021-02-03 | 2024-08-20 | プラスコート株式会社 | 導電性ペーストおよび導電膜 |
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| US2686172A (en) * | 1951-05-22 | 1954-08-10 | Goodrich Co B F | Tough, strong, and easily processed vinyl chloride interpolymers containing free side-chain hydroxyl groups |
| US3036029A (en) * | 1958-12-12 | 1962-05-22 | Monsanto Chemicals | Interpolymers of allyl alcohol, vinyl chloride and dialkyl esters of alpha, beta-ethylenically unsaturated dicarboxylic acids, process for preparing same, and blends with formaldehyde condensation resin |
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-
2009
- 2009-05-25 TW TW98117319A patent/TWI470041B/zh not_active IP Right Cessation
- 2009-06-08 KR KR1020107029887A patent/KR20110027727A/ko not_active Abandoned
- 2009-06-08 BR BRPI0914908A patent/BRPI0914908A2/pt not_active IP Right Cessation
- 2009-06-08 CA CA 2727215 patent/CA2727215A1/en not_active Abandoned
- 2009-06-08 CN CN2009801265083A patent/CN102089371B/zh not_active Expired - Fee Related
- 2009-06-08 JP JP2011512947A patent/JP5456028B2/ja not_active Expired - Fee Related
- 2009-06-08 US US12/996,940 patent/US8633270B2/en not_active Expired - Fee Related
- 2009-06-08 EP EP09761679A patent/EP2288649A1/de not_active Withdrawn
- 2009-06-08 WO PCT/EP2009/057004 patent/WO2009150116A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20110086231A1 (en) | 2011-04-14 |
| TWI470041B (zh) | 2015-01-21 |
| WO2009150116A1 (de) | 2009-12-17 |
| CN102089371B (zh) | 2013-08-28 |
| TW201005049A (en) | 2010-02-01 |
| JP5456028B2 (ja) | 2014-03-26 |
| BRPI0914908A2 (pt) | 2015-10-20 |
| CN102089371A (zh) | 2011-06-08 |
| JP2011525034A (ja) | 2011-09-08 |
| EP2288649A1 (de) | 2011-03-02 |
| CA2727215A1 (en) | 2009-12-17 |
| US8633270B2 (en) | 2014-01-21 |
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