CN102089371B - 用于施加金属层的分散体 - Google Patents

用于施加金属层的分散体 Download PDF

Info

Publication number
CN102089371B
CN102089371B CN2009801265083A CN200980126508A CN102089371B CN 102089371 B CN102089371 B CN 102089371B CN 2009801265083 A CN2009801265083 A CN 2009801265083A CN 200980126508 A CN200980126508 A CN 200980126508A CN 102089371 B CN102089371 B CN 102089371B
Authority
CN
China
Prior art keywords
dispersion
component
metal
weight
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009801265083A
Other languages
English (en)
Chinese (zh)
Other versions
CN102089371A (zh
Inventor
R·洛赫特曼
N·瓦格纳
J·卡祖恩
J·普菲斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of CN102089371A publication Critical patent/CN102089371A/zh
Application granted granted Critical
Publication of CN102089371B publication Critical patent/CN102089371B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/04Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C09D127/06Homopolymers or copolymers of vinyl chloride
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN2009801265083A 2008-06-09 2009-06-08 用于施加金属层的分散体 Expired - Fee Related CN102089371B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08157846.0 2008-06-09
EP08157846 2008-06-09
PCT/EP2009/057004 WO2009150116A1 (de) 2008-06-09 2009-06-08 Dispersion zum aufbringen einer metallschicht

Publications (2)

Publication Number Publication Date
CN102089371A CN102089371A (zh) 2011-06-08
CN102089371B true CN102089371B (zh) 2013-08-28

Family

ID=40978472

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801265083A Expired - Fee Related CN102089371B (zh) 2008-06-09 2009-06-08 用于施加金属层的分散体

Country Status (9)

Country Link
US (1) US8633270B2 (enExample)
EP (1) EP2288649A1 (enExample)
JP (1) JP5456028B2 (enExample)
KR (1) KR20110027727A (enExample)
CN (1) CN102089371B (enExample)
BR (1) BRPI0914908A2 (enExample)
CA (1) CA2727215A1 (enExample)
TW (1) TWI470041B (enExample)
WO (1) WO2009150116A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9080259B2 (en) 2009-06-30 2015-07-14 Basf Se Polyamide fibers with dyeable particles and production thereof
CN102576575B (zh) 2009-09-04 2015-11-25 巴斯夫欧洲公司 用于印刷电极的组合物
SG183160A1 (en) 2010-02-17 2012-09-27 Basf Se Process for producing electrically conductive bonds between solar cells
JP2012209148A (ja) * 2011-03-30 2012-10-25 Sony Corp 導電性粒子、導電性ペースト、及び、回路基板
DE102011016335B4 (de) * 2011-04-07 2013-10-02 Universität Konstanz Nickelhaltige und ätzende druckbare Paste sowie Verfahren zur Bildung von elektrischen Kontakten beim Herstellen einer Solarzelle
US8720776B2 (en) * 2011-11-10 2014-05-13 Paul Llewellyn Greene X-ray security system
US10072177B2 (en) 2014-11-06 2018-09-11 E I Du Pont De Nemours And Company Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics
CN104449230A (zh) * 2014-12-09 2015-03-25 泰兴市和庆机械配件厂 一种笔记本外壳涂料、制备方法及其应用
WO2017102574A1 (en) * 2015-12-18 2017-06-22 Agfa-Gevaert A metallic nanoparticle dispersion
JP6706505B2 (ja) * 2016-02-09 2020-06-10 積水フーラー株式会社 プライマー組成物
JP6333305B2 (ja) 2016-04-28 2018-05-30 大同メタル工業株式会社 摺動部材
WO2017219344A1 (en) * 2016-06-24 2017-12-28 Dow Global Technologies Llc Metalized polyurethane composite and process of preparing the same
CN106604623B (zh) * 2016-12-13 2021-01-26 苏州城邦达力材料科技有限公司 一种电磁屏蔽膜及其制备方法
EP3666809B1 (en) * 2018-12-10 2024-02-07 Henkel AG & Co. KGaA Polyurethane adhesive with semi-crystalline and highly crystalline polyesters
TWI694121B (zh) * 2019-02-12 2020-05-21 台灣中油股份有限公司 石墨烯-奈米銀粒子-高分子溶液、其製備方法及其用途
US11319613B2 (en) 2020-08-18 2022-05-03 Enviro Metals, LLC Metal refinement
JP7536299B2 (ja) * 2021-02-03 2024-08-20 プラスコート株式会社 導電性ペーストおよび導電膜

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983911A (en) * 1990-02-15 1991-01-08 Photon Dynamics, Inc. Voltage imaging system using electro-optics

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2686172A (en) * 1951-05-22 1954-08-10 Goodrich Co B F Tough, strong, and easily processed vinyl chloride interpolymers containing free side-chain hydroxyl groups
US3036029A (en) * 1958-12-12 1962-05-22 Monsanto Chemicals Interpolymers of allyl alcohol, vinyl chloride and dialkyl esters of alpha, beta-ethylenically unsaturated dicarboxylic acids, process for preparing same, and blends with formaldehyde condensation resin
DE1521152A1 (de) 1965-07-16 1969-04-24 Basf Ag Metallisierung von Kunststoffoberflaechen
DE1615786A1 (de) 1967-08-18 1970-05-27 Basf Ag Verfahren zur Herstellung von elektrisch leitenden Schichten auf elektrisch nicht leitenden Oberflaechen
DD135620A1 (de) 1978-03-30 1979-05-16 Frank Zachaeus Verfahren zur herstellung von vinylmischpolymeren
US4663240A (en) 1984-11-06 1987-05-05 Enthone, Incorporated RFI shielded plastic articles and process for making same
JPS6241274A (ja) * 1985-08-16 1987-02-23 Konishiroku Photo Ind Co Ltd 磁性塗料の製造方法
US4983311A (en) * 1988-10-26 1991-01-08 Nippon Zeon Co., Ltd. Magnetic coating and magnetic recording medium
JPH0681812B2 (ja) * 1988-10-26 1994-10-19 日本ゼオン株式会社 磁性塗料及び磁気記録媒体
JP2821754B2 (ja) 1989-02-16 1998-11-05 日本ゼオン株式会社 磁気記録媒体
JPH04318325A (ja) * 1991-04-18 1992-11-09 Fuji Photo Film Co Ltd 磁気記録媒体の製造方法
JPH06329732A (ja) * 1993-04-27 1994-11-29 Minnesota Mining & Mfg Co <3M> 磁性層が非ハロゲン化ビニルコポリマーを混入した磁気記録媒体
AU3131595A (en) 1994-07-29 1996-03-04 Libbey-Owens-Ford Co. Vinyl chloride copolymers and method of producing the same
US5854175A (en) * 1997-04-09 1998-12-29 Eastman Kodak Company Embossed compact disc surfaces for laser thermal labeling
US6139982A (en) * 1998-11-06 2000-10-31 Imation Corp. Magnetic recording medium having a binder system including a polyurethane polymer having both phosphonate and quaternary ammonium pendant groups
JP3241348B2 (ja) * 1999-01-28 2001-12-25 住友ゴム工業株式会社 透光性電磁波シールド部材の製造方法
DE19945400A1 (de) 1999-09-22 2001-04-05 Emtec Magnetics Gmbh Blockcopolymeres Polyurethan, Verfahren zu dessen Herstellung sowie daraus hergestellte Bindemittel und Formkörper
EP1268211B1 (de) 2000-03-30 2007-01-03 Aurentum Innovationstechnologien GmbH Druckverfahren und druckmaschine hierfür
DE10051850A1 (de) 2000-03-30 2001-10-11 Aurentum Innovationstechnologi Druckverfahren und Druckmaschine hierfür
DE10210146A1 (de) * 2002-03-07 2003-09-25 Aurentum Innovationstechnologi Qualitätsdruckverfahren und Druckmaschine sowie Drucksbustanz hierfür
US20040266537A1 (en) 2003-06-27 2004-12-30 Morris Richard D. Decorations and methods for decorating cables
JP4595353B2 (ja) * 2004-03-05 2010-12-08 東洋インキ製造株式会社 導電性インキ、及びそれを用いた非接触型メディア
WO2006095611A1 (ja) 2005-03-11 2006-09-14 Toyo Ink Mfg. Co., Ltd. 導電性インキ、導電回路、及び非接触型メディア
JP2006260818A (ja) * 2005-03-15 2006-09-28 Toyobo Co Ltd 導電性ペースト及びこれを用いた印刷回路
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
PL2191482T3 (pl) 2007-09-13 2017-08-31 Henkel Ag & Co. Kgaa Kompozycja przewodząca prąd elektryczny

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983911A (en) * 1990-02-15 1991-01-08 Photon Dynamics, Inc. Voltage imaging system using electro-optics

Also Published As

Publication number Publication date
US20110086231A1 (en) 2011-04-14
TWI470041B (zh) 2015-01-21
WO2009150116A1 (de) 2009-12-17
KR20110027727A (ko) 2011-03-16
TW201005049A (en) 2010-02-01
JP5456028B2 (ja) 2014-03-26
BRPI0914908A2 (pt) 2015-10-20
CN102089371A (zh) 2011-06-08
JP2011525034A (ja) 2011-09-08
EP2288649A1 (de) 2011-03-02
CA2727215A1 (en) 2009-12-17
US8633270B2 (en) 2014-01-21

Similar Documents

Publication Publication Date Title
CN102089371B (zh) 用于施加金属层的分散体
CN101283414B (zh) 施加金属层用的含有两种不同金属的分散体
CN101728003B (zh) 导电糊、电气布线、装置和电气布线的制造方法
US3576662A (en) Metallizing plastics surfaces
CN1946880B (zh) 非导电性基板的选择性催化活化
US8895651B2 (en) Composition for printing a seed layer and process for producing conductor tracks
KR20010041581A (ko) 전도성 잉크 또는 페인트
CN102771198B (zh) 用于印刷种层的组合物以及制备导线的方法
KR20200015695A (ko) 적층체, 그것을 사용한 프린트 배선판, 플렉서블 프린트 배선판 및 성형품
JP6579293B2 (ja) 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
JP4158080B2 (ja) 導電性ペースト
JP2017208540A (ja) めっき転写フィルム
JPH01159905A (ja) 導電性ペースト
WO2019013179A1 (ja) 無電解めっき下地膜形成用組成物
KR101419968B1 (ko) 도금물 및 이의 제조방법
JP2019014188A (ja) 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
US9650522B2 (en) Absorbing-layer-forming composition and absorbing substrate, printed item, conductive pattern, and electric circuit produced using the same
TW201909709A (zh) 積層體、使用其之印刷配線板、可撓性印刷配線板及成形品

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130828

Termination date: 20170608