BRPI0914908A2 - dispersão para a aplicação de uma camada metálica sobre um substrato não eletricamente condutivo, processos para a produção de uma dispersão, e de uma camada metálica, substrato revestido com uma superfície, e, uso de uma superfície de substrato. - Google Patents

dispersão para a aplicação de uma camada metálica sobre um substrato não eletricamente condutivo, processos para a produção de uma dispersão, e de uma camada metálica, substrato revestido com uma superfície, e, uso de uma superfície de substrato.

Info

Publication number
BRPI0914908A2
BRPI0914908A2 BRPI0914908A BRPI0914908A BRPI0914908A2 BR PI0914908 A2 BRPI0914908 A2 BR PI0914908A2 BR PI0914908 A BRPI0914908 A BR PI0914908A BR PI0914908 A BRPI0914908 A BR PI0914908A BR PI0914908 A2 BRPI0914908 A2 BR PI0914908A2
Authority
BR
Brazil
Prior art keywords
dispersion
substrate
metal layer
processes
applying
Prior art date
Application number
BRPI0914908A
Other languages
English (en)
Portuguese (pt)
Inventor
Jürgen Kaczun
Jürgen Pfister
Norbert Wagner
Rene Lochtman
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of BRPI0914908A2 publication Critical patent/BRPI0914908A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/04—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C09D127/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
BRPI0914908A 2008-06-09 2009-06-08 dispersão para a aplicação de uma camada metálica sobre um substrato não eletricamente condutivo, processos para a produção de uma dispersão, e de uma camada metálica, substrato revestido com uma superfície, e, uso de uma superfície de substrato. BRPI0914908A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08157846 2008-06-09
PCT/EP2009/057004 WO2009150116A1 (de) 2008-06-09 2009-06-08 Dispersion zum aufbringen einer metallschicht

Publications (1)

Publication Number Publication Date
BRPI0914908A2 true BRPI0914908A2 (pt) 2015-10-20

Family

ID=40978472

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0914908A BRPI0914908A2 (pt) 2008-06-09 2009-06-08 dispersão para a aplicação de uma camada metálica sobre um substrato não eletricamente condutivo, processos para a produção de uma dispersão, e de uma camada metálica, substrato revestido com uma superfície, e, uso de uma superfície de substrato.

Country Status (9)

Country Link
US (1) US8633270B2 (enExample)
EP (1) EP2288649A1 (enExample)
JP (1) JP5456028B2 (enExample)
KR (1) KR20110027727A (enExample)
CN (1) CN102089371B (enExample)
BR (1) BRPI0914908A2 (enExample)
CA (1) CA2727215A1 (enExample)
TW (1) TWI470041B (enExample)
WO (1) WO2009150116A1 (enExample)

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JP5800807B2 (ja) 2009-06-30 2015-10-28 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 着色可能な粒子を有するポリアミド繊維及びその製法
JP5984671B2 (ja) 2009-09-04 2016-09-06 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 電極を印刷するための組成物
CN102770971B (zh) 2010-02-17 2016-03-30 巴斯夫欧洲公司 在太阳能电池之间形成导电粘接的方法
JP2012209148A (ja) * 2011-03-30 2012-10-25 Sony Corp 導電性粒子、導電性ペースト、及び、回路基板
DE102011016335B4 (de) * 2011-04-07 2013-10-02 Universität Konstanz Nickelhaltige und ätzende druckbare Paste sowie Verfahren zur Bildung von elektrischen Kontakten beim Herstellen einer Solarzelle
US8720776B2 (en) * 2011-11-10 2014-05-13 Paul Llewellyn Greene X-ray security system
US10072177B2 (en) 2014-11-06 2018-09-11 E I Du Pont De Nemours And Company Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics
CN104449230A (zh) * 2014-12-09 2015-03-25 泰兴市和庆机械配件厂 一种笔记本外壳涂料、制备方法及其应用
JP6703110B2 (ja) * 2015-12-18 2020-06-03 アグフア−ゲヴエルト 金属ナノ粒子分散系
JP6706505B2 (ja) * 2016-02-09 2020-06-10 積水フーラー株式会社 プライマー組成物
JP6333305B2 (ja) 2016-04-28 2018-05-30 大同メタル工業株式会社 摺動部材
WO2017219344A1 (en) * 2016-06-24 2017-12-28 Dow Global Technologies Llc Metalized polyurethane composite and process of preparing the same
CN106604623B (zh) * 2016-12-13 2021-01-26 苏州城邦达力材料科技有限公司 一种电磁屏蔽膜及其制备方法
EP3666809B1 (en) * 2018-12-10 2024-02-07 Henkel AG & Co. KGaA Polyurethane adhesive with semi-crystalline and highly crystalline polyesters
TWI694121B (zh) * 2019-02-12 2020-05-21 台灣中油股份有限公司 石墨烯-奈米銀粒子-高分子溶液、其製備方法及其用途
EP4200452A4 (en) 2020-08-18 2024-10-09 Enviro Metals, LLC METAL REFINING
JP7536299B2 (ja) * 2021-02-03 2024-08-20 プラスコート株式会社 導電性ペーストおよび導電膜

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Also Published As

Publication number Publication date
US20110086231A1 (en) 2011-04-14
US8633270B2 (en) 2014-01-21
EP2288649A1 (de) 2011-03-02
TWI470041B (zh) 2015-01-21
CA2727215A1 (en) 2009-12-17
JP5456028B2 (ja) 2014-03-26
KR20110027727A (ko) 2011-03-16
JP2011525034A (ja) 2011-09-08
WO2009150116A1 (de) 2009-12-17
TW201005049A (en) 2010-02-01
CN102089371A (zh) 2011-06-08
CN102089371B (zh) 2013-08-28

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]