KR20110019376A - 처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법 - Google Patents

처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법 Download PDF

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Publication number
KR20110019376A
KR20110019376A KR1020107028548A KR20107028548A KR20110019376A KR 20110019376 A KR20110019376 A KR 20110019376A KR 1020107028548 A KR1020107028548 A KR 1020107028548A KR 20107028548 A KR20107028548 A KR 20107028548A KR 20110019376 A KR20110019376 A KR 20110019376A
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KR
South Korea
Prior art keywords
gas species
mfc
overshoot
flow rate
gas
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Ceased
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KR1020107028548A
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English (en)
Korean (ko)
Inventor
군수 윤
이크발 에이 샤리프
커트 조겐센
로버트 카라탄
Original Assignee
램 리써치 코포레이션
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Publication of KR20110019376A publication Critical patent/KR20110019376A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Accessories For Mixers (AREA)
KR1020107028548A 2008-06-20 2009-06-12 처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법 Ceased KR20110019376A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US7453908P 2008-06-20 2008-06-20
US61/074,539 2008-06-20
US12/477,196 2009-06-03
US12/477,196 US8340827B2 (en) 2008-06-20 2009-06-03 Methods for controlling time scale of gas delivery into a processing chamber

Publications (1)

Publication Number Publication Date
KR20110019376A true KR20110019376A (ko) 2011-02-25

Family

ID=41432039

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107028548A Ceased KR20110019376A (ko) 2008-06-20 2009-06-12 처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법

Country Status (6)

Country Link
US (1) US8340827B2 (enExample)
JP (1) JP2011524948A (enExample)
KR (1) KR20110019376A (enExample)
CN (1) CN102067280B (enExample)
TW (1) TWI477938B (enExample)
WO (1) WO2009155221A2 (enExample)

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US8770215B1 (en) * 2011-07-20 2014-07-08 Daniel T. Mudd Low flow injector to deliver a low flow of gas to a remote location
US9958302B2 (en) 2011-08-20 2018-05-01 Reno Technologies, Inc. Flow control system, method, and apparatus
US9690301B2 (en) 2012-09-10 2017-06-27 Reno Technologies, Inc. Pressure based mass flow controller
US9188989B1 (en) 2011-08-20 2015-11-17 Daniel T. Mudd Flow node to deliver process gas using a remote pressure measurement device
DE102013109210A1 (de) * 2013-08-20 2015-02-26 Aixtron Se Evakuierbare Kammer, insbesondere mit einem Spülgas spülbare Beladeschleuse
US9580360B2 (en) 2014-04-07 2017-02-28 Lam Research Corporation Monolithic ceramic component of gas delivery system and method of making and use thereof
TWI693638B (zh) 2014-04-07 2020-05-11 美商蘭姆研究公司 獨立於配置的氣體輸送系統
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
US9879795B2 (en) 2016-01-15 2018-01-30 Lam Research Corporation Additively manufactured gas distribution manifold
US10453721B2 (en) * 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
US10679880B2 (en) 2016-09-27 2020-06-09 Ichor Systems, Inc. Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same
US10838437B2 (en) 2018-02-22 2020-11-17 Ichor Systems, Inc. Apparatus for splitting flow of process gas and method of operating same
US11144075B2 (en) 2016-06-30 2021-10-12 Ichor Systems, Inc. Flow control system, method, and apparatus
US10303189B2 (en) 2016-06-30 2019-05-28 Reno Technologies, Inc. Flow control system, method, and apparatus
JP6762218B2 (ja) * 2016-12-13 2020-09-30 株式会社堀場エステック 流量算出システム及び流量算出方法
US10663337B2 (en) 2016-12-30 2020-05-26 Ichor Systems, Inc. Apparatus for controlling flow and method of calibrating same
US10866135B2 (en) * 2018-03-26 2020-12-15 Applied Materials, Inc. Methods, systems, and apparatus for mass flow verification based on rate of pressure decay
US10760944B2 (en) * 2018-08-07 2020-09-01 Lam Research Corporation Hybrid flow metrology for improved chamber matching
US11841715B2 (en) 2020-10-22 2023-12-12 Applied Materials, Inc. Piezo position control flow ratio control
JP7583186B2 (ja) 2021-03-03 2024-11-13 アイコール・システムズ・インク マニホールドアセンブリを備える流体流れ制御システム

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US6193811B1 (en) * 1999-03-03 2001-02-27 Applied Materials, Inc. Method for improved chamber bake-out and cool-down
KR100427563B1 (ko) * 1999-04-16 2004-04-27 가부시키가이샤 후지킨 병렬분류형 유체공급장치와, 이것에 사용하는 유체가변형압력식 유량제어방법 및 유체가변형 압력식 유량제어장치
US6363958B1 (en) * 1999-05-10 2002-04-02 Parker-Hannifin Corporation Flow control of process gas in semiconductor manufacturing
US6632322B1 (en) * 2000-06-30 2003-10-14 Lam Research Corporation Switched uniformity control
US7354555B2 (en) * 2002-05-08 2008-04-08 Taiwan Semiconductor Manufacturing Co., Ltd. Gas flow control system with interlock
EP1753494B1 (en) * 2004-04-23 2017-08-23 Stephan Dr. Böhm Apparatus for changing the concentration of a target gas at the blood compartment of a patient's lung during artificial ventilation
US7216019B2 (en) * 2004-07-08 2007-05-08 Celerity, Inc. Method and system for a mass flow controller with reduced pressure sensitivity
US7412986B2 (en) * 2004-07-09 2008-08-19 Celerity, Inc. Method and system for flow measurement and validation of a mass flow controller
US20080200002A1 (en) * 2004-10-19 2008-08-21 Tokyo Electron Limited Plasma Sputtering Film Deposition Method and Equipment
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US20080153311A1 (en) * 2006-06-28 2008-06-26 Deenesh Padhi Method for depositing an amorphous carbon film with improved density and step coverage
JP5028193B2 (ja) * 2007-09-05 2012-09-19 株式会社日立ハイテクノロジーズ 半導体製造装置における被処理体の搬送方法
US20090084987A1 (en) * 2007-09-28 2009-04-02 Varian Semiconductor Equipment Associates, Inc. Charge neutralization in a plasma processing apparatus

Also Published As

Publication number Publication date
JP2011524948A (ja) 2011-09-08
US8340827B2 (en) 2012-12-25
TW201017357A (en) 2010-05-01
TWI477938B (zh) 2015-03-21
WO2009155221A2 (en) 2009-12-23
US20090319071A1 (en) 2009-12-24
CN102067280A (zh) 2011-05-18
CN102067280B (zh) 2013-04-03
WO2009155221A3 (en) 2010-03-25

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