JP2011524948A - 処理チャンバ内へのガス供給のタイムスケールを制御するための方法 - Google Patents

処理チャンバ内へのガス供給のタイムスケールを制御するための方法 Download PDF

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Publication number
JP2011524948A
JP2011524948A JP2011514723A JP2011514723A JP2011524948A JP 2011524948 A JP2011524948 A JP 2011524948A JP 2011514723 A JP2011514723 A JP 2011514723A JP 2011514723 A JP2011514723 A JP 2011514723A JP 2011524948 A JP2011524948 A JP 2011524948A
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Japan
Prior art keywords
gas
mfc
gas species
overshoot
flow rate
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JP2011514723A
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English (en)
Japanese (ja)
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JP2011524948A5 (enExample
Inventor
ユン・グンス
シャリーフ・イクバル・エー.
イエルゲンセン・カート
チャラタン・ロバート
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Lam Research Corp
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Lam Research Corp
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Publication of JP2011524948A publication Critical patent/JP2011524948A/ja
Publication of JP2011524948A5 publication Critical patent/JP2011524948A5/ja
Pending legal-status Critical Current

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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00Control of flow
    • G05D7/06Control of flow characterised by the use of electric means
    • G05D7/0617Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • Y10T137/7758Pilot or servo controlled
    • Y10T137/7761Electrically actuated valve

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Accessories For Mixers (AREA)
JP2011514723A 2008-06-20 2009-06-12 処理チャンバ内へのガス供給のタイムスケールを制御するための方法 Pending JP2011524948A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7453908P 2008-06-20 2008-06-20
US61/074,539 2008-06-20
US12/477,196 2009-06-03
US12/477,196 US8340827B2 (en) 2008-06-20 2009-06-03 Methods for controlling time scale of gas delivery into a processing chamber
PCT/US2009/047279 WO2009155221A2 (en) 2008-06-20 2009-06-12 Methods for controlling time scale of gas delivery into a processing chamber

Publications (2)

Publication Number Publication Date
JP2011524948A true JP2011524948A (ja) 2011-09-08
JP2011524948A5 JP2011524948A5 (enExample) 2014-02-06

Family

ID=41432039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011514723A Pending JP2011524948A (ja) 2008-06-20 2009-06-12 処理チャンバ内へのガス供給のタイムスケールを制御するための方法

Country Status (6)

Country Link
US (1) US8340827B2 (enExample)
JP (1) JP2011524948A (enExample)
KR (1) KR20110019376A (enExample)
CN (1) CN102067280B (enExample)
TW (1) TWI477938B (enExample)
WO (1) WO2009155221A2 (enExample)

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JP5346628B2 (ja) 2009-03-11 2013-11-20 株式会社堀場エステック マスフローコントローラの検定システム、検定方法、検定用プログラム
US8770215B1 (en) * 2011-07-20 2014-07-08 Daniel T. Mudd Low flow injector to deliver a low flow of gas to a remote location
US9958302B2 (en) 2011-08-20 2018-05-01 Reno Technologies, Inc. Flow control system, method, and apparatus
US9690301B2 (en) 2012-09-10 2017-06-27 Reno Technologies, Inc. Pressure based mass flow controller
US9188989B1 (en) 2011-08-20 2015-11-17 Daniel T. Mudd Flow node to deliver process gas using a remote pressure measurement device
DE102013109210A1 (de) * 2013-08-20 2015-02-26 Aixtron Se Evakuierbare Kammer, insbesondere mit einem Spülgas spülbare Beladeschleuse
US9580360B2 (en) 2014-04-07 2017-02-28 Lam Research Corporation Monolithic ceramic component of gas delivery system and method of making and use thereof
TWI693638B (zh) 2014-04-07 2020-05-11 美商蘭姆研究公司 獨立於配置的氣體輸送系統
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
US9879795B2 (en) 2016-01-15 2018-01-30 Lam Research Corporation Additively manufactured gas distribution manifold
US10453721B2 (en) * 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
US10679880B2 (en) 2016-09-27 2020-06-09 Ichor Systems, Inc. Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same
US10838437B2 (en) 2018-02-22 2020-11-17 Ichor Systems, Inc. Apparatus for splitting flow of process gas and method of operating same
US11144075B2 (en) 2016-06-30 2021-10-12 Ichor Systems, Inc. Flow control system, method, and apparatus
US10303189B2 (en) 2016-06-30 2019-05-28 Reno Technologies, Inc. Flow control system, method, and apparatus
JP6762218B2 (ja) * 2016-12-13 2020-09-30 株式会社堀場エステック 流量算出システム及び流量算出方法
US10663337B2 (en) 2016-12-30 2020-05-26 Ichor Systems, Inc. Apparatus for controlling flow and method of calibrating same
US10866135B2 (en) * 2018-03-26 2020-12-15 Applied Materials, Inc. Methods, systems, and apparatus for mass flow verification based on rate of pressure decay
US10760944B2 (en) * 2018-08-07 2020-09-01 Lam Research Corporation Hybrid flow metrology for improved chamber matching
US11841715B2 (en) 2020-10-22 2023-12-12 Applied Materials, Inc. Piezo position control flow ratio control
JP7583186B2 (ja) 2021-03-03 2024-11-13 アイコール・システムズ・インク マニホールドアセンブリを備える流体流れ制御システム

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JP2007208194A (ja) * 2006-02-06 2007-08-16 Tokyo Electron Ltd ガス供給装置,基板処理装置,ガス供給方法

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US6363958B1 (en) * 1999-05-10 2002-04-02 Parker-Hannifin Corporation Flow control of process gas in semiconductor manufacturing
US6632322B1 (en) * 2000-06-30 2003-10-14 Lam Research Corporation Switched uniformity control
US7354555B2 (en) * 2002-05-08 2008-04-08 Taiwan Semiconductor Manufacturing Co., Ltd. Gas flow control system with interlock
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Also Published As

Publication number Publication date
US8340827B2 (en) 2012-12-25
TW201017357A (en) 2010-05-01
TWI477938B (zh) 2015-03-21
WO2009155221A2 (en) 2009-12-23
US20090319071A1 (en) 2009-12-24
CN102067280A (zh) 2011-05-18
CN102067280B (zh) 2013-04-03
KR20110019376A (ko) 2011-02-25
WO2009155221A3 (en) 2010-03-25

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