TWI477938B - 處方的質量流量控制器控制方案的確定方法和建立方法、及其最佳過衝強度之測定方法 - Google Patents
處方的質量流量控制器控制方案的確定方法和建立方法、及其最佳過衝強度之測定方法 Download PDFInfo
- Publication number
- TWI477938B TWI477938B TW098120734A TW98120734A TWI477938B TW I477938 B TWI477938 B TW I477938B TW 098120734 A TW098120734 A TW 098120734A TW 98120734 A TW98120734 A TW 98120734A TW I477938 B TWI477938 B TW I477938B
- Authority
- TW
- Taiwan
- Prior art keywords
- mfc
- gas
- overshoot
- gas species
- flow rate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 102
- 239000007789 gas Substances 0.000 claims description 344
- 238000012545 processing Methods 0.000 claims description 68
- 239000012159 carrier gas Substances 0.000 claims description 40
- 230000003111 delayed effect Effects 0.000 claims description 39
- 230000035484 reaction time Effects 0.000 claims description 15
- 230000008569 process Effects 0.000 description 44
- 239000000203 mixture Substances 0.000 description 28
- 239000000758 substrate Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000036961 partial effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000002860 competitive effect Effects 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012421 spiking Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7761—Electrically actuated valve
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Accessories For Mixers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7453908P | 2008-06-20 | 2008-06-20 | |
| US12/477,196 US8340827B2 (en) | 2008-06-20 | 2009-06-03 | Methods for controlling time scale of gas delivery into a processing chamber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201017357A TW201017357A (en) | 2010-05-01 |
| TWI477938B true TWI477938B (zh) | 2015-03-21 |
Family
ID=41432039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098120734A TWI477938B (zh) | 2008-06-20 | 2009-06-19 | 處方的質量流量控制器控制方案的確定方法和建立方法、及其最佳過衝強度之測定方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8340827B2 (enExample) |
| JP (1) | JP2011524948A (enExample) |
| KR (1) | KR20110019376A (enExample) |
| CN (1) | CN102067280B (enExample) |
| TW (1) | TWI477938B (enExample) |
| WO (1) | WO2009155221A2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5346628B2 (ja) | 2009-03-11 | 2013-11-20 | 株式会社堀場エステック | マスフローコントローラの検定システム、検定方法、検定用プログラム |
| US8770215B1 (en) * | 2011-07-20 | 2014-07-08 | Daniel T. Mudd | Low flow injector to deliver a low flow of gas to a remote location |
| US9958302B2 (en) | 2011-08-20 | 2018-05-01 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
| US9690301B2 (en) | 2012-09-10 | 2017-06-27 | Reno Technologies, Inc. | Pressure based mass flow controller |
| US9188989B1 (en) | 2011-08-20 | 2015-11-17 | Daniel T. Mudd | Flow node to deliver process gas using a remote pressure measurement device |
| DE102013109210A1 (de) * | 2013-08-20 | 2015-02-26 | Aixtron Se | Evakuierbare Kammer, insbesondere mit einem Spülgas spülbare Beladeschleuse |
| US9580360B2 (en) | 2014-04-07 | 2017-02-28 | Lam Research Corporation | Monolithic ceramic component of gas delivery system and method of making and use thereof |
| TWI693638B (zh) | 2014-04-07 | 2020-05-11 | 美商蘭姆研究公司 | 獨立於配置的氣體輸送系統 |
| US10557197B2 (en) | 2014-10-17 | 2020-02-11 | Lam Research Corporation | Monolithic gas distribution manifold and various construction techniques and use cases therefor |
| US10022689B2 (en) | 2015-07-24 | 2018-07-17 | Lam Research Corporation | Fluid mixing hub for semiconductor processing tool |
| US10118263B2 (en) | 2015-09-02 | 2018-11-06 | Lam Researech Corporation | Monolithic manifold mask and substrate concepts |
| US10215317B2 (en) | 2016-01-15 | 2019-02-26 | Lam Research Corporation | Additively manufactured gas distribution manifold |
| US9879795B2 (en) | 2016-01-15 | 2018-01-30 | Lam Research Corporation | Additively manufactured gas distribution manifold |
| US10453721B2 (en) * | 2016-03-15 | 2019-10-22 | Applied Materials, Inc. | Methods and assemblies for gas flow ratio control |
| US10679880B2 (en) | 2016-09-27 | 2020-06-09 | Ichor Systems, Inc. | Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same |
| US10838437B2 (en) | 2018-02-22 | 2020-11-17 | Ichor Systems, Inc. | Apparatus for splitting flow of process gas and method of operating same |
| US11144075B2 (en) | 2016-06-30 | 2021-10-12 | Ichor Systems, Inc. | Flow control system, method, and apparatus |
| US10303189B2 (en) | 2016-06-30 | 2019-05-28 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
| JP6762218B2 (ja) * | 2016-12-13 | 2020-09-30 | 株式会社堀場エステック | 流量算出システム及び流量算出方法 |
| US10663337B2 (en) | 2016-12-30 | 2020-05-26 | Ichor Systems, Inc. | Apparatus for controlling flow and method of calibrating same |
| US10866135B2 (en) * | 2018-03-26 | 2020-12-15 | Applied Materials, Inc. | Methods, systems, and apparatus for mass flow verification based on rate of pressure decay |
| US10760944B2 (en) * | 2018-08-07 | 2020-09-01 | Lam Research Corporation | Hybrid flow metrology for improved chamber matching |
| US11841715B2 (en) | 2020-10-22 | 2023-12-12 | Applied Materials, Inc. | Piezo position control flow ratio control |
| JP7583186B2 (ja) | 2021-03-03 | 2024-11-13 | アイコール・システムズ・インク | マニホールドアセンブリを備える流体流れ制御システム |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010029888A1 (en) * | 1999-03-03 | 2001-10-18 | Arvind Sundarrajan | Method for improved chamber bake-out and cool-down |
| US20020092564A1 (en) * | 1999-05-10 | 2002-07-18 | Ollivier Louis A. | Flow control of process gas in semiconductor manufacturing |
| US20040031564A1 (en) * | 2000-06-30 | 2004-02-19 | Lam Research Corporation | Switched uniformity control |
| US20060130649A1 (en) * | 2004-12-22 | 2006-06-22 | Ravi Jain | Treatment of effluent gases |
| US20070181255A1 (en) * | 2006-02-06 | 2007-08-09 | Tokyo Electron Limited | Gas supply system, substrate processing apparatus and gas supply method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100427563B1 (ko) * | 1999-04-16 | 2004-04-27 | 가부시키가이샤 후지킨 | 병렬분류형 유체공급장치와, 이것에 사용하는 유체가변형압력식 유량제어방법 및 유체가변형 압력식 유량제어장치 |
| US7354555B2 (en) * | 2002-05-08 | 2008-04-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gas flow control system with interlock |
| EP1753494B1 (en) * | 2004-04-23 | 2017-08-23 | Stephan Dr. Böhm | Apparatus for changing the concentration of a target gas at the blood compartment of a patient's lung during artificial ventilation |
| US7216019B2 (en) * | 2004-07-08 | 2007-05-08 | Celerity, Inc. | Method and system for a mass flow controller with reduced pressure sensitivity |
| US7412986B2 (en) * | 2004-07-09 | 2008-08-19 | Celerity, Inc. | Method and system for flow measurement and validation of a mass flow controller |
| US20080200002A1 (en) * | 2004-10-19 | 2008-08-21 | Tokyo Electron Limited | Plasma Sputtering Film Deposition Method and Equipment |
| US7756599B2 (en) * | 2004-10-28 | 2010-07-13 | Tokyo Electron Limited | Substrate processing apparatus, program for performing operation and control method thereof, and computer readable storage medium storing the program |
| US7854821B2 (en) * | 2005-06-02 | 2010-12-21 | Tokyo Electron Limited | Substrate processing apparatus |
| US20070021935A1 (en) * | 2005-07-12 | 2007-01-25 | Larson Dean J | Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber |
| JP4911982B2 (ja) * | 2006-02-06 | 2012-04-04 | 東京エレクトロン株式会社 | ガス供給装置，基板処理装置，ガス供給方法及びガス供給制御方法 |
| US8304328B2 (en) * | 2006-03-20 | 2012-11-06 | Hitachi Kokusai Electric Inc. | Manufacturing method of semiconductor device and substrate processing apparatus |
| US20080153311A1 (en) * | 2006-06-28 | 2008-06-26 | Deenesh Padhi | Method for depositing an amorphous carbon film with improved density and step coverage |
| JP5028193B2 (ja) * | 2007-09-05 | 2012-09-19 | 株式会社日立ハイテクノロジーズ | 半導体製造装置における被処理体の搬送方法 |
| US20090084987A1 (en) * | 2007-09-28 | 2009-04-02 | Varian Semiconductor Equipment Associates, Inc. | Charge neutralization in a plasma processing apparatus |
-
2009
- 2009-06-03 US US12/477,196 patent/US8340827B2/en active Active
- 2009-06-12 JP JP2011514723A patent/JP2011524948A/ja active Pending
- 2009-06-12 CN CN2009801243953A patent/CN102067280B/zh active Active
- 2009-06-12 KR KR1020107028548A patent/KR20110019376A/ko not_active Ceased
- 2009-06-12 WO PCT/US2009/047279 patent/WO2009155221A2/en not_active Ceased
- 2009-06-19 TW TW098120734A patent/TWI477938B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010029888A1 (en) * | 1999-03-03 | 2001-10-18 | Arvind Sundarrajan | Method for improved chamber bake-out and cool-down |
| US20020092564A1 (en) * | 1999-05-10 | 2002-07-18 | Ollivier Louis A. | Flow control of process gas in semiconductor manufacturing |
| US20040031564A1 (en) * | 2000-06-30 | 2004-02-19 | Lam Research Corporation | Switched uniformity control |
| US20060130649A1 (en) * | 2004-12-22 | 2006-06-22 | Ravi Jain | Treatment of effluent gases |
| US20070181255A1 (en) * | 2006-02-06 | 2007-08-09 | Tokyo Electron Limited | Gas supply system, substrate processing apparatus and gas supply method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011524948A (ja) | 2011-09-08 |
| US8340827B2 (en) | 2012-12-25 |
| TW201017357A (en) | 2010-05-01 |
| WO2009155221A2 (en) | 2009-12-23 |
| US20090319071A1 (en) | 2009-12-24 |
| CN102067280A (zh) | 2011-05-18 |
| CN102067280B (zh) | 2013-04-03 |
| KR20110019376A (ko) | 2011-02-25 |
| WO2009155221A3 (en) | 2010-03-25 |
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